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Infineon Technologies S70GL02GS11FHV023
- Part No.:
- S70GL02GS11FHV023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S70GL02GS11FHV023.pdf
- Description:
- IC FLASH 2GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,501
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Product details
Overview
S70GL02GS11FHV023 from Infineon is a 2 Gbit (256 MB) parallel NOR flash memory IC using 65-nm MIRRORBIT™ technology, configured as dual-die stack of two S29GL01GS devices in a single 64-ball Fortified-BGA package. It delivers 110 ns random access time, 25 ns page access time, and supports 512-byte buffer programming for embedded boot code storage in industrial controllers, automotive ECUs, and network equipment.
For engineers reviewing the S70GL02GS11FHV023 datasheet, S70GL02GS11FHV023 pinout, S70GL02GS11FHV023 application, or S70GL02GS11FHV023 equivalent, key selection criteria include uniform 128-KB sector erase capability, Versatile I/O™ support (1.65 V to VCC), AEC-Q100 Grade 2/3 qualification, CFI compliance, and hardware write protection via WP#.
Technical Context
This device implements a dual-die parallel architecture with independent address mapping across two 1-Gb S29GL01GS dies, accessed via shared A0–A25 and DQ0–DQ15 bus lines plus A26 for die selection. Sector erase and program operations are executed per-die with suspend/resume capability and status reporting via RY/BY#, Status Register, and data polling.
It operates from a single 2.7–3.6 V supply (VCC) with separate VIO rail (1.65–VCC) enabling interface voltage flexibility. The 64-ball LSH Fortified-BGA package integrates thermal and mechanical robustness for automotive and industrial environments, supporting –40°C to +105°C operation under AEC-Q100 Grade 2.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gbit (256 MB), dual-die stack of two 1-Gb S29GL01GS dies |
| Interface Type | Parallel ×16 data bus with CE#, OE#, WE#, RESET#, WP#, RY/BY# control signals |
| Access Time | 110 ns random access (tACC), 25 ns page access (tPACC) at VIO = VCC = 3.0 V |
| Erase Architecture | Uniform 128-KB sectors; 2048 total sectors; 100,000 erase cycles per sector typical |
| Programming Buffer | 512-byte buffer enables single-operation programming up to full page size |
| Data Retention | 20 years typical at +85°C; supported by non-volatile sector protection and OTP array |
| Operating Temp | AEC-Q100 Grade 2 (–40°C to +105°C) and Grade 3 (–40°C to +85°C) qualified |
Pinout & Package
Package: 64-ball LSH Fortified-BGA, 13 mm × 11 mm, with thermal and mechanical reinforcement for high-reliability applications. Ball pitch: 0.8 mm. RoHS-compliant, lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address Input | 26-bit address bus for 64-MB addressing space per die; A26 selects upper/lower die |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word read/write and CFI queries |
| CE#, OE#, WE# | Control Inputs | Chip Enable, Output Enable, Write Enable - active-low asynchronous control for read/program/erase |
| RY/BY# | Status Output | Open-drain ready/busy indicator: low during embedded algorithm execution, high-Z when idle |
| WP# | Protection Input | Write Protect/Acceleration: low disables outermost sector programming/erasing; high enables unlock-bypass mode |
| VCC / VIO / VSS | Power Supplies | VCC (2.7–3.6 V) powers core logic; VIO (1.65–VCC) sets I/O voltage; VSS is ground reference |
| RESET# | Hardware Reset | Active-low signal that forces device into reading state and clears internal status registers |
| NC / RFU / DNU | No-Connect | A1, A8, C1, D1, H1, H8 = NC; F7/G1 = RFU; E1 = DNU - not for host system connection or PCB routing |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O™ Interface | Independent VIO rail (1.65 V to VCC) allows seamless integration with mixed-voltage SoCs and FPGAs |
| Dual-Die Stack Architecture | Two 1-Gb S29GL01GS dies in one package double density without increasing footprint or bus complexity |
| Advanced Sector Protection (ASP) | Volatile and non-volatile lock bits per sector enable flexible firmware update partitioning and secure boot regions |
| 1024-byte OTP Array | Two lockable regions store immutable calibration data, security keys, or device-specific configuration |
| CFI Compliance | Standard Common Flash Interface enables automatic detection, parameter readout, and vendor-agnostic driver support |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated engine maps, diagnostic routines, and bootloader code in Tier-1 automotive modules. IC Role / Device Role / Timing Role: Primary non-volatile code storage with AEC-Q100 Grade 2 qualification and 100K erase cycle endurance. Use Value: Enables field-upgradable firmware while maintaining data integrity over 15+ year vehicle lifetimes at +105°C ambient. | Use Scenario: Holding ladder logic programs, I/O configuration tables, and safety-critical firmware in programmable logic controllers. IC Role / Device Role / Timing Role: Parallel NOR flash providing deterministic 110 ns read latency for real-time scan-cycle execution. Use Value: Supports fast boot and hot-swappable firmware updates without external buffering or translation layers. |
| Telecom Base Station Boot Memory | Medical Imaging System Configuration |
