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Infineon Technologies S70GL02GS12FHBV20
- Part No.:
- S70GL02GS12FHBV20
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S70GL02GS12FHBV20.pdf
- Description:
- IC FLASH 2GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,335
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Product details
Overview
S70GL02GS12FHBV20 from Infineon is a 2 Gbit (256 MB) parallel NOR flash memory device fabricated on 65-nm MIRRORBIT™ technology, featuring 128-KB uniform sectors, 110 ns random access time, and 25 ns page access time. It operates from a single 2.7–3.6 V supply with Versatile I/O supporting 1.65–VCC VIO, and integrates dual S29GL01GS die in one package for embedded boot code and firmware storage in automotive and industrial controllers.
For engineers reviewing the S70GL02GS12FHBV20 datasheet, S70GL02GS12FHBV20 pinout, S70GL02GS12FHBV20 application, or S70GL02GS12FHBV20 equivalent, key selection criteria include sector erase reliability (100,000 cycles), OTP array support, AEC-Q100 Grade 2/3 qualification, and Fortified-BGA thermal handling requirements.
Technical Context
This device implements a dual-die stack architecture-two independent 1-Gb S29GL01GS dies sharing address/data bus and control signals-with dedicated AMAX+1 signal routing to distinguish between die accesses. Sector protection uses Advanced Sector Protection (ASP) with volatile and non-volatile lock modes per sector.
It supports three status monitoring methods: Ready/Busy# pin assertion, status register polling, and data polling. Programming employs a 512-byte buffer enabling up to 256-word writes per operation, while erase executes at 477 KBps per 128-KB sector.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 2 Gbit (256 MB), realized as dual 1-Gb die stack for higher capacity without increasing footprint |
| Access time | 110 ns random access, 25 ns page access - enables fast instruction fetch in boot ROM applications |
| Supply voltage | VCC = 2.7–3.6 V; VIO = 1.65–VCC - allows flexible I/O interfacing with mixed-voltage SoCs |
| Erase endurance | 100,000 cycles per sector - supports field firmware updates over product lifetime |
| Data retention | 20 years typical - ensures long-term reliability in unpowered storage scenarios |
| Operating temperature | –40°C to +105°C (AEC-Q100 Grade 2) - qualified for under-hood automotive ECUs |
| Package | 64-ball Fortified-BGA, 13 mm × 11 mm - provides mechanical robustness and thermal stability for high-reliability PCBs |
Pinout & Package
64-ball LSH Fortified-BGA (13 mm × 11 mm), RoHS-compliant, with reinforced solder joint structure and moisture sensitivity level (MSL) 3 per J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A26–A0 | Address inputs | 27-bit address bus supporting full 2-Gb addressing; A26 selects top/bottom die in dual-die configuration |
| DQ15–DQ0 | Bi-directional data bus | ×16 data interface for high-throughput read/write; compatible with standard parallel NOR controllers |
| CE#, OE#, WE# | Chip/Output/Write Enable controls | Standard asynchronous control timing; CE# gating enables low-power standby when inactive |
| RY/BY# | Ready/Busy output | Active-low open-drain signal indicating active program/erase; used for hardware flow control |
| WP# | Write Protect input | Hardware sector lock for first/last sectors; prevents accidental firmware overwrite during power transitions |
| RESET# | Hardware reset input | Asynchronous reset to reading state; required for recovery after power-on or error conditions |
| VCC, VIO, VSS | Power and ground | Separate VCC (core) and VIO (I/O) supplies enable voltage domain isolation and noise reduction |
| NC, RFU, DNU | No-connect/reserved | NC pins (A1, A8, C1, etc.) may be used for PCB routing; DNU (E1) must not connect to host signals |
Key Features
| Feature | Design Value |
|---|---|
| 512-byte programming buffer | Reduces effective programming time by batching up to 256 words, improving firmware update throughput |
| Advanced Sector Protection (ASP) | Enables independent volatile/non-volatile locking of each 128-KB sector to prevent unauthorized modification |
| 1024-byte OTP array | Two lockable regions store immutable calibration data or security keys, resistant to field reprogramming |
| Suspend/Resume commands | Allows interrupting erase or program operations to service high-priority reads, minimizing system latency |
| Common Flash Interface (CFI) | Provides standardized JEDEC-compliant identification and parameter query for automatic driver initialization |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot code and calibrated engine maps in diesel ECU modules operating under hood temperatures up to +105°C. IC Role / Device Role / Timing Role: Primary non-volatile firmware storage with AEC-Q100 Grade 2 qualification and 100K-cycle endurance. Use Value: Ensures deterministic boot timing via 25 ns page access and maintains data integrity over 20-year vehicle lifespan. | Use Scenario: Holding ladder logic firmware and configuration parameters in modular PLC backplanes exposed to factory vibration and EMI. IC Role / Device Role / Timing Role: Parallel NOR flash providing deterministic read latency and sector-level write protection for safety-critical updates. Use Value: ASP and WP# hardware locks prevent unintended firmware corruption during hot-swap I/O module insertion. |
| Avionics Display Boot ROM | Medical Imaging System Configuration |
