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Infineon Technologies S70GL02GT11FHA010
- Part No.:
- S70GL02GT11FHA010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S70GL02GT11FHA010.pdf
- Description:
- IC FLASH 2GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:360
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Product details
Overview
S70GL02GT11FHA010 from Infineon is a 2 Gb (256 MB) parallel NOR flash memory IC built on 45-nm MIRRORBIT™ technology, featuring 110 ns random access time, 20 ns page access time, and 512-byte programming buffer. It operates from a single 2.7–3.6 V supply, supports ×8/×16 data bus, and targets embedded boot code storage in industrial and automotive systems requiring high reliability and fast read performance.
For engineers reviewing the S70GL02GT11FHA010 datasheet, S70GL02GT11FHA010 pinout, S70GL02GT11FHA010 application, or S70GL02GT11FHA010 equivalent, key selection criteria include uniform 128-KB sector erase architecture, AEC-Q100 Grade 2/3 qualification, dual-die stacked configuration in fortified-BGA, and support for suspend/resume during program/erase operations.
Technical Context
The device integrates two S29GL01GT 1-Gb dies in a single 64-ball LSH fortified-BGA package, enabling 2-Gb density while maintaining pin compatibility with single-die counterparts. Its parallel interface uses address lines A0–A26 and bidirectional DQ0–DQ15 with BYTE#-controlled bus width selection.
Embedded algorithms handle sector erase (128 KB), buffer programming (up to 512 bytes), and status reporting via RY/BY# open-drain output, Status Register, and data polling. Protection includes volatile/non-volatile ASP, OTP array with two lockable regions, and WP#-enabled highest-sector write lock.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gb (256 MB), implemented as dual 1-Gb S29GL01GT dies |
| Access Time | 110 ns random access, 20 ns page access - enables fast CPU boot code fetch |
| Programming Buffer | 512 bytes - reduces effective programming time vs. byte-by-byte writes |
| Sector Size | Uniform 128 KB (64 kwords) - simplifies firmware partitioning and OTA update management |
| Endurance & Retention | 100,000 program-erase cycles / 20-year data retention - meets industrial lifecycle requirements |
| Operating Voltage | VCC = 2.7–3.6 V; VIO = 1.65 V to VCC - supports mixed-voltage system interfacing |
| Temperature Range | Industrial Plus (–40°C to +105°C) and AEC-Q100 Grade 2 - qualified for under-hood automotive use |
Pinout & Package
Package: 64-ball LSH fortified ball grid array (BGA), 13 mm × 11 mm, RoHS-compliant, with special handling requirements (no ultrasonic cleaning; max 150°C exposure).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ0–DQ15 | Data I/O (×16 mode) / DQ0–DQ7 + A1 (×8 mode) | Configurable data bus width; A1 repurposed as LSB address in byte mode |
| A0–A26 | Address inputs | 27-bit addressing supports full 2-Gb linear map with 128-KB sector granularity |
| CE#, OE#, WE# | Chip, Output, Write Enable controls | Standard parallel NOR control signals; CE# active-low chip select enables multi-device sharing |
| RY/BY# | Open-drain Ready/Busy output | Signals active algorithm execution; requires external pull-up; supports wired-OR across multiple devices |
| WP#, RESET#, BYTE# | Function control inputs | WP# locks highest sector; RESET# forces standby state; BYTE# selects ×8/×16 bus configuration |
| VCC, VIO, VSS, VSSQ | Power and ground supplies | VCC powers core logic; VIO sets I/O voltage level independently; VSSQ isolates flash array ground |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die stacking | Two 1-Gb S29GL01GT dies in one 64-ball BGA - achieves 2-Gb density without increasing footprint or signal count |
| 512-byte programming buffer | Enables burst programming of up to 512 bytes per command - cuts typical firmware write time by >70% vs. single-word writes |
| Uniform 128-KB sectors | 2048 identical sectors simplify memory mapping, wear leveling, and secure firmware update partitioning |
| Advanced Sector Protection (ASP) | Volatile and non-volatile locking per sector - allows runtime protection changes and factory-set permanent locks |
| OTP array with dual lockable regions | 1024-byte one-time-programmable space - stores cryptographic keys or calibration data with hardware-enforced write disable |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot code and real-time OS image in digital dashboard systems with AEC-Q100 compliance requirements. IC Role / Device Role / Timing Role: Parallel NOR flash serving as primary XIP (eXecute-In-Place) memory for MCU boot ROM and critical firmware. Use Value: 105°C operation and 20-year data retention ensure reliability over vehicle lifetime; 110 ns access enables deterministic boot timing. | Use Scenario: Holding field-upgradable firmware and configuration data in programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: Nonvolatile storage for safety-critical application code, supporting secure OTA updates and rollback recovery. Use Value: Uniform 128-KB sectors allow atomic firmware swap; suspend/resume enables safe interruption during power-loss events. |
| Medical Imaging Boot Memory | Avionics Display System |
