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Infineon Technologies S70GL02GT11FHB013
- Part No.:
- S70GL02GT11FHB013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S70GL02GT11FHB013.pdf
- Description:
- IC FLASH 2GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,465
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Product details
Overview
S70GL02GT11FHB013 from Infineon is a 2 Gb (256 MB) parallel NOR flash memory IC using 45 nm MIRRORBIT™ technology, configured as dual-die stack of two S29GL01GT dies in a single package. It delivers 110 ns random access time, 20 ns page access time, and supports ×8/×16 data bus operation with 512-byte programming buffer. Used in automotive infotainment boot storage where deterministic read latency and AEC-Q100 Grade 2 compliance are required.
For engineers reviewing the S70GL02GT11FHB013 datasheet, S70GL02GT11FHB013 pinout, S70GL02GT11FHB013 application, or S70GL02GT11FHB013 equivalent, key selection criteria include industrial-plus temperature support (–40°C to +105°C), uniform 128-KB sector erase architecture, OTP array with dual lockable regions, and VIO range of 1.65 V to VCC for flexible I/O interfacing.
Technical Context
This device implements a dual-die stacked architecture with independent 1-Gb flash arrays sharing common control logic and I/O pins. Address lines A0–A26 support full 2-Gb addressing; BYTE# selects between byte (DQ7–DQ0 active, DQ15/A1 repurposed) and word (DQ15–DQ0 active) modes.
Embedded algorithms handle program/erase with suspend/resume capability; status reporting uses RY/BY# open-drain output, data polling, and Status Register reads. Sector protection includes volatile/non-volatile ASP and hardware WP# lock for the highest 128-KB sector.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory capacity | 2 Gb (256 MB), organized as 2048 uniform 128-KB sectors |
| Access time | 110 ns random access, 20 ns page access - enables fast instruction fetch in MCU boot scenarios |
| Programming buffer | 512 bytes - reduces effective programming time vs. byte-by-byte writes |
| Operating voltage | VCC = 2.7–3.6 V; VIO = 1.65 V to VCC - supports mixed-voltage system interfacing |
| Endurance & retention | 100,000 program-erase cycles; 20-year data retention at +85°C - meets automotive long-life requirements |
| Temperature grade | AEC-Q100 Grade 2 (–40°C to +105°C) - qualified for under-hood and display module use |
| Package | 64-ball fortified BGA (LSH064), 13 mm × 11 mm - optimized for thermal reliability in high-density PCBs |
Pinout & Package
64-ball LSH fortified BGA (13 mm × 11 mm), RoHS-compliant, with exposed thermal pad. Ball pitch: 0.8 mm. Requires controlled reflow profile per Infineon S70GL02GT packaging guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ0–DQ14, DQ15/A-1 | Data I/O / LSB address in byte mode | 16-bit bidirectional data bus; DQ15 doubles as A-1 only when BYTE# = LOW |
| A0–A26 | Address inputs | 27-bit address bus supporting full 2-Gb linear addressing (0x0000000–0x7FFFFFF) |
| CE#, OE#, WE# | Chip, Output, Write Enable controls | Standard parallel NOR control signals; all active-low, TTL-compatible input thresholds |
| RY/BY# | Open-drain ready/busy indicator | Active-low during embedded operations; requires external pull-up; supports multi-device ready detection |
| WP# | Hardware write protect | Locks highest 128-KB sector regardless of ASP settings; internal pull-up ensures default-unlocked state |
| BYTE# | Data bus width select | LOW = byte mode (DQ7–DQ0 active); HIGH = word mode (DQ15–DQ0 active) |
| RESET# | Hardware reset input | Asynchronous reset of command logic; returns device to read mode without power cycle |
| VCC, VIO, VSS, VSSQ | Power and ground rails | VCC = core supply (2.7–3.6 V); VIO = I/O supply (1.65 V to VCC); separate VSSQ improves noise immunity |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die stacked architecture | Two 1-Gb S29GL01GT dies in single 64-ball package - achieves 2-Gb density without increasing footprint |
| 512-byte programming buffer | Enables burst programming up to 1.14 MBps at +105°C - cuts firmware update time by >70% vs. single-word writes |
| Advanced sector protection (ASP) | Volatile and non-volatile locking per sector - allows runtime configuration and factory-locked security partitions |
| 1024-byte OTP array | Two independently lockable regions - stores calibration data, MAC addresses, or secure keys with irreversible write-once guarantee |
| Common Flash Interface (CFI) | Full CFI compliance - enables OS-agnostic flash management and automatic driver detection in Linux/U-Boot environments |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot code and GUI assets for real-time digital instrument clusters requiring AEC-Q100 qualification. IC Role / Device Role / Timing Role: Parallel NOR flash providing deterministic <110 ns read access for MCU instruction fetch during startup and gauge animation rendering. Use Value: Grade 2 temperature rating (–40°C to +105°C) and 20-year data retention ensure reliability across vehicle lifetime without refresh. | Use Scenario: Holds field-upgradable firmware and configuration parameters in DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: Nonvolatile storage with suspend/resume erase capability - allows background firmware updates without halting I/O scanning. Use Value: 128-KB uniform sectors simplify partitioning for dual-bank firmware images; WP# protects critical bootloader region from accidental overwrite. |
| Medical Imaging Control Panel | Avionics Display Boot Memory |