Use Scenario: Hosting certified boot firmware for cockpit display units requiring DO-254 compliance and radiation-tolerant storage. IC Role / Device Role / Timing Role: High-reliability boot memory with 20-year data retention and dual-die redundancy management. Use Value: Dual-die architecture enables fault-aware mapping; CFI support simplifies DO-254 verification traceability. | Use Scenario: Storing calibration profiles and DICOM configuration tables in MRI/X-ray control systems with strict regulatory audit trails. IC Role / Device Role / Timing Role: Secure, tamper-resistant storage using OTP array for calibration constants and ASP for firmware partitioning. Use Value: Two-lock OTP regions ensure calibration data immutability; sector erase granularity enables safe field updates without full reflash. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS12FHIV20 | Single 1-Gb die, identical 65-nm process, same 128-KB sectors and CFI support | Lacks dual-die stacking; limited to 128 MB capacity; no AMAX+1 die-select capability | Select when lower density suffices and board layout avoids dual-die interconnect complexity |
| MX29GL256FHTI-90G | 2-Gb Spansion-compatible part, 90 ns random access, no OTP array, no AEC-Q100 Grade 2 rating | Supports only industrial temp range (–40°C to +85°C); lacks automotive qualification and hardware write acceleration | Choose for cost-sensitive industrial designs where AEC-Q100 and OTP are not required |
Compared with S29GL01GS12FHIV20, the S70GL02GS12FHBV20 delivers double density and die-select flexibility at identical process node; versus MX29GL256FHTI-90G, it adds automotive qualification, OTP security, and faster 25 ns page access-critical for safety-critical boot paths.
Availability
S70GL02GS12FHBV20 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware upgrades, and avionics boot ROM deployment requiring stable component supply across extended product lifecycles.
Supply support for S70GL02GS12FHBV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions for mission-critical systems.
The GL-S series targets automotive and industrial applications demanding AEC-Q100 qualification, long data retention, and robust sector protection-designed specifically for boot code, firmware, and configuration storage in harsh environments.
FAQ
What is the purpose of the AMAX+1 signal in S70GL02GS12FHBV20?
AMAX+1 is a dedicated address line used to select between the two stacked 1-Gb dies inside the S70GL02GS12FHBV20 package. When asserted, it routes commands to the upper die; when deasserted, it addresses the lower die. This enables seamless 2-Gb addressing without external multiplexing or additional control logic.
Does S70GL02GS12FHBV20 support hardware acceleration for programming?
Yes. When WP# is driven to VHH (high-voltage level), the device enters unlock bypass mode and accelerates programming speed. This feature reduces effective write time during firmware updates and is distinct from standard VIL/VIH logic levels-requiring a dedicated VHH generator circuit per Infineon's application notes.
How is the 1024-byte OTP array structured and accessed?
The OTP array consists of two independently lockable 512-byte regions. Each region can be permanently locked via dedicated command sequences issued through the CFI interface. Once locked, contents cannot be altered-even by power cycling-and are readable during normal operation for calibration or security key storage.
Can S70GL02GS12FHBV20 be used in systems requiring JEDEC-standard Common Flash Interface?
Yes. The device fully supports JEDEC JESD68 Common Flash Interface (CFI) with complete vendor-specific and device-specific query tables. This enables automatic driver detection, sector map parsing, and timing parameter retrieval in Linux MTD and U-Boot environments without hard-coded configuration.
S70GL02GS12FHBV20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 2Gbit
- Memory Organization:
- 128M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 120 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S70GL02GS12FHBV20 FAQ
1.How can I place an order for S70GL02GS12FHBV20 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70GL02GS12FHBV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70GL02GS12FHBV20 reliable?
The price and inventory of S70GL02GS12FHBV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70GL02GS12FHBV20 is usually 5 days.
3.What payment methods are accepted for S70GL02GS12FHBV20?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70GL02GS12FHBV20 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70GL02GS12FHBV20?
S70GL02GS12FHBV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70GL02GS12FHBV20 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70GL02GS12FHBV20?
For technical support, including S70GL02GS12FHBV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70GL02GS12FHBV20 requirements.
6.How does Aetrix verify that S70GL02GS12FHBV20 is sourced from the original manufacturer or authorized distributors?
All S70GL02GS12FHBV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70GL02GS12FHBV20 meets industry standards.
7.What is the process for return or replacement of S70GL02GS12FHBV20?
All S70GL02GS12FHBV20 units undergo pre-shipment inspection (PSI). If there is an issue with S70GL02GS12FHBV20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70GL02GS12FHBV20 part is unused and in its original packaging.
Return procedure for S70GL02GS12FHBV20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S70GL02GS12FHBV20 Tags
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