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Infineon Technologies S70GL02GS12FHIV23
- Part No.:
- S70GL02GS12FHIV23
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S70GL02GS12FHIV23.pdf
- Description:
- IC FLASH 2GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,568
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Product details
Overview
S70GL02GS12FHIV23 from Infineon is a 2 Gbit (256 MB) parallel NOR flash memory device fabricated on 65-nm MIRRORBIT™ process, featuring 128-KB uniform sectors, 110 ns random access time, and 25 ns page access time. It operates from a single 2.7–3.6 V supply with Versatile I/O support (1.65 V to VCC), and integrates dual S29GL01GS die in one package for embedded boot code storage in automotive and industrial controllers.
For engineers reviewing the S70GL02GS12FHIV23 datasheet, S70GL02GS12FHIV23 pinout, S70GL02GS12FHIV23 application, or S70GL02GS12FHIV23 equivalent, key selection criteria include sector erase granularity (128 KB), 512-byte programming buffer throughput (1.5 MBps), AEC-Q100 Grade 2/3 qualification, and Fortified-BGA mechanical robustness for high-reliability PCB mounting.
Technical Context
This device implements a dual-die stacked architecture-two independent 1-Gb S29GL01GS dies sharing common control signals (CE#, OE#, WE#, RESET#) and a unified 16-bit DQ bus. Address lines A0–A25 serve both dies, while A26 selects between them, enabling seamless 2-Gb linear addressing without external multiplexing.
It supports three status monitoring methods-Ready/Busy# pin assertion, data polling, and Status Register read-and includes Advanced Sector Protection (ASP) with volatile/non-volatile lock bits per sector plus a dedicated 1024-byte OTP array with two lockable regions for secure configuration storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gbit (256 MB) total capacity across two stacked 1-Gb dies |
| Access Time | 110 ns random access; enables fast instruction fetch in real-time MCU boot sequences |
| Page Read Buffer | 16-word (32-byte) buffer; reduces sequential read latency in firmware execution |
| Programming Buffer | 512-byte buffer; allows single-command write of full page, improving effective write speed by ~8× vs byte-wise programming |
| Sector Erase | Uniform 128-KB sectors (2048 total); simplifies firmware update partitioning and wear leveling |
| Data Retention | 20 years typical at +85°C; meets long-life requirements for automotive ECUs and industrial PLCs |
| Erase Cycles | 100,000 cycles per sector; supports frequent field firmware updates over product lifetime |
Pinout & Package
Package: 64-ball LSH Fortified BGA, 13 mm × 11 mm, with enhanced mechanical reliability for automotive thermal cycling and board-level shock resistance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address Inputs | 26-bit address bus for 64-MB addressing per die; A26 selects upper/lower die |
| DQ0–DQ15 | Bidirectional Data Bus | 16-bit parallel interface compatible with legacy microcontroller memory buses |
| CE#, OE#, WE# | Chip/Output/Write Enable | Standard NOR flash control signals; support asynchronous read/write/erase timing |
| RY/BY# | Ready/Busy Output | Active-low open-drain signal indicating ongoing Embedded Algorithm execution |
| WP# | Write Protect Input | Hardware sector protection override; disables program/erase in outermost sectors when pulled low |
| RESET# | Hardware Reset Input | Asynchronous reset to reading state; required for power-on initialization and error recovery |
| VIO | Versatile I/O Supply | Independent 1.65–VCC voltage rail for interfacing with mixed-voltage host logic |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Die Stacked Architecture | Two S29GL01GS dies in single BGA footprint deliver 2-Gb density without increasing PCB area or routing complexity |
| Versatile I/O (VIO) | Independent 1.65–VCC I/O supply enables direct connection to 1.8 V, 2.5 V, or 3.3 V host processors without level shifters |
| Advanced Sector Protection (ASP) | Volatile and non-volatile lock bits per sector prevent accidental firmware corruption during field updates or debug sessions |
| Dedicated OTP Array | 1024-byte one-time-programmable region with two lockable sections stores immutable calibration data or security keys |
| Common Flash Interface (CFI) | Standardized JEDEC CFI query table enables automatic driver detection and configuration in bootloader software |
Applications
| Automotive Engine Control Unit (ECU) | Industrial Programmable Logic Controller (PLC) |
|---|---|
Use Scenario: Storing boot firmware and real-time control algorithms in engine management systems requiring AEC-Q100 Grade 2 operation (–40°C to +105°C). IC Role / Device Role / Timing Role: Primary non-volatile code storage with deterministic 110 ns read access for hard real-time instruction fetch. Use Value: 20-year data retention and 100K erase cycles ensure firmware integrity over full vehicle service life without refresh. | Use Scenario: Holding ladder logic programs and I/O configuration data in modular PLC backplanes exposed to wide ambient temperature swings. IC Role / Device Role / Timing Role: Parallel NOR flash providing direct XIP (eXecute-In-Place) capability for deterministic scan cycle execution. Use Value: Uniform 128-KB sectors simplify firmware partitioning and enable atomic update of functional modules without system downtime. |
| Medical Diagnostic Imaging System | Avionics Flight Management Computer |
