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Infineon Technologies S70GL02GT11FHI020
- Part No.:
- S70GL02GT11FHI020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S70GL02GT11FHI020.pdf
- Description:
- IC FLASH 2GBIT CFI 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,439
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Product details
Overview
S70GL02GT11FHI020 from Infineon is a 2 Gb (256 MB) parallel NOR flash memory device fabricated on 45-nm MIRRORBIT™ process, featuring 110 ns random access time, 20 ns page access time, and uniform 128-KB sectors (2048 total). It operates from a single 2.7–3.6 V supply, supports ×8/×16 data bus width, and integrates a 512-byte programming buffer for accelerated write performance in embedded boot code storage.
For engineers reviewing the S70GL02GT11FHI020 datasheet, S70GL02GT11FHI020 pinout, S70GL02GT11FHI020 application, or S70GL02GT11FHI020 equivalent, key selection criteria include industrial-grade temperature support (–40°C to +85°C), AEC-Q100 Grade 3 qualification, dual-die stacked architecture, fortified-BGA package compatibility, and sector-level erase/suspend/resume functionality.
Technical Context
The S70GL02GT11FHI020 implements a dual-die stack of two S29GL01GT 1-Gb dies in a single 64-ball LSH fortified-BGA package, enabling 2-Gb density while retaining pin-compatible behavior with discrete 1-Gb counterparts. Its architecture supports byte/word mode via BYTE# control and uses a common flash interface (CFI) for standardized identification and command set compliance.
It delivers deterministic timing with tACC = 110 ns and tPACC = 20 ns at VIO = 3.0 V, and supports advanced data integrity features including 100,000 program-erase cycles, 20-year data retention, and volatile/non-volatile sector protection (ASP) with OTP lockable regions. The RY/BY# open-drain ready/busy signal enables multi-device synchronization during embedded algorithms.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gb (256 MB), dual-die stack of two 1-Gb S29GL01GT dies |
| Access Time | tACC = 110 ns (random), tPACC = 20 ns (page) - enables fast instruction fetch in boot ROM applications |
| Supply Voltage | VCC = 2.7–3.6 V (single supply for read/program/erase); VIO = 1.65–VCC - supports mixed-voltage system interfacing |
| Bus Width | Configurable ×8 or ×16 via BYTE# input - simplifies migration between microcontroller data bus widths |
| Sector Size & Count | Uniform 128-KB sectors; 2048 total - enables fine-grained firmware update partitioning |
| Programming Buffer | 512-byte write buffer - reduces effective programming time by up to 256× vs. single-word writes |
| Endurance & Retention | 100,000 program-erase cycles; 20-year data retention at +85°C - meets long-lifecycle industrial/AEC-Q100 requirements |
Pinout & Package
Package: 64-ball LSH fortified ball grid array (BGA), 13 mm × 11 mm, RoHS-compliant, with special handling requirements (no ultrasonic cleaning; max 150°C exposure).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ15–DQ0 | Data I/O (×16) / DQ7–DQ0 + A1 (×8) | Bi-directional data bus; A1 repurposed as LSB address in byte mode |
| A26–A0 | Address inputs | 27-bit addressing for full 2-Gb space; A26 used for die selection in dual-die stack |
| CE#, OE#, WE# | Chip/Output/Write Enable controls | Standard parallel flash control signals; CE# active-low chip select for multi-device decoding |
| RY/BY# | Open-drain ready/busy output | Indicates active erase/program; requires external pull-up; supports wired-OR across multiple devices |
| WP#, BYTE#, RESET# | Function control inputs | WP# protects top 128-KB sector; BYTE# selects bus width; RESET# forces hardware reset to standby state |
| VCC, VIO, VSS, VSSQ | Power and ground terminals | VCC = core supply; VIO = I/O voltage rail (1.65–VCC); VSS/VSSQ = separate analog/digital grounds for noise isolation |
Key Features
| Feature | Design Value |
|---|---|
| 45-nm MIRRORBIT™ process | Enables 2-Gb density in compact BGA package while maintaining industrial temperature reliability |
| 512-byte programming buffer | Allows burst programming of full page in one command - cuts firmware update time vs. byte-by-byte writes |
| Suspend/Resume for erase & program | Permits interruptible background operations - critical for real-time systems requiring low-latency response |
| Advanced Sector Protection (ASP) | Independent volatile/non-volatile locking per 128-KB sector - prevents accidental overwrite of boot or calibration data |
| Common Flash Interface (CFI) | Standardized JEDEC-compliant ID and command structure - ensures bootloader compatibility across vendors |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated gauge graphics, driver-assist logic, and OTA update images in AEC-Q100 Grade 3 qualified head unit. IC Role / Device Role / Timing Role: Boot ROM and persistent firmware storage with guaranteed 20-year data retention at +85°C. Use Value: Dual-die stacking provides required 2-Gb density without board area penalty; ASP prevents corruption of safety-critical calibration sectors. | Use Scenario: Holding ladder logic, configuration parameters, and firmware revision history in DIN-rail mounted programmable controllers. IC Role / Device Role / Timing Role: Non-volatile program memory with deterministic 110 ns read access for real-time scan cycle execution. Use Value: Uniform 128-KB sectors allow atomic firmware updates; suspend/resume avoids scan interruption during field upgrades. |
