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Infineon Technologies S70GL02GS12FHIV13
- Part No.:
- S70GL02GS12FHIV13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S70GL02GS12FHIV13.pdf
- Description:
- IC FLASH 2GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,232
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Product details
Overview
S70GL02GS12FHIV13 from Infineon is a 2 Gbit (256 MB) parallel NOR flash memory device fabricated on 65-nm MIRRORBIT™ process, featuring 110 ns random access time, 25 ns page access time, and 512-byte programming buffer. It integrates two S29GL01GS dies in a single 64-ball Fortified-BGA package and supports industrial (–40°C to +85°C) and automotive AEC-Q100 Grade 2 (–40°C to +105°C) operation for embedded boot code storage.
For engineers reviewing the S70GL02GS12FHIV13 datasheet, S70GL02GS12FHIV13 pinout, S70GL02GS12FHIV13 application, or S70GL02GS12FHIV13 equivalent, key selection criteria include uniform 128-KB sector erase architecture, Versatile I/O™ support (1.65 V to VCC), CFI compliance, ASP protection, and dual-die stacking for density scaling in space-constrained designs.
Technical Context
This device implements a dual-die stacked architecture where two independent 1-Gb S29GL01GS dies share common control signals (CE#, OE#, WE#, RESET#) and a unified 16-bit data bus (DQ0–DQ15), with address lines A0–A25 supporting 26-bit addressing and A26 selecting between die banks. Sector erase and program operations are executed per-die with independent status reporting via RY/BY# and Status Register.
The memory map comprises 2048 uniform 128-KB sectors (SA00–SA2047), each individually protected via Advanced Sector Protection (ASP) using volatile/non-volatile lock bits. The 1024-byte OTP array includes two lockable regions for secure configuration storage, and WP# enables hardware write protection of outermost sectors regardless of ASP state.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gbit (256 MB), realized as dual 1-Gb die stack enabling compact footprint without external interconnect |
| Access Time | 110 ns random access, 25 ns page access - meets real-time boot latency requirements in microcontroller-based systems |
| Programming Buffer | 512-byte buffer - reduces effective programming time by up to 256× vs. byte-wise writes in firmware update routines |
| Erase Architecture | 2048 uniform 128-KB sectors - simplifies partitioning for bootloader, OS, and application image storage |
| Operating Voltage | VCC = 2.7–3.6 V; VIO = 1.65 V to VCC - supports mixed-voltage host interfaces without level shifters |
| Data Retention | 20 years typical - ensures long-term reliability in automotive ECUs and industrial controllers |
| Endurance | 100,000 erase cycles per sector - sufficient for field firmware updates over product lifetime |
Pinout & Package
Package: 64-ball LSH Fortified-BGA, 13 mm × 11 mm, RoHS-compliant, with thermal pad exposed on bottom side for enhanced heat dissipation in high-duty-cycle applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address Input | 26-bit address bus for 64-MB addressing space per die; A26 selects active die bank |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus shared across both dies; supports x16 mode only |
| CE#, OE#, WE# | Control Inputs | Chip Enable, Output Enable, Write Enable - standard parallel NOR interface timing compatible with legacy controllers |
| RY/BY# | Status Output | Active-low Ready/Busy indicator - drives low during erase/program; high-Z when operation complete |
| WP# | Hardware Protect | Write Protect input - disables program/erase in outermost sectors when pulled low, independent of ASP settings |
| RESET# | Hardware Reset | Asynchronous reset input - forces device into read mode and clears internal state on falling edge |
| VCC, VIO, VSS | Power/Ground | Separate core (VCC) and I/O (VIO) supplies enable voltage translation; VSS provides dedicated ground return path |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Die Stacking | Two 1-Gb S29GL01GS dies in single BGA package - doubles density without increasing PCB area or signal count |
| Versatile I/O™ | VIO range 1.65 V to VCC - eliminates level shifters when interfacing with 1.8 V, 2.5 V, or 3.3 V host processors |
| Advanced Sector Protection | Volatile and non-volatile lock bits per 128-KB sector - enables secure firmware partitioning and field update safeguards |
| CFI Compliance | Common Flash Interface v1.3 - enables automatic detection and configuration by BIOS/bootloader without hard-coded parameters |
| OTP Array | 1024-byte one-time-programmable region with two lockable sections - stores immutable keys, calibration data, or serial numbers |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot loader, real-time OS kernel, and calibrated engine maps in AEC-Q100 Grade 2 qualified environment. IC Role / Device Role / Timing Role: Primary non-volatile code storage with deterministic 110 ns read access for fast startup and interrupt response. Use Value: 20-year data retention and 100K erase cycles ensure firmware integrity over 15+ year vehicle service life. | Use Scenario: Holds programmable logic controller firmware, configuration tables, and safety-critical runtime parameters. IC Role / Device Role / Timing Role: Parallel NOR interface provides direct CPU memory-mapped access without DMA overhead. Use Value: Uniform 128-KB sectors simplify firmware partitioning into boot, application, and parameter zones with independent protection. |
| Medical Imaging System Boot Memory | Avionics Display Controller Code Storage |