Use Scenario: Stores safety-critical UI firmware and calibration tables in portable ultrasound control panels subject to IEC 60601-1 EMC requirements. IC Role / Device Role / Timing Role: High-reliability parallel flash with CFI support enabling certified bootloader verification and secure field updates. Use Value: OTP array stores device-specific calibration coefficients; ASP allows runtime lockdown of diagnostic partitions during FDA audit mode. | Use Scenario: Provides DO-178C certifiable boot image storage for cockpit multifunction displays operating in extended temperature environments. IC Role / Device Role / Timing Role: Deterministic read timing and RY/BY# signaling enable predictable boot sequence timing for ARINC 661-compliant graphics stacks. Use Value: Dual-die stacking eliminates interposer routing complexity while maintaining MIL-STD-883 Class B screening compatibility. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S29GL01GT11FHIV10 | Single-die 1-Gb version; identical 45 nm MIRRORBIT™ process, same pinout subset but no dual-die stacking | Lacks 2-Gb density; suitable only where space allows two discrete packages or where lower capacity suffices | Select when board layout permits dual-package placement or when 1-Gb capacity meets functional requirements |
| Macronix MX29GL256FHTI-90G | 2-Gb parallel NOR with 90 ns random access; different command set, no CFI support, no OTP array | Requires custom driver development; lacks hardware sector lock granularity and secure OTP storage | Choose only if legacy system compatibility mandates MX29GL command set and CFI/OTP are not required |
Compared with S29GL01GT11FHIV10, S70GL02GT11FHB013 doubles density in same footprint and adds dual-die coordination logic; versus MX29GL256FHTI-90G, it provides CFI automation, finer sector protection, and certified AEC-Q100 Grade 2 operation - critical for safety-aware systems.
Availability
S70GL02GT11FHB013 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging panels, and avionics displays requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S70GL02GT11FHB013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions.
The GL-T series targets automotive and industrial applications demanding AEC-Q100 qualification, extended temperature operation, and deterministic flash performance for safety-critical boot and firmware storage.
FAQ
What is the function of the BYTE# pin on S70GL02GT11FHB013?
BYTE# selects data bus width: when pulled LOW, the device operates in byte mode with DQ7–DQ0 active and DQ15 repurposed as A-1 address line; when HIGH, it operates in word mode with full DQ15–DQ0 data bus. This enables flexible interface design with 8-bit or 16-bit host processors without external multiplexing logic.
Does S70GL02GT11FHB013 support hardware write protection for sectors other than the highest one?
Yes - via Advanced Sector Protection (ASP), which allows volatile or non-volatile locking of any individual 128-KB sector. WP# only protects the highest sector unconditionally; ASP provides granular, software-configurable protection for all 2048 sectors, including permanent lock via non-volatile bits.
Can the OTP array be used for storing cryptographic keys?
Yes - the 1024-byte OTP array has two independently lockable regions. Once locked, data cannot be altered or read back, making it suitable for storing root keys, device identifiers, or calibration secrets in systems requiring tamper-resistant storage, provided key provisioning occurs before final lock.
Is RY/BY# compatible with wired-OR multi-device ready signaling?
Yes - RY/BY# is an open-drain output requiring an external pull-up resistor. Multiple S70GL02GT11FHB013 devices can tie their RY/BY# outputs together; the combined signal goes LOW only when any device is busy, enabling synchronized readiness detection in multi-flash memory subsystems.
S70GL02GT11FHB013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8, 128M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (11x13)
S70GL02GT11FHB013 FAQ
1.How can I place an order for S70GL02GT11FHB013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70GL02GT11FHB013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70GL02GT11FHB013 reliable?
The price and inventory of S70GL02GT11FHB013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70GL02GT11FHB013 is usually 5 days.
3.What payment methods are accepted for S70GL02GT11FHB013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70GL02GT11FHB013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70GL02GT11FHB013?
S70GL02GT11FHB013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70GL02GT11FHB013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70GL02GT11FHB013?
For technical support, including S70GL02GT11FHB013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70GL02GT11FHB013 requirements.
6.How does Aetrix verify that S70GL02GT11FHB013 is sourced from the original manufacturer or authorized distributors?
All S70GL02GT11FHB013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70GL02GT11FHB013 meets industry standards.
7.What is the process for return or replacement of S70GL02GT11FHB013?
All S70GL02GT11FHB013 units undergo pre-shipment inspection (PSI). If there is an issue with S70GL02GT11FHB013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70GL02GT11FHB013 part is unused and in its original packaging.
Return procedure for S70GL02GT11FHB013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S70GL02GT11FHB013 Tags
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M24C02-WMN6TP
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