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Infineon Technologies S70GL02GT11FAI033
- Part No.:
- S70GL02GT11FAI033
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S70GL02GT11FAI033.pdf
- Description:
- IC FLASH 2GBIT CFI 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,125
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Product details
Overview
S70GL02GT11FAI033 from Infineon is a 2 Gb (256 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, configured as dual-die stack of two S29GL01GT dies in a single fortified-BGA package. It delivers 110 ns random access time, 20 ns page access time, and supports ×8/×16 data bus operation with 512-byte programming buffer - deployed in industrial-grade embedded controllers requiring nonvolatile program storage and firmware update capability.
For engineers reviewing the S70GL02GT11FAI033 datasheet, S70GL02GT11FAI033 pinout, S70GL02GT11FAI033 application, or S70GL02GT11FAI033 equivalent, key selection criteria include uniform 128-KB sector erase architecture, AEC-Q100 Grade 2/3 qualification, 100,000 program-erase cycles, and dual-voltage I/O (1.65 V to VCC) for mixed-signal host interfacing.
Technical Context
This device implements a parallel interface NOR flash architecture with dual 1-Gb die stacked in one package, sharing common control signals (CE#, OE#, WE#) and address/data buses. It uses MIRRORBIT™ charge-trap technology enabling high-density storage with single-supply 2.7–3.6 V operation and integrated status reporting via RY/BY# open-drain output and Status Register polling.
The memory map comprises 2048 uniform 128-KB sectors (0x0000000–0x7FFFFFF), each individually erasable. Sector protection includes volatile/non-volatile ASP and hardware WP# lock for the highest-address sector, plus a dedicated 1024-byte OTP array with two lockable regions compliant with Common Flash Interface (CFI).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gb (256 MB) - dual-die stack of two 1-Gb S29GL01GT dies |
| Access Time | 110 ns random / 20 ns page - enables fast instruction fetch in boot ROM applications |
| Data Bus Width | ×8 or ×16 configurable via BYTE# input - supports legacy 8-bit microcontrollers and modern 16-bit hosts |
| Programming Buffer | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| Sector Size & Count | 128 KB uniform sectors × 2048 - simplifies firmware partitioning and OTA update management |
| Endurance & Retention | 100,000 program-erase cycles / 20-year data retention - validated for long-life industrial deployments |
| Operating Temperature | –40°C to +105°C (Industrial Plus / AEC-Q100 Grade 2) - suitable for under-hood automotive ECUs |
Pinout & Package
Package: 64-ball LSH fortified BGA, 13 mm × 11 mm, RoHS-compliant, with special handling requirements (no ultrasonic cleaning; max 150°C exposure).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ0–DQ15 | Data I/O (×16) or DQ0–DQ7 + A1 (×8) | Bi-directional data path; A1 repurposed as LSB address in byte mode |
| A0–A26 | Address inputs | 27-bit addressing supports full 2-Gb linear map (0x0000000–0x7FFFFFF) |
| CE#, OE#, WE# | Chip/Output/Write Enable controls | Standard parallel flash control logic; CE# active-low chip select |
| RY/BY# | Open-drain Ready/Busy output | Signals algorithm progress; requires external pull-up; supports multi-device ready detection |
| WP# | Hardware write protect | Locks highest 128-KB sector regardless of ASP settings; internal pull-up |
| BYTE# | Data bus width selector | VIL = ×8 mode (DQ7–DQ0 active); VIH = ×16 mode (DQ15–DQ0 active) |
| RESET# | Hardware reset input | Resets internal state machine to standby; asynchronous, active-low |
| VCC / VIO / VSS | Power supplies | VCC = 2.7–3.6 V core; VIO = 1.65–VCC I/O voltage; separate VSS pins for core/I/O grounds |
Key Features
| Feature | Design Value |
|---|---|
| 45-nm MIRRORBIT™ process | Enables 2-Gb density in compact BGA without stacked die interposer complexity |
| 512-byte programming buffer | Reduces average programming time by >70% vs. byte-by-byte writes in firmware update sequences |
| Uniform 128-KB sectors | Eliminates need for variable-sector management logic in bootloader implementations |
| Common Flash Interface (CFI) | Allows runtime identification and configuration by host OS or bootloader without hard-coded parameters |
| Dual-temp grade support | Single BOM covers both Industrial Plus (–40°C to +105°C) and AEC-Q100 Grade 2 automotive use |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated engine maps and real-time control code in diesel ECU with AEC-Q100 compliance requirement. IC Role / Device Role / Timing Role: Nonvolatile boot ROM and field-upgradable firmware store accessed via parallel bus during cold start and OTA updates. Use Value: 100,000-cycle endurance and 20-year retention ensure reliability over vehicle lifetime; WP# hardware lock prevents accidental corruption of critical calibration sector. | Use Scenario: Holding ladder logic firmware and configuration data in modular industrial programmable logic controller with extended temperature operation. IC Role / Device Role / Timing Role: Primary firmware image storage with CFI-enabled auto-detection and sector-protected parameter tables. Use Value: Uniform 128-KB sectors simplify firmware versioning and rollback; 110 ns access supports deterministic scan cycle timing in real-time control loops. |
| Medical Imaging System Boot Memory | Telecom Base Station Configuration Store |
