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Infineon Technologies S70GL02GT12FHBV20
- Part No.:
- S70GL02GT12FHBV20
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S70GL02GT12FHBV20.pdf
- Description:
- IC FLASH 2GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,909
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Product details
Overview
S70GL02GT12FHBV20 from Infineon is a 2 Gb (256 MB) parallel NOR flash memory IC built on 45-nm MIRRORBIT™ technology, configured as a dual-die stack of two S29GL01GT dies in a single fortified-BGA package. It delivers 110 ns random access time, 20 ns page access time, and supports ×8/×16 data bus operation with 512-byte buffer programming - enabling fast firmware storage and code execution in industrial control systems.
For engineers reviewing the S70GL02GT12FHBV20 datasheet, S70GL02GT12FHBV20 pinout, S70GL02GT12FHBV20 application, or S70GL02GT12FHBV20 equivalent, key selection criteria include its 128-KB uniform sector architecture, AEC-Q100 Grade 2/3 automotive qualification, 100,000 program-erase cycles, and dual-voltage I/O (1.65 V to VCC) for flexible host interface integration.
Technical Context
This device implements a parallel NOR flash architecture with embedded algorithms for sector erase and buffer programming, supporting both byte and word modes via BYTE# control. Its dual-die stacking enables 2 Gb density while retaining pin compatibility with single-die S29GL01GT devices, using shared address lines A0–A26 and dual DQ buses.
The RY/BY# open-drain ready/busy signal and WP# hardware write protection operate independently per die, and status reporting is supported via status register, data polling, and dedicated output - critical for deterministic boot-time flash initialization in safety-critical systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gb (256 MB), realized as two stacked 1-Gb S29GL01GT dies |
| Access Time | 110 ns random access, 20 ns page access - enables sub-100 ns instruction fetch latency |
| Bus Width | Configurable ×8 or ×16 via BYTE# input - supports legacy 8-bit microcontrollers and modern 16-bit interfaces |
| Sector Size | Uniform 128 KB (64 kword) sectors, 2048 total - simplifies firmware partitioning and OTA update management |
| Programming Buffer | 512-byte page buffer - reduces average programming time by >8× vs. single-word writes |
| Endurance & Retention | 100,000 program/erase cycles, 20-year data retention at ≤85°C - meets industrial lifecycle requirements |
| Supply Range | VCC = 2.7 V to 3.6 V; VIO = 1.65 V to VCC - allows direct interfacing with 1.8 V/2.5 V/3.3 V logic without level shifters |
Pinout & Package
Package: 64-ball LSH fortified BGA, 13 mm × 11 mm, RoHS-compliant, with thermal pad (VSS balls distributed across array for improved heat dissipation).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ0–DQ14, DQ15/A-1 | Data I/O / LSB Address | Bi-directional data bus (×16 mode) or DQ0–DQ7 + A1 (×8 mode); A-1 used only in byte mode |
| A0–A26 | Address Inputs | 27-bit address bus supporting full 2 Gb addressing; A26 selects upper/lower die in dual-die configuration |
| CE#, OE#, WE# | Chip/Output/Write Enable | Standard parallel flash control signals; CE# must be active for any operation, OE#/WE# control direction |
| RY/BY# | Open-drain Ready/Busy | Active-low during erase/program; high-impedance when complete - requires external pull-up for system-level status monitoring |
| WP#, RESET#, BYTE# | Function Control Inputs | WP# protects top 128 KB sector; RESET# forces standby state; BYTE# configures bus width and DQ15 function |
| VCC, VIO, VSS, VSSQ | Power & Ground | VCC powers core logic; VIO powers I/O drivers; VSS/VSSQ are separate ground returns for noise isolation |
Key Features
| Feature | Design Value |
|---|---|
| Advanced Sector Protection (ASP) | Volatile and non-volatile lock bits per 128 KB sector - enables secure bootloader partitioning and field firmware rollback prevention |
| OTP Array | 1024-byte one-time-programmable region with two lockable sections - stores cryptographic keys or calibration data without risk of overwrite |
| Suspend/Resume | Interruptible erase and program operations - allows real-time response to higher-priority CPU requests during flash updates |
| Common Flash Interface (CFI) | Full CFI compliance (JEDEC JESD68) - enables automatic detection and driver configuration in Linux/U-Boot environments |
| Dual-Die Stack Architecture | Two S29GL01GT dies in single package with shared control pins - preserves PCB footprint while doubling capacity |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing firmware and configuration data in programmable logic controllers operating continuously at 85°C ambient. IC Role / Device Role / Timing Role: Non-volatile code storage with deterministic read latency and sector-level update capability. Use Value: 100,000-cycle endurance and 20-year retention ensure 15+ years of unattended operation without refresh. | Use Scenario: Holding boot code and safety-critical calibration tables for radar ECU in AEC-Q100 Grade 2 (–40°C to +105°C) environment. IC Role / Device Role / Timing Role: Primary boot flash with hardware write protection (WP#) and CFI-based auto-configuration. Use Value: AEC-Q100 qualification and ASP enable ISO 26262 ASIL-B compliant memory partitioning and secure boot verification. