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Infineon Technologies S70GL02GT12FHAV10
- Part No.:
- S70GL02GT12FHAV10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S70GL02GT12FHAV10.pdf
- Description:
- IC FLASH 2GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,886
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Product details
Overview
S70GL02GT12FHAV10 from Infineon is a 2 Gb (256 MB) parallel NOR flash memory IC with dual-die stacked architecture, fabricated on 45-nm MIRRORBIT™ process. It operates from a single 2.7–3.6 V supply, delivers 110 ns random access time and 20 ns page access time, and integrates a 512-byte programming buffer for accelerated write throughput. It is used in automotive infotainment boot storage where deterministic read latency and AEC-Q100 Grade 2 reliability are required.
For engineers reviewing the S70GL02GT12FHAV10 datasheet, S70GL02GT12FHAV10 pinout, S70GL02GT12FHAV10 application, or S70GL02GT12FHAV10 equivalent, key selection criteria include uniform 128-KB sector erase granularity, industrial-plus temperature range (–40°C to +105°C), OTP array support, and fortified-BGA package mechanical robustness for high-vibration environments.
Technical Context
This device implements a dual-die stack of two S29GL01GT dies in one package, enabling 2-Gb density while maintaining pin compatibility with 1-Gb counterparts. Its parallel ×16 data bus supports byte/word mode via BYTE# control, and it uses Common Flash Interface (CFI) for host software compatibility.
The embedded algorithm engine supports suspend/resume during program and erase operations, and status reporting via RY/BY# open-drain output, status register polling, and data polling - all critical for real-time OS boot loaders and firmware update sequences requiring non-blocking background operations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gb (256 MB) total capacity, implemented as two 1024 Mb dies in stacked BGA |
| Access Time | 110 ns random access time ensures deterministic boot code fetch timing for ARM Cortex-A/R-based SoCs |
| Programming Buffer | 512-byte buffer enables single-command multi-word writes, reducing effective programming time by >4× vs. byte-by-byte |
| Sector Size | Uniform 128-KB sectors (2048 total); simplifies firmware partitioning and OTA update atomicity |
| Endurance & Retention | 100,000 program-erase cycles and 20-year data retention meet automotive ECU long-life requirements |
| Temperature Grade | AEC-Q100 Grade 2 (–40°C to +105°C) qualified for under-hood and display module deployment |
| I/O Voltage Range | VIO = 1.65 V to VCC supports mixed-voltage system interfacing without level shifters |
Pinout & Package
64-ball LSH fortified ball grid array (BGA), 13 mm × 11 mm footprint, with reinforced solder joint structure for thermal cycling reliability in automotive applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ0–DQ15 | Data I/O (×16 mode) | Bi-directional parallel data bus; DQ15/A-1 serves as LSB address in byte mode |
| A0–A26 | Address inputs | 27-bit address bus supporting full 2-Gb linear addressing; A26 selects upper die |
| CE#, OE#, WE# | Control enables | Standard parallel flash control signals; CE# enables chip select, OE# enables output drivers, WE# controls direction |
| RY/BY# | Open-drain status output | Signals active programming/erase; requires external pull-up; supports wired-OR across multiple devices |
| WP#, BYTE#, RESET# | Function control inputs | WP# protects top 128-KB sector; BYTE# configures ×8/×16 bus width; RESET# forces hardware reset |
| VCC, VIO, VSS | Power supplies | VCC = 2.7–3.6 V core supply; VIO = 1.65–VCC I/O supply; VSS = common ground reference |
Key Features
| Feature | Design Value |
|---|---|
| Advanced Sector Protection (ASP) | Volatile and non-volatile per-sector lock enabling secure firmware update partitions and bootloader protection |
| OTP Array | 1024-byte one-time-programmable region with two lockable sections for unique device identifiers or calibration data |
| Suspend/Resume | Interruptible program/erase operations allow foreground read access during background writes - essential for real-time UI responsiveness |
| CFI Compliance | Standardized JEDEC CFI query table enables automatic driver detection and cross-platform firmware portability |
| Fortified BGA Packaging | Enhanced mechanical integrity against thermal stress and vibration; qualified for automotive under-hood mounting |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores calibrated gauge graphics, CAN message lookup tables, and safety-critical boot firmware in digital dashboards. IC Role / Device Role / Timing Role: Primary non-volatile boot memory with deterministic 110 ns read access for fast cold-start response. Use Value: AEC-Q100 Grade 2 qualification and 20-year data retention ensure compliance with ISO 26262 ASIL-B functional safety requirements. | Use Scenario: Holds field-upgradable ladder logic, I/O configuration maps, and real-time OS kernel images in programmable logic controllers. IC Role / Device Role / Timing Role: Parallel NOR interface provides direct XIP (eXecute-In-Place) capability for deterministic interrupt latency. Use Value: Uniform 128-KB sector erase enables atomic firmware updates without runtime corruption risk during power loss. |
| Avionics Display Module | Medical Imaging Boot Loader |
