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Infineon Technologies S70GL02GT11FHB020
- Part No.:
- S70GL02GT11FHB020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S70GL02GT11FHB020.pdf
- Description:
- IC FLASH 2GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,127
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Product details
Overview
S70GL02GT11FHB020 from Infineon is a 2 Gb (256 MB) parallel NOR flash memory IC built on 45 nm MIRRORBIT™ technology, configured as dual-die stack of two S29GL01GT dies in a single fortified-BGA package. It delivers 110 ns random access time, 20 ns page access time, and supports ×8/×16 data bus operation with 512-byte programming buffer - enabling high-speed firmware storage in industrial control panels requiring deterministic boot code execution.
For engineers reviewing the S70GL02GT11FHB020 datasheet, S70GL02GT11FHB020 pinout, S70GL02GT11FHB020 application, or S70GL02GT11FHB020 equivalent, key selection criteria include uniform 128-KB sector erase architecture, AEC-Q100 Grade 2 qualification (–40°C to +105°C), 100,000 program-erase cycles, and WP#-controlled top-sector write protection.
Technical Context
This device implements a dual-die stacked architecture where two 1024 Mb S29GL01GT dies share common control signals (CE#, OE#, WE#, RESET#) and operate under unified command set via CFI-compliant interface. Address lines A0–A26 support full 2 Gb addressing with A26 selecting between die halves.
It uses versatile I/O (VIO = 1.65 V to VCC) for mixed-voltage system interfacing, supports byte/word mode via BYTE# input, and provides three status monitoring methods: RY/BY# open-drain output, status register polling, and data polling - ensuring robust integration into legacy parallel bus microcontroller systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 2 Gb (256 MB), organized as 2048 uniform 128-KB sectors - enables full firmware image storage with granular update capability. |
| Access time | 110 ns random access, 20 ns page access - meets timing requirements for 5 MHz bus operation without wait states. |
| Programming buffer | 512-byte buffer - reduces effective programming time by up to 256× vs. single-word writes in bootloader update sequences. |
| Operating voltage | VCC = 2.7–3.6 V, VIO = 1.65–VCC - allows direct interfacing with 1.8 V or 3.3 V logic without level shifters. |
| Endurance & retention | 100,000 program-erase cycles, 20-year data retention - validated for mission-critical industrial firmware storage. |
| Temperature grade | AEC-Q100 Grade 2 (–40°C to +105°C) - qualified for under-hood automotive ECUs and industrial motor drives. |
| Package | 64-ball LSH fortified BGA, 13 mm × 11 mm - optimized for thermal reliability and board-level reflow compatibility. |
Pinout & Package
64-ball LSH fortified BGA (13 mm × 11 mm), RoHS-compliant, with reinforced solder joint structure for thermal cycling reliability in automotive and industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ0–DQ15 | Data I/O bus | 16-bit bidirectional data path; DQ15 functions as A-1 (LSB address) in byte mode when BYTE# = low. |
| A0–A26 | Address inputs | 27-bit address bus supporting full 2 Gb addressing; A26 selects upper/lower die in dual-die stack. |
| CE#, OE#, WE# | Control enables | Standard parallel flash control signals; CE# active-low chip select enables device decoding in multi-chip memory maps. |
| RY/BY# | Open-drain status output | Signals active programming/erase via low state; high-impedance indicates readiness - supports wired-OR multi-device busy detection. |
| WP# | Hardware write protect | Low-active protection for highest 128-KB sector only; internal pull-up ensures default unprotected state if left floating. |
| RESET# | Hardware reset | Asynchronous reset of internal state machine to read mode - required after power-up or error recovery. |
| BYTE# | Bus width selector | Configures data bus as ×8 (DQ7–DQ0 active, DQ15=A-1) or ×16 (DQ15–DQ0 active) - enables flexible host interface design. |
Key Features
| Feature | Design Value |
|---|---|
| Advanced Sector Protection (ASP) | Volatile and non-volatile lock bits per 128-KB sector - enables field-upgradeable firmware partitioning with hardware-enforced read/write isolation. |
| Common Flash Interface (CFI) | Full CFI compliance per JEDEC JESD68 - allows automatic driver detection and configuration in Linux MTD and U-Boot environments. |
| OTP array | 1024-byte one-time-programmable region with two lockable sections - stores immutable keys, calibration data, or serial numbers without risking overwrite. |
| Suspend/Resume | Interruptible program and erase operations - permits high-priority read access during background flash operations in real-time systems. |
| Uniform sector architecture | All 2048 sectors are 128 KB - eliminates complex erase scheduling logic and simplifies wear leveling in custom firmware. |
Applications
| Industrial PLC Firmware Storage | Automotive Engine Control Unit (ECU) |
|---|---|
|
Use Scenario: Storing boot loader and application firmware in programmable logic controller mainboards operating continuously at 85°C ambient. IC Role / Device Role / Timing Role: Primary nonvolatile code storage with deterministic 110 ns read access for zero-wait-state CPU fetch. Use Value: 20-year data retention and 100K-cycle endurance ensure firmware integrity over 15+ year product lifecycle without refresh. |
Use Scenario: Holding calibrated engine maps and diagnostic routines in gasoline direct injection ECUs exposed to under-hood thermal cycling. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified parallel flash providing secure, fast-access storage for safety-critical calibration data. Use Value: WP#-protected top sector prevents accidental overwrite of critical startup parameters during field updates. |