Use Scenario: Hosting boot images and FPGA configuration bitstreams in 5G radio units requiring rapid cold-start recovery. IC Role / Device Role / Timing Role: High-density parallel flash with CFI support for BIOS-level initialization and secure image validation. Use Value: Delivers 1.5 MBps buffer programming speed and hardware write protection to prevent accidental corruption during OTA updates. | Use Scenario: Storing DICOM metadata templates, calibration profiles, and regulatory compliance flags in FDA-cleared imaging devices. IC Role / Device Role / Timing Role: Secure, long-retention storage with OTP array for immutable medical device identifiers and audit logs. Use Value: Meets IEC 62304 software lifecycle requirements via non-volatile sector locking and 20-year data retention at +85°C. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS11FHIV10 | Single-die 1 Gbit version; identical 64-ball BGA package and pinout; lacks A26 die-select line usage | Lower density suitable for cost-sensitive designs where 256 MB exceeds firmware footprint | Select when application requires only 128 MB and benefits from simpler address decoding |
| MX29GL256FHT2I-90G | 2 Gbit Macronix part; 90 ns tACC; no AEC-Q100 qualification; different CFI ID and OTP structure | Commercial-grade alternative for non-automotive industrial use; lacks Grade 2 temperature rating | Choose for price-sensitive non-automotive systems where extended temperature range is not required |
Compared with S29GL01GS11FHIV10, this dual-die variant doubles density without changing footprint or interface timing; versus MX29GL256FHT2I-90G, it provides automotive qualification and tighter 110 ns access but requires Infineon-specific CFI handling and OTP management.
Availability
S70GL02GS11FHV023 is available at Aetrix Electronics and suitable for automotive ECU firmware storage, industrial PLC boot memory, and telecom base station configuration requiring stable component supply across extended product lifecycles.
Supply support for S70GL02GS11FHV023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions.
This device belongs to the GL-S family of MIRRORBIT™ parallel NOR flash products, designed specifically for mission-critical embedded applications demanding AEC-Q100 qualification, long-term data retention, and deterministic read performance.
FAQ
What is the function of the A26 pin on S70GL02GS11FHV023?
A26 serves as the die-select address line: low selects the lower 1-Gb die (address range 0000000h–3FFFFFFh), high selects the upper 1-Gb die (4000000h–7FFFFFFh). It enables unified 2-Gb addressing across the dual-die stack while maintaining compatibility with existing S29GL01GS-based designs that use A26 as a don't-care bit.
Does S70GL02GS11FHV023 support common flash interface (CFI)?
Yes, it fully supports CFI per JEDEC JESD68-A specification. The device responds to CFI query commands at address 0x55, returning vendor ID, device geometry, command set, and sector protection information. This enables standardized driver initialization and auto-detection in U-Boot, Linux MTD, and bare-metal bootloaders.
How does the Versatile I/O™ feature benefit system design?
Versatile I/O™ decouples I/O voltage (VIO) from core supply (VCC), allowing VIO to operate from 1.65 V to VCC. This permits direct interfacing with 1.8 V or 2.5 V FPGAs and SoCs without level shifters, reducing BOM count and signal integrity risk while maintaining full 3.0 V core performance and reliability.
Can the OTP array be reprogrammed after initial programming?
No - the 1024-byte OTP array consists of one-time-programmable fuses. Once a region is locked (via dedicated lock bits), its contents cannot be altered. Each region supports independent locking; unsecured regions remain writable until locked, but no fuse can be reset or erased after programming.
S70GL02GS11FHV023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 2Gbit
- Memory Organization:
- 128M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S70GL02GS11FHV023 FAQ
1.How can I place an order for S70GL02GS11FHV023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70GL02GS11FHV023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70GL02GS11FHV023 reliable?
The price and inventory of S70GL02GS11FHV023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70GL02GS11FHV023 is usually 5 days.
3.What payment methods are accepted for S70GL02GS11FHV023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70GL02GS11FHV023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70GL02GS11FHV023?
S70GL02GS11FHV023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70GL02GS11FHV023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70GL02GS11FHV023?
For technical support, including S70GL02GS11FHV023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70GL02GS11FHV023 requirements.
6.How does Aetrix verify that S70GL02GS11FHV023 is sourced from the original manufacturer or authorized distributors?
All S70GL02GS11FHV023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70GL02GS11FHV023 meets industry standards.
7.What is the process for return or replacement of S70GL02GS11FHV023?
All S70GL02GS11FHV023 units undergo pre-shipment inspection (PSI). If there is an issue with S70GL02GS11FHV023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70GL02GS11FHV023 part is unused and in its original packaging.
Return procedure for S70GL02GS11FHV023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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