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Infineon Technologies S70GL02GT11FHI023
- Part No.:
- S70GL02GT11FHI023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S70GL02GT11FHI023.pdf
- Description:
- IC FLASH 2GBIT CFI 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,366
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Product details
Overview
S70GL02GT11FHI023 from Infineon is a 2 Gb (256 MB) parallel NOR flash memory IC using 45 nm MIRRORBIT™ technology, configured as dual-die stack of two S29GL01GT dies in a single package. It delivers 110 ns random access time, 20 ns page access time, and supports ×8/×16 data bus operation with 512-byte programming buffer - enabling high-speed firmware storage in industrial control panels requiring deterministic boot code execution.
For engineers reviewing the S70GL02GT11FHI023 datasheet, S70GL02GT11FHI023 pinout, S70GL02GT11FHI023 application, or S70GL02GT11FHI023 equivalent, key selection criteria include uniform 128-KB sector erase architecture, AEC-Q100 Grade 2 qualification (–40°C to +105°C), VIO range of 1.65 V to VCC, OTP array support, and WP#-controlled top-sector write protection.
Technical Context
This device implements a dual-die stacked architecture where two independent 1-Gb S29GL01GT dies share common control signals (CE#, WE#, OE#, RY/BY#) and address/data buses, with internal address decoding extending A26 for die selection. Sector erase and program operations execute independently per die but are synchronized via shared status reporting.
The 64-ball fortified BGA package integrates dedicated VIO and VCCQ supplies for I/O and core logic separation, supporting wide voltage tolerance (1.65 V–3.6 V) on VIO while maintaining 3.0 V core operation. BYTE# input selects between byte (DQ7–DQ0 active, DQ15/A1 repurposed as LSB address) and word (DQ15–DQ0 active) data width modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 2 Gb (256 MB) total capacity, implemented as two 1-Gb dies in single package |
| Access time | 110 ns random access time (tACC), enabling deterministic read latency in real-time boot loaders |
| Page access | 20 ns page access time (tPACC), accelerating sequential instruction fetch from cached pages |
| Programming buffer | 512-byte buffer allowing single-command multi-word writes, reducing effective programming time by ~8× vs byte-by-byte |
| Sector size | Uniform 128 KB sectors (2048 total), simplifying firmware partitioning and OTA update management |
| Endurance & retention | 100,000 program/erase cycles and 20-year data retention at +85°C, validated for long-life industrial deployments |
| Temperature grade | AEC-Q100 Grade 2 (–40°C to +105°C), qualified for under-hood automotive ECUs and rail signaling controllers |
Pinout & Package
Package: 64-ball LSH fortified BGA, 13 mm × 11 mm, with exposed thermal pad (VSS-connected). Ball pitch: 0.8 mm. Requires reflow profile compliant with JEDEC J-STD-020 moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ0–DQ15 | Data I/O bidirectional bus | Supports ×8 (DQ7–DQ0 active, DQ15/A1 becomes A1) or ×16 mode; open-drain RY/BY# requires external pull-up |
| A0–A26 | Address inputs | A26 selects upper/lower 1-Gb die; full 27-bit addressing enables linear 256 MB map without banking logic |
| CE#, OE#, WE# | Chip/Output/Write Enable controls | Standard parallel interface timing; CE# gating enables low-power deselection during idle periods |
| BYTE# | Data bus width selector | VIL = byte mode (8-bit), VIH = word mode (16-bit); eliminates need for external bus-width translation logic |
| WP# | Hardware write protect | VIL locks highest 128 KB sector only - preserves bootloader integrity without disabling full-device protection schemes |
| RY/BY# | Open-drain ready/busy indicator | Shared across multiple devices; High-Z = ready, VIL = active erase/program - enables synchronous multi-chip command execution |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage (VIO) | 1.65 V to VCC operation allows direct interfacing with 1.8 V, 2.5 V, or 3.3 V host processors without level shifters |
| Advanced sector protection (ASP) | Volatile and non-volatile lock bits per 128 KB sector enable field-upgradable security policies without hardware modification |
| OTP array | 1024-byte one-time-programmable region with two lockable sections stores immutable keys or calibration data |
| Common Flash Interface (CFI) | Standardized CFI query table enables automatic driver detection and configuration in Linux/U-Boot environments |
| Suspend/resume capability | Interrupts ongoing erase or program operations to service high-priority reads - critical for real-time HMI responsiveness |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing firmware images and configuration tables in programmable logic controllers deployed in factory automation lines. IC Role / Device Role / Timing Role: Non-volatile code storage with deterministic 110 ns read access ensuring sub-millisecond boot initialization. Use Value: Uniform 128 KB sectors simplify firmware version rollback and delta updates; AEC-Q100 Grade 2 rating ensures reliability in temperature-cycled cabinet environments. | Use Scenario: Holding boot code and safety-critical sensor calibration data in radar ECU modules operating near engine compartments. IC Role / Device Role / Timing Role: Primary boot memory mapped into ARM Cortex-R5 processor's XIP space with 20 ns page access accelerating instruction prefetch. Use Value: WP#-protected top sector isolates bootloader from accidental overwrite during over-the-air updates; 20-year data retention meets ISO 26262 ASIL-B requirements. |