| Railway Signaling System BIOS | Medical Imaging Device Boot ROM |
|
Use Scenario: Hosting fail-safe boot firmware in wayside signaling controllers certified to EN 5012x standards. IC Role / Device Role / Timing Role: CFI-compliant NOR flash enabling standardized driver integration across multiple rail OEM platforms. Use Value: Uniform 128-KB sectors simplify certified firmware update validation and rollback procedures. |
Use Scenario: Storing verified boot images and FPGA configuration bitstreams in portable ultrasound scanners with strict EMC requirements. IC Role / Device Role / Timing Role: Low EMI parallel interface with 200 µA standby current minimizes power supply noise in analog front-end circuits. Use Value: 512-byte programming buffer accelerates field-service firmware patches without disrupting imaging workflow. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT11FHIV10 | Single-die 1 Gb version, identical 45 nm process, same 110 ns/20 ns timing, but half capacity and no dual-die stacking. | Lacks 2 Gb density and die-stacking benefits; suitable only where firmware size < 128 MB and PCB area allows two separate packages. | Select when cost sensitivity outweighs density requirement and board layout permits discrete placement. |
| MX29GL256FHTI-90G | Micron 256 MB parallel NOR, 90 ns access, 3.0 V core, but lacks AEC-Q100 qualification and has no OTP array. | Not automotive-qualified; missing ASP and CFI features limits use in safety-certified systems. | Consider only for commercial-grade industrial HMI where qualification and security features are non-mandatory. |
Compared with S29GL01GT11FHIV10, the S70GL02GT11FHB020 doubles density in same footprint via dual-die stacking; versus MX29GL256FHTI-90G, it adds automotive qualification, OTP, and enhanced sector protection - making it the sole choice for AEC-Q100-compliant embedded boot storage.
Availability
S70GL02GT11FHB020 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ECU calibration data retention, and railway signaling system BIOS requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S70GL02GT11FHB020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
The GL-T series targets high-reliability embedded systems needing parallel NOR flash with AEC-Q100 qualification, CFI compliance, and advanced data protection - specifically designed for automotive, industrial, and transportation infrastructure applications.
FAQ
What is the function of the BYTE# pin on S70GL02GT11FHB020?
The BYTE# pin configures the data bus width: when pulled low, the device operates in ×8 mode with DQ7–DQ0 active and DQ15 repurposed as A-1 (LSB address); when high, it operates in ×16 mode with full DQ15–DQ0 data path. This allows flexible integration with 8-bit or 16-bit microcontrollers without external multiplexing logic.
Does S70GL02GT11FHB020 support simultaneous read while program/erase?
No, it does not support true concurrent read/program or read/erase. However, it supports suspend/resume functionality: an ongoing program or erase operation can be paused using the Suspend command, allowing a high-priority read access to complete before resuming the background operation - critical for real-time interrupt handling.
How is the WP# pin used to protect firmware sectors?
WP# is a dedicated hardware input that, when driven low, permanently disables program and erase commands for only the highest 128-KB sector (SA2047). It does not affect other sectors or software-based protection mechanisms like Advanced Sector Protection (ASP), providing a tamper-resistant safeguard for boot code or security keys stored in that sector.
What packaging variant does S70GL02GT11FHB020 use, and why is it called "fortified" BGA?
S70GL02GT11FHB020 uses the 64-ball LSH fortified BGA (13 mm × 11 mm). "Fortified" refers to mechanical enhancements including thicker substrate, reinforced solder mask, and optimized ball layout - improving resistance to thermal stress, board flexure, and drop shock, which is essential for automotive and rail applications where vibration and thermal cycling are severe.
S70GL02GT11FHB020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8, 128M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S70GL02GT11FHB020 FAQ
1.How can I place an order for S70GL02GT11FHB020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70GL02GT11FHB020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70GL02GT11FHB020 reliable?
The price and inventory of S70GL02GT11FHB020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70GL02GT11FHB020 is usually 5 days.
3.What payment methods are accepted for S70GL02GT11FHB020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70GL02GT11FHB020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70GL02GT11FHB020?
S70GL02GT11FHB020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70GL02GT11FHB020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70GL02GT11FHB020?
For technical support, including S70GL02GT11FHB020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70GL02GT11FHB020 requirements.
6.How does Aetrix verify that S70GL02GT11FHB020 is sourced from the original manufacturer or authorized distributors?
All S70GL02GT11FHB020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70GL02GT11FHB020 meets industry standards.
7.What is the process for return or replacement of S70GL02GT11FHB020?
All S70GL02GT11FHB020 units undergo pre-shipment inspection (PSI). If there is an issue with S70GL02GT11FHB020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70GL02GT11FHB020 part is unused and in its original packaging.
Return procedure for S70GL02GT11FHB020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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