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Storing FPGA bitstreams and diagnostic firmware in portable ultrasound units requiring zero data loss over 10-year service life. IC Role / Device Role / Timing Role: High-reliability configuration memory with suspend/resume for concurrent diagnostics and update tasks. Use Value: 20-year data retention at 85°C and 512-byte buffer programming reduce update window by 75% vs. legacy parallel flash. | Use Scenario: Holding field-upgradable configuration profiles and protocol stacks in outdoor 5G base station remote radio units. IC Role / Device Role / Timing Role: Dual-voltage I/O (1.65 V to VCC) interface to 1.8 V FPGA and 3.3 V power management ICs. Use Value: Versatile VIO eliminates need for external level shifters, reducing BOM count and board area by 12%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S29GL01GT12FHI020 | Single-die 1 Gb version; identical pinout and timing but half capacity; no A26 die-select functionality | Used where 1 Gb suffices and dual-die stacking is unnecessary; lacks top-sector protection granularity of S70GL02GT | Select when cost-sensitive designs require lower density and simpler thermal profile |
| Infineon S70GL02GT11FHBV20 | Same dual-die 2 Gb device but with 110 ns max random access (vs. 120 ns in -12 variant); otherwise identical electrical and mechanical specs | Targeted at timing-critical boot paths where <115 ns access is mandatory; same industrial/automotive grades | Choose for systems requiring tighter access time margin without changing layout or firmware |
Compared with S29GL01GT12FHI020, S70GL02GT12FHBV20 doubles density in same footprint and adds die-select control; versus S70GL02GT11FHBV20, it trades 10 ns slower access for broader voltage tolerance and enhanced thermal stability in extended temperature operation.
Availability
S70GL02GT12FHBV20 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply across long-lifecycle programs.
Supply support for S70GL02GT12FHBV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for industrial, automotive, and IoT applications.
The GL-T series targets high-reliability embedded systems requiring deterministic parallel flash performance, AEC-Q100 qualification, and long-term data integrity - optimized for code storage in safety-critical boot paths.
FAQ
What is the purpose of the A26 pin on S70GL02GT12FHBV20?
A26 serves as the die-select signal in the dual-die stack configuration: when low, it addresses the lower 1 Gb die; when high, it selects the upper 1 Gb die. This enables full 2 Gb addressing while maintaining pin compatibility with single-die S29GL01GT devices, allowing seamless migration from 1 Gb to 2 Gb density without PCB redesign.
How does the BYTE# pin affect DQ15 functionality?
When BYTE# is driven low, the device enters byte mode: DQ15 functions as A1 (LSB address), and only DQ0–DQ7 are active for data transfer. When BYTE# is high, the device operates in word mode: DQ0–DQ15 form a full 16-bit data bus, and A1 is sourced from the address pins. This dual-mode flexibility supports both legacy 8-bit microcontrollers and modern 16-bit interfaces.
Can WP# protect sectors other than the highest 128 KB?
No - WP# exclusively protects the highest-address 128 KB sector (SA2047). Sector-level protection for other regions requires software-controlled Advanced Sector Protection (ASP) using command sequences. WP# is a hardware-only, non-volatile lock that remains active even after power cycling, making it ideal for immutable bootloader protection.
Is the RY/BY# signal compatible with wired-OR bus topologies?
Yes - RY/BY# is an open-drain output requiring an external pull-up resistor. Multiple S70GL02GT12FHBV20 devices can have their RY/BY# outputs tied together on a shared bus; the line goes low if any device is busy and returns high-impedance only when all devices complete their operations. This enables synchronized status monitoring in multi-flash memory systems.
S70GL02GT12FHBV20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8, 128M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 120 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S70GL02GT12FHBV20 FAQ
1.How can I place an order for S70GL02GT12FHBV20 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70GL02GT12FHBV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70GL02GT12FHBV20 reliable?
The price and inventory of S70GL02GT12FHBV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70GL02GT12FHBV20 is usually 5 days.
3.What payment methods are accepted for S70GL02GT12FHBV20?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70GL02GT12FHBV20 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70GL02GT12FHBV20?
S70GL02GT12FHBV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70GL02GT12FHBV20 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70GL02GT12FHBV20?
For technical support, including S70GL02GT12FHBV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70GL02GT12FHBV20 requirements.
6.How does Aetrix verify that S70GL02GT12FHBV20 is sourced from the original manufacturer or authorized distributors?
All S70GL02GT12FHBV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70GL02GT12FHBV20 meets industry standards.
7.What is the process for return or replacement of S70GL02GT12FHBV20?
All S70GL02GT12FHBV20 units undergo pre-shipment inspection (PSI). If there is an issue with S70GL02GT12FHBV20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70GL02GT12FHBV20 part is unused and in its original packaging.
Return procedure for S70GL02GT12FHBV20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S70GL02GT12FHBV20 Tags
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