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Infineon Technologies S70GL02GT11FHV013
- Part No.:
- S70GL02GT11FHV013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S70GL02GT11FHV013.pdf
- Description:
- IC FLASH 2GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,947
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Product details
Overview
S70GL02GT11FHV013 from Infineon is a 2 Gb (256 MB) parallel NOR flash memory device fabricated on 45-nm MIRRORBIT™ process, featuring 110 ns random access time, 20 ns page access time, and 512-byte programming buffer. It integrates two 1-Gb S29GL01GT dies in a single 64-ball fortified-BGA package and supports industrial (–40°C to +85°C) and automotive AEC-Q100 grade 3 operation for embedded boot code storage.
For engineers reviewing the S70GL02GT11FHV013 datasheet, S70GL02GT11FHV013 pinout, S70GL02GT11FHV013 application, or S70GL02GT11FHV013 equivalent, key selection criteria include uniform 128-KB sector erase capability, dual-die stack architecture, VIO range of 1.65 V to VCC, WP#-controlled top-sector protection, and CFI-compliant device identification.
Technical Context
This device implements a dual-die stacked architecture where two independent 1-Gb S29GL01GT dies share common control signals (CE#, OE#, WE#, RESET#) and operate under unified command set execution. Address lines A0–A26 support full 2-Gb addressing with byte/word mode selection via BYTE#.
It uses MIRRORBIT™ charge-trap technology enabling 100,000 program-erase cycles and 20-year data retention. Status monitoring is supported via RY/BY# open-drain output, status register polling, and data polling - all compatible with legacy parallel flash controllers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 2 Gb (256 MB), dual-die stack of two 1-Gb S29GL01GT dies |
| Access time | 110 ns random access (tACC), 20 ns page access (tPACC) at VIO = VCC = 3.0 V |
| Programming buffer | 512-byte write buffer enabling single-operation programming of up to 256 words |
| Sector size & count | Uniform 128-KB sectors; 2048 total sectors across full address space |
| Supply voltage | VCC = 2.7 V to 3.6 V; VIO = 1.65 V to VCC - enables mixed-voltage system interfacing |
| Data bus width | Configurable ×8 or ×16 via BYTE# input; DQ15/A-1 serves as LSB address in byte mode |
| Endurance & retention | 100,000 program/erase cycles; guaranteed 20-year data retention at ≤85°C |
Pinout & Package
Package: 64-ball LSH fortified BGA, 13 mm × 11 mm, RoHS-compliant, with thermal pad exposed on bottom side.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ0–DQ14, DQ15/A-1 | Data I/O / LSB address | Bidirectional data bus; DQ15 functions as A-1 (LSB) in byte mode when BYTE# = VIL |
| A0–A26 | Address inputs | 27-bit address bus supporting full 2-Gb linear addressing (0x0000000–0x7FFFFFF) |
| CE#, OE#, WE# | Chip, Output, Write Enable | Standard parallel flash control signals; active-low, TTL-compatible thresholds |
| RY/BY# | Ready/Busy output | Open-drain status indicator requiring external pull-up; shared across multiple devices for synchronization |
| WP# | Write Protect input | Hardware lock for highest 128-KB sector (SA2047); internal pull-up ensures default unprotected state |
| RESET# | Hardware reset | Asynchronous reset of internal state machine to standby; no effect on stored data |
| BYTE# | Bus width select | VIL = ×8 mode (DQ7–DQ0 active); VIH = ×16 mode (DQ15–DQ0 active) |
| VCC, VIO, VSS | Power supplies | VCC powers core logic; VIO powers I/O buffers independently - allows flexible voltage domain interfacing |
Key Features
| Feature | Design Value |
|---|---|
| Advanced Sector Protection (ASP) | Volatile and non-volatile locking per sector - enables field-upgradeable firmware partitioning |
| OTP array | 1024-byte one-time-programmable region with two lockable sections for secure configuration storage |
| Suspend/Resume | Interruptible program and erase operations - allows high-priority read access during background writes |
| Common Flash Interface (CFI) | Standardized query table at known address - enables automatic driver detection and configuration by bootloader |
| Temperature grading | Qualified for Industrial Plus (–40°C to +105°C) and AEC-Q100 Grade 2 - suitable for under-hood automotive ECUs |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated engine maps, diagnostic routines, and bootloader code in safety-critical powertrain modules. IC Role / Device Role / Timing Role: Primary non-volatile boot memory with AEC-Q100 Grade 2 qualification and 100K-cycle endurance. Use Value: Ensures reliable firmware persistence over 15+ years of vehicle service life under thermal cycling and EMI stress. | Use Scenario: Holding firmware images and configuration parameters for programmable logic controllers operating in factory automation environments. IC Role / Device Role / Timing Role: Parallel NOR flash used for XIP (eXecute-In-Place) execution of real-time control code. Use Value: 20 ns page access enables deterministic instruction fetch latency critical for sub-millisecond I/O scan cycles. |
| Medical Imaging System Boot ROM | Avionics Data Logger Memory |
