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Infineon Technologies S70GL02GS12FHBV23
- Part No.:
- S70GL02GS12FHBV23
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S70GL02GS12FHBV23.pdf
- Description:
- IC FLASH 2GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,319
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Product details
Overview
S70GL02GS12FHBV23 from Infineon is a 2 Gbit (256 MB) parallel NOR flash memory IC built on 65-nm MIRRORBIT™ technology, featuring 128-KB uniform sectors, 110 ns random access time, and 25 ns page access time. It operates from a single 2.7–3.6 V supply with Versatile I/O supporting 1.65–VCC VIO, and integrates a 512-byte programming buffer for accelerated write throughput in embedded boot and firmware storage applications.
For engineers reviewing the S70GL02GS12FHBV23 datasheet, S70GL02GS12FHBV23 pinout, S70GL02GS12FHBV23 application, or S70GL02GS12FHBV23 equivalent, key selection criteria include sector erase granularity (128 KB), industrial/automotive temperature support (–40°C to +105°C), dual-die stack architecture, CFI compliance, and Fortified-BGA package mechanical compatibility.
Technical Context
This device implements a dual-die stack of two S29GL01GS 1-Gb dies in a single 64-ball LSH Fortified-BGA package, enabling 2-Gb density while retaining pin-compatible layout with discrete 1-Gb variants. Addressing uses A0–A26 with A26 selecting between die banks, and DQ0–DQ15 providing ×16 data bus operation.
It supports three status monitoring methods-Ready/Busy# pin, status register polling, and data polling-and includes suspend/resume capability for both program and erase operations. Sector protection combines volatile (lock bits) and non-volatile (ASP) mechanisms, plus a dedicated 1024-byte OTP array with two lockable regions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory capacity | 2 Gbit (256 MB), realized as dual 1-Gb S29GL01GS die stack |
| Access time | 110 ns random access; enables fast instruction fetch in boot ROM applications |
| Page access time | 25 ns; reduces latency during sequential read from page buffer |
| Programming buffer | 512 bytes; allows single-command multi-word writes, improving firmware update speed |
| Sector size | 128 KB uniform sectors (2048 total); simplifies partitioning for bootloader + application + parameter storage |
| Endurance & retention | 100,000 erase cycles per sector; 20-year data retention at +85°C - suitable for long-life industrial deployments |
| Operating voltage | VCC = 2.7–3.6 V; VIO = 1.65–VCC - supports mixed-voltage host interfaces without level shifters |
Pinout & Package
Package: 64-ball LSH Fortified-BGA, 13 mm × 11 mm, RoHS-compliant, with thermal pad exposed on bottom side. Designed for high-reliability automotive and industrial PCB assembly; ultrasonic cleaning prohibited; max reflow peak temperature 150°C.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A26 | Address inputs | A26 selects top/bottom die; A0–A25 address within selected 1-Gb die |
| DQ0–DQ15 | Data I/O | ×16 bidirectional bus; supports byte/word reads and buffer programming |
| CE#, OE#, WE# | Control enables | Standard parallel NOR interface timing; CE# active-low chip select |
| RY/BY# | Status output | Open-drain ready/busy indicator; low during erase/program, high-Z when idle |
| WP# | Write protect | Hardware sector lock: VIL protects outermost sectors; VHH enables unlock-bypass mode |
| RESET# | Hardware reset | Active-low; forces device into reading state, clears internal state machines |
| VCC / VIO / VSS | Power supplies | VCC powers core logic; VIO sets I/O voltage domain; separate VSS pins reduce noise coupling |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die stacked architecture | Enables 2-Gb density in footprint identical to 1-Gb S29GL01GS, preserving board layout |
| Versatile I/O (VIO) | Supports 1.65–VCC I/O voltage range, eliminating external level shifters for 1.8 V/2.5 V/3.3 V hosts |
| 512-byte programming buffer | Reduces average programming time by >70% vs. byte-wise writes, critical for OTA firmware updates |
| Advanced sector protection (ASP) | Combines volatile lock bits and non-volatile ASP for flexible, field-updatable security policies |
| CFI-compliant interface | Enables automatic detection and configuration by standard flash drivers (e.g., U-Boot, Linux MTD) |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated display graphics, gauge logic, and safety-critical boot code in AEC-Q100 Grade 2 (–40°C to +105°C) environments. IC Role / Device Role / Timing Role: Primary boot ROM and firmware image store accessed via parallel bus during cold start and runtime updates. Use Value: 128-KB uniform sectors allow isolated update of instrument cluster UI without disturbing safety-critical boot loader; 20-year retention ensures calibration integrity over vehicle lifetime. | Use Scenario: Holding programmable logic controller firmware, configuration tables, and real-time OS kernel in factory automation systems. IC Role / Device Role / Timing Role: Nonvolatile storage for deterministic boot and field-upgradable application code, interfaced directly to ARM Cortex-M7 MCU parallel bus. Use Value: 110 ns random access meets hard real-time boot timing budgets; suspend/resume enables safe firmware patching during operational pauses. |
| Medical Imaging Boot Memory | Avionics Data Logger |