Use Scenario: Storing FPGA configuration bitstreams and safety-critical boot images in CT/MRI subsystems requiring extended reliability validation. IC Role / Device Role / Timing Role: Secure, tamper-resistant storage with OTP region for cryptographic keys and calibration constants. Use Value: Dedicated 1024-byte OTP array with dual lock bits prevents unauthorized modification of regulatory-certified parameters. | Use Scenario: Hosting certified flight software and navigation databases in DO-254-compliant avionics hardware operating under extreme vibration and thermal stress. IC Role / Device Role / Timing Role: High-integrity parallel flash with Fortified-BGA package ensuring solder joint reliability during repeated thermal cycling. Use Value: LSH064 package's reinforced ball grid structure resists interconnect fatigue in high-G aerospace environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS12FHIV20 | Single 1-Gb die; identical timing, same package footprint but half capacity | Used where firmware size fits within 128 MB and cost-per-bit optimization is prioritized | Select when system memory map requires only 1-Gb address space and BOM simplification is critical |
| MX29GL256FHT2I-90G | 256-MB Macronix device; 90 ns max tACC, no AEC-Q100 qualification, different OTP layout | Targeted at commercial-grade industrial gateways where automotive qualification is not mandated | Choose for cost-sensitive non-automotive designs accepting reduced temperature range (–40°C to +85°C only) |
Compared with S29GL01GS12FHIV20, the S70GL02GS12FHIV23 doubles density without changing PCB layout; versus MX29GL256FHT2I-90G, it adds AEC-Q100 Grade 2 support, 20-year retention, and hardened OTP-critical for safety-certified systems.
Availability
S70GL02GS12FHIV23 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC manufacturing, and medical imaging system production requiring stable component supply across multi-year product lifecycles.
Supply support for S70GL02GS12FHIV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT applications.
The GL-S series targets high-reliability embedded systems needing deterministic parallel NOR flash performance, with emphasis on AEC-Q100 compliance, long-term data retention, and robust packaging for harsh environments.
FAQ
What is the purpose of the A26 address line on S70GL02GS12FHIV23?
A26 serves as the die select signal in the dual-die stack architecture. When A26 = 0, the lower 1-Gb die (S29GL01GS) is accessed; when A26 = 1, the upper 1-Gb die is selected. This enables contiguous 2-Gb addressing using standard 26-bit address bus hardware without external decoding logic.
Does S70GL02GS12FHIV23 support execute-in-place (XIP) operation?
Yes, it supports XIP directly from the 16-bit parallel bus. With 110 ns random access time and deterministic Ready/Busy# signaling, the device enables zero-wait-state instruction fetch for ARM Cortex-M or PowerPC-based controllers, eliminating need for SRAM caching of boot code.
How does the Versatile I/O (VIO) feature benefit system design?
VIO allows independent 1.65–VCC supply for the DQ and control pins, enabling direct interface with 1.8 V, 2.5 V, or 3.3 V host processors without external level shifters. This reduces BOM count, PCB area, and signal integrity risk in mixed-voltage embedded systems.
Can the OTP array be reprogrammed after initial programming?
No-the 1024-byte OTP array is physically one-time programmable. Once a bit is set to '0', it cannot be changed back to '1'. Two independently lockable regions allow staged provisioning: one for factory calibration data, the other for field-updatable security keys, each secured against further writes after locking.
S70GL02GS12FHIV23 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 2Gbit
- Memory Organization:
- 128M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 120 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S70GL02GS12FHIV23 FAQ
1.How can I place an order for S70GL02GS12FHIV23 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70GL02GS12FHIV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70GL02GS12FHIV23 reliable?
The price and inventory of S70GL02GS12FHIV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70GL02GS12FHIV23 is usually 5 days.
3.What payment methods are accepted for S70GL02GS12FHIV23?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70GL02GS12FHIV23 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70GL02GS12FHIV23?
S70GL02GS12FHIV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70GL02GS12FHIV23 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70GL02GS12FHIV23?
For technical support, including S70GL02GS12FHIV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70GL02GS12FHIV23 requirements.
6.How does Aetrix verify that S70GL02GS12FHIV23 is sourced from the original manufacturer or authorized distributors?
All S70GL02GS12FHIV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70GL02GS12FHIV23 meets industry standards.
7.What is the process for return or replacement of S70GL02GS12FHIV23?
All S70GL02GS12FHIV23 units undergo pre-shipment inspection (PSI). If there is an issue with S70GL02GS12FHIV23, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70GL02GS12FHIV23 part is unused and in its original packaging.
Return procedure for S70GL02GS12FHIV23:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S70GL02GS12FHIV23 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
Microchip Technology
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
Microchip Technology
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AT24C04C-SSHM-T
Microchip Technology
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24LC01BT-I/SN
Microchip Technology
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24AA02UIDT-I/OT
Microchip Technology
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AT24C08C-STUM-T
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