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Infineon Technologies S70GL02GT12FHBV23
- Part No.:
- S70GL02GT12FHBV23
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S70GL02GT12FHBV23.pdf
- Description:
- IC FLASH 2GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,301
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Product details
Overview
S70GL02GT12FHBV23 from Infineon is a 2 Gb (256 MB) parallel NOR flash memory IC using 45 nm MIRRORBIT™ technology, configured as dual-die stack of two S29GL01GT dies in a single fortified-BGA package. It delivers 110 ns random access time, 20 ns page access time, and supports ×8/×16 data bus operation with 512-byte programming buffer - enabling high-speed firmware storage in automotive infotainment boot code execution.
For engineers reviewing the S70GL02GT12FHBV23 datasheet, S70GL02GT12FHBV23 pinout, S70GL02GT12FHBV23 application, or S70GL02GT12FHBV23 equivalent, key selection criteria include industrial-plus temperature support (–40°C to +105°C), AEC-Q100 Grade 2 qualification, uniform 128-KB sector erase architecture, and dual-die stacking for density without interface change.
Technical Context
This device implements a dual-die stacked architecture where two independent 1-Gb S29GL01GT dies share common control signals (CE#, OE#, WE#, RY/BY#) and address/data buses, with internal die-select logic managed via A26. It uses CMOS 3.0 V core supply (2.7–3.6 V) and separate VIO (1.65–VCC) for I/O flexibility.
Embedded algorithms handle sector erase (128 KB), buffer programming (up to 512 bytes), and suspend/resume operations. Status reporting is supported via status register, data polling, and open-drain RY/BY# output requiring external pull-up - critical for multi-device ready synchronization in automotive ECUs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory capacity | 2 Gb (256 MB) total, composed of two 1-Gb dies in stacked BGA |
| Access time (tACC) | 110 ns max at –40°C to +85°C - determines minimum read cycle timing in host controller |
| Page access time (tPACC) | 20 ns - enables fast sequential reads from internal 16-word buffer |
| Programming buffer | 512 bytes - reduces effective write time vs. byte-by-byte programming by >10× |
| Sector size & count | Uniform 128 KB sectors; 2048 total - simplifies firmware partitioning and OTA update management |
| Endurance & retention | 100,000 program-erase cycles; 20-year data retention - meets automotive ECU long-life requirements |
| Operating temperature | –40°C to +105°C (Industrial Plus / AEC-Q100 Grade 2) - qualified for under-hood applications |
Pinout & Package
Package: 64-ball LSH fortified BGA, 13 mm × 11 mm, RoHS-compliant, with special handling requirements (no ultrasonic cleaning; max 150°C exposure).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ0–DQ15 | Data I/O (×16 mode) or DQ0–DQ7 + A1 (×8 mode) | Configurable bus width supports legacy 8-bit controllers or modern 16-bit interfaces |
| A0–A26 | Address inputs | A26 selects between upper/lower die in dual-die stack; full 27-bit addressing for 2 Gb space |
| CE#, OE#, WE# | Chip, Output, Write Enable controls | Standard parallel NOR interface timing compatible with ARM Cortex-M7/A9 memory controllers |
| RY/BY# | Open-drain Ready/Busy output | Active-low during erase/program; high-Z when complete - enables hardware handshaking without polling |
| WP# | Write Protect input | Hardware lock for highest 128 KB sector - prevents accidental overwrite of boot loader region |
| BYTE# | Bus width configuration | Pull-low for ×8 mode (DQ7–DQ0 active); pull-high for ×16 mode (DQ15–DQ0 active) |
| VCC / VIO / VSS | Power supplies | VCC = 2.7–3.6 V core; VIO = 1.65–VCC I/O voltage - allows interfacing with 1.8 V or 3.3 V SoCs |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die stacked architecture | Two 1-Gb S29GL01GT dies in one 64-ball BGA - achieves 2 Gb density without changing PCB footprint or interface |
| 512-byte programming buffer | Enables burst programming at 1.14 MBps (–40°C to +105°C) - cuts firmware update time vs. single-word writes |
| Advanced sector protection (ASP) | Volatile/non-volatile locking per 128 KB sector - supports secure boot partitioning and field firmware rollback |
| Common Flash Interface (CFI) | Supports auto-configuration of timing and geometry by host bootloader - eliminates hard-coded memory map dependencies |
| OTP array | 1024-byte one-time-programmable region with two lockable sections - stores cryptographic keys or calibration data |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
|
Use Scenario: Stores calibrated gauge graphics, driver-assist UI assets, and over-the-air (OTA) update staging area. IC Role / Device Role / Timing Role: Parallel NOR boot memory mapped to ARM Cortex-R5 processor's external bus interface. Use Value: 105°C rating ensures reliability behind dashboard; 128 KB uniform sectors simplify delta-update patching. |
Use Scenario: Holds real-time OS kernel, motion control firmware, and configuration profiles in modular automation hardware. IC Role / Device Role / Timing Role: Non-volatile code storage with deterministic 110 ns read access for hard real-time task loading. Use Value: Dual-die stacking provides 2 GB density in legacy 64-ball footprint - avoids PCB redesign during capacity upgrade. |