Use Scenario: Secure boot image and DICOM protocol stack storage in Class II medical devices requiring long-term reliability and audit-trail firmware integrity. IC Role / Device Role / Timing Role: Trusted boot source verified at power-on; OTP region stores cryptographic keys and device-specific calibration constants. Use Value: Dual-die redundancy and 100K-cycle endurance support frequent diagnostic firmware revisions; ASP prevents accidental overwrite of certified boot code. | Use Scenario: Recording flight-critical sensor metadata and system health logs in DO-160-compliant avionics modules operating across extended temperature ranges. IC Role / Device Role / Timing Role: High-reliability nonvolatile storage for cyclic logging buffers and post-event crash dump capture. Use Value: 25 ns page access accelerates log flushes during transient events; RY/BY# pin enables precise timing control of write operations under interrupt-driven logging. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS12FHBV23 | Single 1-Gb die; identical pinout, timing, and feature set except half capacity | Used where 128 MB suffices and cost-per-bit optimization is prioritized over density | Select when board space or BOM cost constraints favor lower-density variant without redesign |
| MX29GL256FHTI-90G | 2-Gb, 90 ns access time, 48-pin TSOP; no Versatile I/O or OTP array; different CFI ID | Targeted at legacy industrial controllers using TSOP packages and simpler protection schemes | Choose only if existing PCB uses TSOP footprint and host driver lacks CFI flexibility for VIO configuration |
Compared with S29GL01GS12FHBV23, the S70GL02GS12FHBV23 doubles density in same BGA footprint but adds die-select complexity; versus MX29GL256FHTI-90G, it offers superior I/O flexibility, OTP security, and automotive qualification at the cost of package type and driver compatibility requirements.
Availability
S70GL02GS12FHBV23 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging systems, and avionics data loggers requiring stable component supply across extended temperature and long-lifecycle programs.
Supply support for S70GL02GS12FHBV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions for mission-critical systems.
The GL-S series targets automotive and industrial applications demanding AEC-Q100 qualification, extended temperature operation, and robust firmware storage with hardware-based security features like OTP and ASP.
FAQ
What is the function of the A26 pin on S70GL02GS12FHBV23?
A26 serves as the die-select address line. When asserted high, it enables access to the upper 1-Gb die; when low, it selects the lower 1-Gb die. This allows the dual-die stack to appear as a contiguous 2-Gb address space (A0–A26) while maintaining full compatibility with S29GL01GS software drivers through bank switching.
Does S70GL02GS12FHBV23 support hardware write protection for individual sectors?
Yes - it implements Advanced Sector Protection (ASP) with both volatile (lock bits cleared on power cycle) and non-volatile (persistent until explicitly unlocked) modes. Each of the 2048 uniform 128-KB sectors can be independently protected, and WP# provides additional hardware-level protection for outermost sectors regardless of ASP state.
Can the 1024-byte OTP array be used for cryptographic key storage?
Yes - the OTP array consists of two separately lockable 512-byte regions. Once locked, contents cannot be altered or read back, making it suitable for storing immutable root keys, device identifiers, or calibration signatures. Locking is performed via dedicated CFI commands and requires VHH on WP# to enter unlock-bypass mode first.
Is the RY/BY# pin compatible with standard microcontroller GPIO interrupts?
Yes - RY/BY# is an open-drain output with internal pull-up capability. It drives low during active erase/program operations and floats high-Z when idle, allowing direct connection to an interrupt-capable GPIO pin configured with external or internal pull-up. This enables precise timing-aware firmware control without polling overhead.
S70GL02GS12FHBV23 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 2Gbit
- Memory Organization:
- 128M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 120 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S70GL02GS12FHBV23 FAQ
1.How can I place an order for S70GL02GS12FHBV23 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70GL02GS12FHBV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70GL02GS12FHBV23 reliable?
The price and inventory of S70GL02GS12FHBV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70GL02GS12FHBV23 is usually 5 days.
3.What payment methods are accepted for S70GL02GS12FHBV23?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70GL02GS12FHBV23 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70GL02GS12FHBV23?
S70GL02GS12FHBV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70GL02GS12FHBV23 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70GL02GS12FHBV23?
For technical support, including S70GL02GS12FHBV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70GL02GS12FHBV23 requirements.
6.How does Aetrix verify that S70GL02GS12FHBV23 is sourced from the original manufacturer or authorized distributors?
All S70GL02GS12FHBV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70GL02GS12FHBV23 meets industry standards.
7.What is the process for return or replacement of S70GL02GS12FHBV23?
All S70GL02GS12FHBV23 units undergo pre-shipment inspection (PSI). If there is an issue with S70GL02GS12FHBV23, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70GL02GS12FHBV23 part is unused and in its original packaging.
Return procedure for S70GL02GS12FHBV23:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S70GL02GS12FHBV23 Tags
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