Use Scenario: Secure boot image storage for MRI and CT scanner mainboards requiring FDA-compliant traceability and long-term reliability. IC Role / Device Role / Timing Role: CFI-compliant boot device with OTP region storing cryptographic keys and calibration signatures. Use Value: Non-volatile ASP and OTP locking prevent unauthorized firmware modification during maintenance or field updates. | Use Scenario: Recording flight parameter snapshots and fault logs in black-box recorders where data integrity must survive crash-level shock and temperature extremes. IC Role / Device Role / Timing Role: High-reliability parallel flash with 20-year data retention and RY/BY#-synchronized multi-device erase coordination. Use Value: Uniform 128-KB sector erase allows atomic log segment updates without corrupting adjacent mission-critical records. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT11FHV010 | Single-die 1-Gb version; identical timing, package, and command set but half capacity | Lacks dual-die stacking; unsuitable for designs requiring >1 Gb in same footprint | Select when board layout or cost constraints require lower density without changing interface or timing margins |
| MX29GL256EHTI-90G | Macronix 2-Gb parallel NOR; 90 ns tACC, no CFI support, different OTP structure | Requires custom driver adaptation; lacks AEC-Q100 qualification | Consider only for non-automotive industrial use where CFI auto-detection is not required and qualification is waived |
Compared with S29GL01GT11FHV010 and MX29GL256EHTI-90G, the S70GL02GT11FHV013 uniquely delivers dual-die density in a drop-in compatible footprint while maintaining AEC-Q100 Grade 2 compliance, CFI interoperability, and hardware-based sector protection - essential for automotive and medical safety-critical firmware storage.
Availability
S70GL02GT11FHV013 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware upgrades, and medical imaging system boot ROM replacement requiring stable component supply across extended product lifecycles.
Supply support for S70GL02GT11FHV013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions.
The GL-T series targets high-end embedded systems needing robust, pin-compatible NOR flash with extended temperature operation, AEC-Q100 qualification, and advanced data protection features for mission-critical firmware storage.
FAQ
What is the function of the BYTE# pin on S70GL02GT11FHV013?
The BYTE# pin selects between ×8 and ×16 data bus configurations. When pulled low (VIL), it enables byte mode where DQ7–DQ0 are active and DQ15/A-1 becomes the LSB address input. When high (VIH), it activates word mode with full DQ15–DQ0 data width. This flexibility supports legacy 8-bit controllers and modern 16-bit interfaces without redesigning PCB traces.
Does S70GL02GT11FHV013 support hardware write protection for sectors other than the top one?
No - hardware write protection via WP# applies exclusively to the highest 128-KB sector (SA2047). Other sectors can be protected using Advanced Sector Protection (ASP), which offers both volatile (power-cycle reset) and non-volatile (permanent until unlocked) locking per sector through command sequences written to specific address locations.
How does the 512-byte programming buffer improve effective write speed?
The 512-byte buffer allows up to 256 words to be loaded before initiating internal programming, reducing overhead from repeated command/address/data handshaking. At 3.0 V and 25°C, this achieves 1.114 MBps effective throughput - approximately 4× faster than single-word programming - critical for rapid firmware field updates in production test or service environments.
Can S70GL02GT11FHV013 be used in place of S29GL01GT11FHV010 on the same PCB?
Yes - both share identical 64-ball LSH fortified BGA package, pinout, voltage ranges, timing specifications, and command set. The S70GL02GT11FHV013 is a dual-die stack delivering double the density (2 Gb vs. 1 Gb) with no changes to PCB layout, firmware drivers, or timing margins, making it a direct upgrade path for capacity-constrained designs.
S70GL02GT11FHV013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8, 128M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (11x13)
S70GL02GT11FHV013 FAQ
1.How can I place an order for S70GL02GT11FHV013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70GL02GT11FHV013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70GL02GT11FHV013 reliable?
The price and inventory of S70GL02GT11FHV013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70GL02GT11FHV013 is usually 5 days.
3.What payment methods are accepted for S70GL02GT11FHV013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70GL02GT11FHV013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70GL02GT11FHV013?
S70GL02GT11FHV013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70GL02GT11FHV013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70GL02GT11FHV013?
For technical support, including S70GL02GT11FHV013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70GL02GT11FHV013 requirements.
6.How does Aetrix verify that S70GL02GT11FHV013 is sourced from the original manufacturer or authorized distributors?
All S70GL02GT11FHV013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70GL02GT11FHV013 meets industry standards.
7.What is the process for return or replacement of S70GL02GT11FHV013?
All S70GL02GT11FHV013 units undergo pre-shipment inspection (PSI). If there is an issue with S70GL02GT11FHV013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70GL02GT11FHV013 part is unused and in its original packaging.
Return procedure for S70GL02GT11FHV013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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