| Medical Imaging Boot Loader | Avionics Display System |
|
Use Scenario: Secures boot code and FPGA configuration bitstreams for MRI subsystem controllers with regulatory traceability. IC Role / Device Role / Timing Role: CFI-compliant flash enabling automatic initialization by safety-certified bootloader (IEC 62304 Class C). Use Value: OTP array stores device-specific encryption keys; ASP prevents unauthorized firmware modification during service. |
Use Scenario: Stores certified display firmware, font libraries, and failure-mode graphics for cockpit multifunction displays. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified parallel flash directly interfaced to PowerPC e200z7 host. Use Value: 20-year data retention meets DO-160E environmental lifetime requirements; WP# protects critical boot sector. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT12FHBV23 | Single 1-Gb die in same 64-ball BGA; half capacity; identical timing and command set | Suitable where 128 MB suffices and cost-per-bit optimization is prioritized over future scalability | Select when board space is constrained but density demand is lower - drop-in replacement with no layout change |
| S70GL02GT11FHBV23 | Same 2-Gb dual-die stack but rated for Industrial (–40°C to +85°C), not Industrial Plus | Lacks AEC-Q100 Grade 2 qualification; unsuitable for under-hood or high-temp avionics use | Choose only for cost-sensitive industrial control applications where extended temperature is not required |
Compared with S29GL01GT12FHBV23 and S70GL02GT11FHBV23, the S70GL02GT12FHBV23 uniquely combines 2 Gb density, +105°C operation, and AEC-Q100 Grade 2 compliance - making it the sole option for automotive Tier-1 suppliers needing both thermal robustness and scalable firmware storage in legacy BGA footprints.
Availability
S70GL02GT12FHBV23 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging boot loaders, and avionics display systems requiring stable component supply across extended product lifecycles.
Supply support for S70GL02GT12FHBV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for mission-critical applications.
The GL-T series targets high-reliability embedded systems requiring AEC-Q100 qualified parallel NOR flash with extended temperature range, deterministic timing, and long-term data integrity - especially in automotive and industrial control domains.
FAQ
Is S70GL02GT12FHBV23 pin-compatible with S29GL01GT12FHBV23?
Yes - both use identical 64-ball LSH fortified BGA (13 mm × 11 mm) with matching ball map and signal assignments. The dual-die S70GL02GT replaces the single-die S29GL01GT without PCB revision, though A26 must be driven to select upper/lower die in 2 Gb mode.
What is the function of the BYTE# pin on S70GL02GT12FHBV23?
BYTE# configures data bus width: pulled low for ×8 mode (DQ7–DQ0 active, DQ15/A1 becomes LSB address), pulled high for ×16 mode (DQ15–DQ0 active). This allows backward compatibility with 8-bit microcontrollers while supporting higher bandwidth in 16-bit systems.
Does S70GL02GT12FHBV23 support hardware reset via RESET#?
Yes - asserting RESET# low resets internal control logic to standby state, halting any ongoing erase or program operation and returning outputs to high-impedance. This is essential for safe recovery after power brownout or watchdog timeout in automotive ECUs.
How is write protection implemented on S70GL02GT12FHBV23?
WP# disables program/erase in the highest 128 KB sector (SA2047) when pulled low. Unlike software-based protection, this is hardware-enforced and active regardless of sector lock status - ensuring boot loader integrity even if firmware is compromised.
S70GL02GT12FHBV23 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8, 128M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 120 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S70GL02GT12FHBV23 FAQ
1.How can I place an order for S70GL02GT12FHBV23 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70GL02GT12FHBV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70GL02GT12FHBV23 reliable?
The price and inventory of S70GL02GT12FHBV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70GL02GT12FHBV23 is usually 5 days.
3.What payment methods are accepted for S70GL02GT12FHBV23?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70GL02GT12FHBV23 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70GL02GT12FHBV23?
S70GL02GT12FHBV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70GL02GT12FHBV23 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70GL02GT12FHBV23?
For technical support, including S70GL02GT12FHBV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70GL02GT12FHBV23 requirements.
6.How does Aetrix verify that S70GL02GT12FHBV23 is sourced from the original manufacturer or authorized distributors?
All S70GL02GT12FHBV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70GL02GT12FHBV23 meets industry standards.
7.What is the process for return or replacement of S70GL02GT12FHBV23?
All S70GL02GT12FHBV23 units undergo pre-shipment inspection (PSI). If there is an issue with S70GL02GT12FHBV23, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70GL02GT12FHBV23 part is unused and in its original packaging.
Return procedure for S70GL02GT12FHBV23:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S70GL02GT12FHBV23 Tags
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