Use Scenario: Secure boot image storage for FPGA-based MRI subsystem requiring data integrity and tamper resistance. IC Role / Device Role / Timing Role: Trusted boot ROM with OTP region storing cryptographic keys and secure boot hash values. Use Value: Dedicated 1024-byte OTP array with dual lockable regions enables hardware-enforced key separation; ASP supports field-locking of diagnostic partitions. | Use Scenario: Storing radio configuration profiles and protocol stacks in LTE/5G macro base station equipment operating in outdoor cabinets. IC Role / Device Role / Timing Role: High-reliability configuration store accessed during power-up and software-defined radio reconfiguration. Use Value: –40°C to +105°C rating ensures operation in uncooled enclosures; RY/BY# open-drain output enables synchronized readiness across multiple flash devices in distributed control plane. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT11FAI020 | Single-die 1-Gb version in same 64-ball BGA; identical timing and feature set except density | Used where firmware size < 128 MB and board space allows dual-package layout | Select when lower density suffices and supply chain prefers single-die sourcing |
| MX29GL256FHI-90G | 2-Gb Macronix parallel NOR; 90 ns random access (vs. 110 ns); no AEC-Q100 qualification | Targeted at commercial-grade telecom infrastructure, not automotive or harsh industrial environments | Choose for cost-sensitive non-automotive designs needing faster access but no automotive qualification |
Compared with S29GL01GT11FAI020, the S70GL02GT11FAI033 doubles capacity in same footprint; versus MX29GL256FHI-90G, it trades 20 ns slower access for guaranteed AEC-Q100 Grade 2 compliance and Infineon's long-term industrial support roadmap.
Availability
S70GL02GT11FAI033 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware storage, medical imaging boot systems, and telecom base station configuration requiring stable component supply across extended product lifecycles.
Supply support for S70GL02GT11FAI033 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and nonvolatile memory solutions with global manufacturing and quality certification.
The GL-T series targets high-reliability embedded applications demanding AEC-Q100 qualification, long data retention, and robust sector protection - designed specifically for automotive, industrial, and medical systems requiring certified flash memory.
FAQ
What is the function of the BYTE# pin on S70GL02GT11FAI033?
The BYTE# pin selects data bus width: when driven low, the device operates in ×8 mode with DQ7–DQ0 active and DQ15/A1 repurposed as LSB address; when high, it operates in ×16 mode with full DQ15–DQ0 data path. This enables backward compatibility with legacy 8-bit controllers while supporting modern 16-bit host interfaces without redesigning PCB layout.
Does S70GL02GT11FAI033 support hardware write protection for sectors other than the highest-address sector?
Yes - advanced sector protection (ASP) provides both volatile and non-volatile locking for all 2048 uniform 128-KB sectors. WP# only protects the highest-address sector unconditionally; ASP allows selective, persistent protection of any sector via Status Register bits or CFI commands, enabling flexible firmware partitioning with read-only boot loaders and writable application zones.
How does the RY/BY# signal behave during erase or program operations?
RY/BY# is an open-drain output pulled low (VIL) when an embedded algorithm (program or erase) is actively executing; it transitions to high-impedance (High-Z) when complete, requiring an external pull-up resistor to detect readiness. Multiple devices can wire-OR their RY/BY# outputs to monitor collective completion - essential for synchronized firmware updates across multi-flash systems.
Is the 1024-byte OTP array on S70GL02GT11FAI033 field-programmable and permanently lockable?
Yes - the OTP array consists of two independently lockable 512-byte regions. Each region can be programmed once in-system via standard command sequences, then permanently locked using dedicated CFI commands or Status Register bits. Once locked, contents are immutable and resistant to accidental overwrite, making it suitable for storing cryptographic keys, calibration constants, or secure boot hashes.
S70GL02GT11FAI033 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- CFI
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S70GL02GT11FAI033 FAQ
1.How can I place an order for S70GL02GT11FAI033 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70GL02GT11FAI033 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70GL02GT11FAI033 reliable?
The price and inventory of S70GL02GT11FAI033 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70GL02GT11FAI033 is usually 5 days.
3.What payment methods are accepted for S70GL02GT11FAI033?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70GL02GT11FAI033 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70GL02GT11FAI033?
S70GL02GT11FAI033 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70GL02GT11FAI033 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70GL02GT11FAI033?
For technical support, including S70GL02GT11FAI033 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70GL02GT11FAI033 requirements.
6.How does Aetrix verify that S70GL02GT11FAI033 is sourced from the original manufacturer or authorized distributors?
All S70GL02GT11FAI033 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70GL02GT11FAI033 meets industry standards.
7.What is the process for return or replacement of S70GL02GT11FAI033?
All S70GL02GT11FAI033 units undergo pre-shipment inspection (PSI). If there is an issue with S70GL02GT11FAI033, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70GL02GT11FAI033 part is unused and in its original packaging.
Return procedure for S70GL02GT11FAI033:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S70GL02GT11FAI033 Tags
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M24C02-WMN6TP
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