| Railway Signaling Controller | Medical Imaging System BIOS |
Use Scenario: Storing certified control logic and fail-safe state machines in EN 5012x-compliant trackside interlocking units. IC Role / Device Role / Timing Role: Dual-die architecture provides redundancy-ready storage; RY/BY# sharing enables synchronized erase across mirrored banks. Use Value: 100,000 erase cycles support decades of maintenance cycles; CFI compliance ensures compatibility with legacy diagnostic toolchains. | Use Scenario: Hosting BIOS and FPGA configuration bitstreams in CT/MRI scanner mainboards requiring zero-failure startup. IC Role / Device Role / Timing Role: Parallel NOR interface delivers burst read throughput >100 MB/s for rapid FPGA reconfiguration during power-on self-test. Use Value: OTP array secures cryptographic keys used in DICOM image encryption; VIO range accommodates mixed-voltage board design with 1.8 V FPGAs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT11FHIV10 | Single-die 1 Gb variant, identical 45 nm process, same pinout but no A26 connection required | Lacks dual-die density; suitable for cost-sensitive designs where 256 MB is not required | Select when system memory map fits within 128 MB and PCB layout must avoid A26 routing complexity |
| MX29GL256FHTI-90G | 2 Gb Macronix device; 90 ns tACC, no RY/BY# sharing support, lacks ASP and OTP features | Lower endurance (100K vs 100K), no AEC-Q100 qualification, limited sector protection granularity | Choose only for non-automotive industrial use where CFI compatibility and 1.65 V VIO are not required |
Compared with S29GL01GT11FHIV10, the S70GL02GT11FHI023 doubles density without increasing footprint; versus MX29GL256FHTI-90G, it adds automotive qualification, finer-grained protection, and dual-die synchronization - critical for safety-certified systems.
Availability
S70GL02GT11FHI023 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and railway signaling controller applications requiring stable component supply across extended product lifecycles.
Supply support for S70GL02GT11FHI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for mission-critical systems.
The GL-T series targets high-reliability embedded applications demanding AEC-Q100 qualification, extended temperature operation, and robust data integrity - particularly in automotive ECUs, industrial automation, and infrastructure control systems.
FAQ
What is the function of the BYTE# pin on S70GL02GT11FHI023?
The BYTE# pin configures the data bus width: at VIL, the device operates in byte mode (DQ7–DQ0 active, DQ15/A1 repurposed as address A1); at VIH, it operates in word mode (DQ15–DQ0 active). This eliminates external bus-width translation logic and supports both 8-bit and 16-bit host interfaces without redesign.
Does S70GL02GT11FHI023 support simultaneous erase operations across both dies?
No - erase commands execute sequentially per die under shared CE#/WE# control. The dual-die stack shares all control signals; internal arbitration ensures only one die processes an erase command at a time, though RY/BY# reflects combined busy status for system-level synchronization.
How is the 2 Gb capacity physically organized in the 64-ball BGA package?
The capacity is implemented as two vertically stacked 1-Gb S29GL01GT dies sharing the same 64-ball footprint. Address line A26 selects between dies, while all other address, data, and control signals are common. This maintains pin compatibility with single-die variants while doubling density in identical PCB area.
Can the OTP array be reprogrammed after initial programming?
No - the 1024-byte OTP array is permanently programmable once. Each of its two lockable regions can be individually locked via dedicated CFI commands; after locking, no further writes are possible to that region, ensuring cryptographic key or calibration data immutability in field-deployed units.
S70GL02GT11FHI023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- CFI
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S70GL02GT11FHI023 FAQ
1.How can I place an order for S70GL02GT11FHI023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70GL02GT11FHI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70GL02GT11FHI023 reliable?
The price and inventory of S70GL02GT11FHI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70GL02GT11FHI023 is usually 5 days.
3.What payment methods are accepted for S70GL02GT11FHI023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70GL02GT11FHI023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70GL02GT11FHI023?
S70GL02GT11FHI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70GL02GT11FHI023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70GL02GT11FHI023?
For technical support, including S70GL02GT11FHI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70GL02GT11FHI023 requirements.
6.How does Aetrix verify that S70GL02GT11FHI023 is sourced from the original manufacturer or authorized distributors?
All S70GL02GT11FHI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70GL02GT11FHI023 meets industry standards.
7.What is the process for return or replacement of S70GL02GT11FHI023?
All S70GL02GT11FHI023 units undergo pre-shipment inspection (PSI). If there is an issue with S70GL02GT11FHI023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70GL02GT11FHI023 part is unused and in its original packaging.
Return procedure for S70GL02GT11FHI023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S70GL02GT11FHI023 Tags
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