Use Scenario: Stores FPGA configuration bitstreams and diagnostic firmware in Class II medical devices requiring long-term reliability. IC Role / Device Role / Timing Role: High-density 256 MB capacity accommodates multiple firmware versions and calibration datasets. Use Value: Dual-die architecture delivers density without sacrificing parallel interface speed or adding complexity of NAND management. | Use Scenario: Hosts display controller firmware and graphics assets in DO-178C-certifiable avionics subsystems. IC Role / Device Role / Timing Role: CFI-compliant interface enables automated firmware validation during power-on self-test (POST). Use Value: OTP array secures cryptographic keys used for secure boot verification and firmware signature checking. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS11FHIV10 | Single-die 1 Gbit device in same 64-ball Fortified-BGA package; identical timing and feature set except density | Used where 128 MB suffices and cost-per-bit optimization is prioritized over future scalability | Select when board layout rework is prohibited and density headroom is unnecessary |
| MX29GL256FHT2I-90G | 2 Gbit Macronix device; 90 ns random access, no dual-die stacking, different CFI implementation and OTP structure | Requires CFI parser adaptation and lacks ASP granularity; suitable for non-automotive cost-sensitive designs | Choose only after verifying bootloader compatibility and performing full erase/program cycle validation |
Compared with S29GL01GS11FHIV10, the S70GL02GS12FHIV13 doubles density in identical footprint but increases standby current slightly; versus MX29GL256FHT2I-90G, it offers superior automotive qualification, tighter timing, and more robust sector protection-critical for safety-critical firmware storage.
Availability
S70GL02GS12FHIV13 is available at Aetrix Electronics and suitable for automotive ECU design, industrial PLC firmware storage, and medical imaging system boot memory requiring stable component supply across extended product lifecycles.
Supply support for S70GL02GS12FHIV13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q100 standards.
The GL-S series targets high-reliability embedded applications demanding deterministic timing, long data retention, and automotive-grade qualification - specifically engineered for boot code, firmware, and configuration storage in safety-critical systems.
FAQ
What is the function of the A26 pin on S70GL02GS12FHIV13?
A26 serves as the die select line in the dual-die stack architecture. When A26 = low, the lower 1-Gb die (address range 0x0000000–0x07FFFFFF) is active; when A26 = high, the upper 1-Gb die (0x08000000–0x0FFFFFFF) responds to read/write commands. This enables seamless 2-Gb addressing using standard 26-bit address buses without external multiplexing.
Does S70GL02GS12FHIV13 support burst read mode?
No, the S70GL02GS12FHIV13 does not support burst read mode. It operates exclusively in asynchronous parallel NOR mode with individual address setup and data hold timing. Burst capability is absent per the datasheet's timing diagrams and command set - all reads require full address assertion for each 16-bit word access.
How is the 1024-byte OTP array accessed and secured?
The OTP array resides at fixed address offset 0x00000000 within a dedicated 1024-byte region and is accessed using standard read/write commands with specific unlock sequences. Two independently lockable 512-byte sections allow permanent write-protection after programming; once locked, no further writes or erases are possible, ensuring immutability of stored keys or calibration data.
Can S70GL02GS12FHIV13 be used in place of a NAND flash for firmware storage?
Yes, but only where deterministic read latency, byte-level random access, and simple controller interface are required - not for high-throughput bulk storage. Unlike NAND, it requires no ECC engine or wear leveling, supports true in-place execution (XIP), and guarantees 100% bit reliability over 20 years, making it preferred for boot code and safety-critical firmware despite lower density efficiency than NAND.
S70GL02GS12FHIV13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 2Gbit
- Memory Organization:
- 128M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 120 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S70GL02GS12FHIV13 FAQ
1.How can I place an order for S70GL02GS12FHIV13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70GL02GS12FHIV13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70GL02GS12FHIV13 reliable?
The price and inventory of S70GL02GS12FHIV13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70GL02GS12FHIV13 is usually 5 days.
3.What payment methods are accepted for S70GL02GS12FHIV13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70GL02GS12FHIV13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70GL02GS12FHIV13?
S70GL02GS12FHIV13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70GL02GS12FHIV13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70GL02GS12FHIV13?
For technical support, including S70GL02GS12FHIV13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70GL02GS12FHIV13 requirements.
6.How does Aetrix verify that S70GL02GS12FHIV13 is sourced from the original manufacturer or authorized distributors?
All S70GL02GS12FHIV13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70GL02GS12FHIV13 meets industry standards.
7.What is the process for return or replacement of S70GL02GS12FHIV13?
All S70GL02GS12FHIV13 units undergo pre-shipment inspection (PSI). If there is an issue with S70GL02GS12FHIV13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70GL02GS12FHIV13 part is unused and in its original packaging.
Return procedure for S70GL02GS12FHIV13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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