| Medical Imaging System Boot Loader | Telecom Base Station Configuration |
Use Scenario: Securely storing FPGA bitstreams, sensor calibration tables, and regulatory compliance logs in Class II medical devices. IC Role / Device Role / Timing Role: Trusted boot source with OTP lockable regions for cryptographic keys and regulatory signatures. Use Value: Separate 1024-byte OTP array with two lockable regions ensures immutable root-of-trust elements survive field reprogramming. | Use Scenario: Maintaining radio frequency profiles, neighbor cell lists, and software license keys across 5G base station deployments. IC Role / Device Role / Timing Role: High-reliability configuration store supporting remote diagnostics and zero-touch provisioning. Use Value: 100,000-cycle endurance and RY/BY# wired-OR capability enable coordinated multi-module updates without service interruption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT11FHIV10 | Single-die 1-Gb version; identical timing, same 64-ball BGA footprint but half capacity | Limited to applications needing ≤128 MB; no dual-die interconnect overhead | Select when board layout must retain pin compatibility but density requirement is lower |
| S70GL02GT11FHI010 | Same dual-die 2-Gb device but rated for Industrial Plus (–40°C to +105°C) instead of Industrial (–40°C to +85°C) | Required for under-hood automotive or high-ambient industrial enclosures | Choose when extended temperature operation is mandatory; otherwise identical functionality |
Compared with S29GL01GT11FHIV10, the S70GL02GT11FHI020 doubles density without changing footprint or interface; compared with S70GL02GT11FHI010, it trades +105°C capability for cost optimization in standard industrial environments.
Availability
S70GL02GT11FHI020 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging boot loaders, and telecom base station configuration storage requiring stable component supply across multi-year production cycles.
Supply support for S70GL02GT11FHI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q100 standards.
This device belongs to Infineon's GL-T series of parallel NOR flash memories, designed specifically for high-reliability embedded boot code and firmware storage in automotive, industrial, and medical systems demanding long-term data integrity and AEC-Q100 compliance.
FAQ
What is the function of the RY/BY# pin?
RY/BY# is an open-drain ready/busy output that signals whether the device is executing an embedded algorithm (e.g., program or erase). When pulled low, the device is busy; when in high-impedance state (requiring external pull-up), it is ready. Multiple devices can share this signal via wired-OR for synchronized status monitoring.
Does S70GL02GT11FHI020 support both ×8 and ×16 data bus modes?
Yes - the BYTE# input selects bus width: logic low configures ×8 mode (DQ7–DQ0 active, DQ15/A1 becomes LSB address), and logic high enables ×16 mode (DQ15–DQ0 active). This allows flexible integration with microcontrollers offering either 8-bit or 16-bit external memory interfaces.
How is sector protection implemented on this device?
Sector protection uses Advanced Sector Protection (ASP) with both volatile (power-on default) and non-volatile (permanent until unlocked) methods per 128-KB sector. WP# independently locks the highest-address sector. Protection status is verified via CFI commands and autoselect ID reads, ensuring robust prevention of accidental firmware overwrite.
What packaging and handling precautions apply to this BGA device?
The device uses a 64-ball LSH fortified-BGA (13 mm × 11 mm) requiring avoidance of ultrasonic cleaning and limiting exposure to temperatures above 150°C. Balls E1 (DNU), C1/D1/E1/G1 (RFU), and A1/A8/H1/H8 (NC) must not be routed on PCB; E1 has internal pull-down and may be tied to VSS if needed.
S70GL02GT11FHI020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- CFI
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S70GL02GT11FHI020 FAQ
1.How can I place an order for S70GL02GT11FHI020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70GL02GT11FHI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70GL02GT11FHI020 reliable?
The price and inventory of S70GL02GT11FHI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70GL02GT11FHI020 is usually 5 days.
3.What payment methods are accepted for S70GL02GT11FHI020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70GL02GT11FHI020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70GL02GT11FHI020?
S70GL02GT11FHI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70GL02GT11FHI020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70GL02GT11FHI020?
For technical support, including S70GL02GT11FHI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70GL02GT11FHI020 requirements.
6.How does Aetrix verify that S70GL02GT11FHI020 is sourced from the original manufacturer or authorized distributors?
All S70GL02GT11FHI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70GL02GT11FHI020 meets industry standards.
7.What is the process for return or replacement of S70GL02GT11FHI020?
All S70GL02GT11FHI020 units undergo pre-shipment inspection (PSI). If there is an issue with S70GL02GT11FHI020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70GL02GT11FHI020 part is unused and in its original packaging.
Return procedure for S70GL02GT11FHI020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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