Use Scenario: Stores certified flight display firmware, font assets, and diagnostic self-test routines in cockpit multifunction displays. IC Role / Device Role / Timing Role: Dual-die architecture delivers 2-Gb density within legacy 64-ball footprint, easing board-level redesign. Use Value: Suspend/resume functionality allows concurrent display refresh and background firmware verification during pre-flight checks. | Use Scenario: Hosts certified boot loader, cryptographic keys, and DICOM image decompression microcode in MRI/PET console systems. IC Role / Device Role / Timing Role: OTP array stores immutable root-of-trust keys; WP# protects top sector containing secure boot vector. Use Value: 100,000-cycle endurance supports frequent regulatory-mandated firmware validation cycles over 15+ year product life. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT12FHAV10 | Single-die 1-Gb version; identical pinout and command set but half density and no A26 address line usage | Suitable for cost-sensitive designs where 1-Gb capacity suffices and dual-die stacking is unnecessary | Select when board layout re-use is prioritized and density headroom is not required |
| MX29GL256FHTI-90G | 2-Gb Macronix part; 90 ns random access (vs. 110 ns); no AEC-Q100 qualification; different CFI ID and OTP implementation | Acceptable for industrial control where automotive qualification is not mandated | Choose only if AEC-Q100 is waived and faster access time justifies vendor change and firmware revalidation |
Compared with S29GL01GT12FHAV10, the S70GL02GT12FHAV10 doubles density without changing footprint or interface; versus MX29GL256FHTI-90G, it trades 20 ns slower access for guaranteed automotive qualification, OTP security, and Infineon's long-term supply commitment.
Availability
S70GL02GT12FHAV10 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, avionics displays, and medical imaging consoles requiring stable component supply across extended product lifecycles.
Supply support for S70GL02GT12FHAV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and memory solutions, with global R&D and manufacturing infrastructure.
The GL-T series targets high-reliability embedded systems requiring AEC-Q100-qualified parallel NOR flash for boot code and firmware storage in harsh environments.
FAQ
What is the function of the BYTE# pin on S70GL02GT12FHAV10?
BYTE# selects data bus width: at VIL, the device operates in ×8 mode with DQ7–DQ0 active and DQ15/A-1 repurposed as LSB address; at VIH, it operates in ×16 mode with full DQ0–DQ15 data path. This enables flexible interface design across 8-bit and 16-bit host controllers without external logic.
Does S70GL02GT12FHAV10 support execute-in-place (XIP) operation?
Yes - its parallel NOR architecture and deterministic 110 ns random access time enable direct code execution from flash memory without copying to RAM. This reduces boot latency and SRAM footprint in resource-constrained microcontrollers and SoCs used in automotive and industrial applications.
How is sector protection implemented on this device?
Sector protection uses Advanced Sector Protection (ASP) with both volatile (register-based) and non-volatile (lock-bit) methods. The WP# pin independently protects the highest 128-KB sector. Each of the 2048 uniform sectors can be individually locked via status register bits or OTP fuses, enabling granular firmware partitioning.
What does "fortified BGA" mean for this package?
Fortified BGA refers to Infineon's enhanced mechanical construction - including reinforced solder mask, optimized ball layout, and substrate stiffening - designed to withstand thermal cycling, mechanical shock, and vibration in automotive under-hood and industrial environments. It exceeds standard JEDEC BGA reliability requirements.
S70GL02GT12FHAV10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8, 128M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 120 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (11x13)
S70GL02GT12FHAV10 FAQ
1.How can I place an order for S70GL02GT12FHAV10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70GL02GT12FHAV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70GL02GT12FHAV10 reliable?
The price and inventory of S70GL02GT12FHAV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70GL02GT12FHAV10 is usually 5 days.
3.What payment methods are accepted for S70GL02GT12FHAV10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70GL02GT12FHAV10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70GL02GT12FHAV10?
S70GL02GT12FHAV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70GL02GT12FHAV10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70GL02GT12FHAV10?
For technical support, including S70GL02GT12FHAV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70GL02GT12FHAV10 requirements.
6.How does Aetrix verify that S70GL02GT12FHAV10 is sourced from the original manufacturer or authorized distributors?
All S70GL02GT12FHAV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70GL02GT12FHAV10 meets industry standards.
7.What is the process for return or replacement of S70GL02GT12FHAV10?
All S70GL02GT12FHAV10 units undergo pre-shipment inspection (PSI). If there is an issue with S70GL02GT12FHAV10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70GL02GT12FHAV10 part is unused and in its original packaging.
Return procedure for S70GL02GT12FHAV10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S70GL02GT12FHAV10 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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AT24C02C-SSHM-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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