Use Scenario: Hosting bootloader and diagnostic firmware in CT/MRI subsystems requiring long-term data integrity and ESD robustness. IC Role / Device Role / Timing Role: High-reliability parallel flash used for cold-start initialization and self-test routines. Use Value: 100,000 erase cycles support frequent calibration updates; ASP and OTP protect against unauthorized firmware modification. | Use Scenario: Providing certified boot code and display graphics assets in DO-254-compliant cockpit displays. IC Role / Device Role / Timing Role: Deterministic-access NOR flash delivering verified firmware to radiation-tolerant microcontrollers. Use Value: RY/BY# open-drain output enables synchronized status monitoring across redundant memory channels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT11FHIV10 | Single 1-Gb die, same 45-nm process, identical pinout and command set | Limited to half the density; suitable where 128 MB suffices and cost-per-bit is prioritized | Select when board layout rework is unacceptable and 1-Gb capacity meets firmware size requirements |
| MX29GL256FHTI-90G | 2-Gb Macronix device; 90 ns random access (slower), no AEC-Q100 qualification | Not automotive-qualified; lacks OTP array and advanced sector protection features | Consider only for industrial-only designs where extended temperature range and security features are noncritical |
Compared with S29GL01GT11FHIV10, the S70GL02GT11FHA010 doubles density without changing footprint or interface; versus MX29GL256FHTI-90G, it delivers faster access, automotive qualification, and enhanced security - making it optimal for safety-critical embedded boot memory.
Availability
S70GL02GT11FHA010 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging subsystems, and avionics displays requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S70GL02GT11FHA010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q200.
The GL-T series is designed specifically for high-reliability embedded boot memory applications, emphasizing AEC-Q100 qualification, long data retention, and robust sector protection for automotive and industrial firmware storage.
FAQ
What is the difference between S70GL02GT11FHA010 and S29GL01GT11FHIV10?
The S70GL02GT11FHA010 integrates two S29GL01GT dies in a single 64-ball fortified-BGA package to deliver 2 Gb density, whereas the S29GL01GT11FHIV10 is a single 1-Gb die in the same package footprint. Both share identical command sets, timing, and electrical specifications, enabling drop-in replacement where density permits.
Does S70GL02GT11FHA010 support x8 and x16 data bus modes?
Yes, the device supports both ×8 and ×16 configurations via the BYTE# input. When BYTE# is low, DQ7–DQ0 are active and DQ15/A1 functions as the LSB address; when BYTE# is high, DQ15–DQ0 operate as a full 16-bit data bus. This flexibility allows integration with 8-bit or 16-bit microcontrollers without external glue logic.
How is sector protection implemented on this device?
Sector protection uses Advanced Sector Protection (ASP) with both volatile (register-based) and non-volatile (hardware-latched) methods per 128-KB sector. The WP# pin provides additional hardware lock for the highest-address sector. An independent 1024-byte OTP array with two lockable regions further secures calibration data or cryptographic keys against overwrite.
Is ultrasonic cleaning safe for the S70GL02GT11FHA010 package?
No - ultrasonic cleaning is explicitly prohibited for this 64-ball fortified-BGA package. Infineon warns that such cleaning may damage internal interconnects or compromise data integrity. Recommended PCB cleaning methods include vapor-phase or batch solvent cleaning with temperatures held below 150°C for limited durations.
S70GL02GT11FHA010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8, 128M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (11x13)
S70GL02GT11FHA010 FAQ
1.How can I place an order for S70GL02GT11FHA010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70GL02GT11FHA010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70GL02GT11FHA010 reliable?
The price and inventory of S70GL02GT11FHA010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70GL02GT11FHA010 is usually 5 days.
3.What payment methods are accepted for S70GL02GT11FHA010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70GL02GT11FHA010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70GL02GT11FHA010?
S70GL02GT11FHA010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70GL02GT11FHA010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70GL02GT11FHA010?
For technical support, including S70GL02GT11FHA010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70GL02GT11FHA010 requirements.
6.How does Aetrix verify that S70GL02GT11FHA010 is sourced from the original manufacturer or authorized distributors?
All S70GL02GT11FHA010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70GL02GT11FHA010 meets industry standards.
7.What is the process for return or replacement of S70GL02GT11FHA010?
All S70GL02GT11FHA010 units undergo pre-shipment inspection (PSI). If there is an issue with S70GL02GT11FHA010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70GL02GT11FHA010 part is unused and in its original packaging.
Return procedure for S70GL02GT11FHA010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S70GL02GT11FHA010 Tags
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