Infineon Technologies S70GL02GT12FHIV10
- Part No.:
- S70GL02GT12FHIV10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S70GL02GT12FHIV10.pdf
- Description:
- IC FLASH 2GBIT PARALLEL 64FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:151
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Product details
Overview
S70GL02GT12FHIV10 from Infineon is a 2 Gb (256 MB) parallel NOR flash memory IC built on 45 nm MIRRORBIT™ process, featuring 110 ns random access time, 20 ns page access time, and 512-byte programming buffer. It integrates two 1024 Mb S29GL01GT dies in a single 64-ball fortified-BGA package and supports industrial (–40°C to +85°C) and automotive AEC-Q100 grade 3 operation for embedded boot code storage.
For engineers reviewing the S70GL02GT12FHIV10 datasheet, S70GL02GT12FHIV10 pinout, S70GL02GT12FHIV10 application, or S70GL02GT12FHIV10 equivalent, key selection criteria include uniform 128-KB sector erase architecture, dual-die stack configuration, VIO range of 1.65 V to VCC, OTP array with two lockable regions, and hardware write protection via WP#.
Technical Context
This device implements a dual-die stacked architecture where two S29GL01GT dies share common control signals (CE#, OE#, WE#, RY/BY#, RESET#) and operate as a unified 2 Gb memory space. Address lines A0–A26 support full 256 MB addressing with byte/word mode selection via BYTE#.
It uses Common Flash Interface (CFI) for standardized identification and supports three status monitoring methods: Status Register polling, data polling, and open-drain RY/BY# output. Sector protection includes volatile/non-volatile ASP and dedicated WP#-controlled lock on the highest 128-KB sector.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gb (256 MB), realized as dual 1024 Mb die stack for seamless address continuity |
| Access Time | 110 ns random access time - determines minimum read cycle duration in CPU bus interface |
| Page Access Time | 20 ns - enables fast burst reads from internal 16-word page buffer |
| Programming Buffer | 512 bytes - allows single-command multi-word writes, reducing effective program time vs. byte-by-byte |
| Sector Size & Count | Uniform 128 KB sectors × 2048 - simplifies firmware partitioning and OTA update management |
| Endurance & Retention | 100,000 program-erase cycles / 20-year data retention - validated for long-life embedded control applications |
| Supply Range | VCC = 2.7 V to 3.6 V; VIO = 1.65 V to VCC - supports mixed-voltage host interfaces without level shifters |
Pinout & Package
Package: 64-ball LSH fortified BGA, 13 mm × 11 mm, RoHS-compliant, with thermal pad (VSSQ) and special handling requirements (no ultrasonic cleaning, max 150°C exposure).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ0–DQ15 | Data I/O (×16 mode) | Bidirectional data bus; DQ15/A-1 serves as LSB address in byte mode when BYTE# = VIL |
| A0–A26 | Address Inputs | 27-bit address bus supporting full 256 MB linear addressing (A26 enables top 128 MB) |
| CE#, OE#, WE# | Control Enables | Standard parallel flash control trio; CE# selects device, OE# enables output drivers, WE# initiates write |
| RY/BY# | Open-drain Ready/Busy | Active-low during embedded algorithms; high-impedance when ready - requires external pull-up, supports wired-OR multi-device sync |
| WP#, BYTE#, RESET# | Function Control | WP# locks top 128 KB sector; BYTE# configures ×8/×16 bus width; RESET# forces hardware reset to standby state |
| VCC, VIO, VSS, VSSQ | Power & Ground | VCC powers core logic; VIO sets I/O voltage domain; VSS/VSSQ are separate analog/digital grounds for noise isolation |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die stacked architecture | Two S29GL01GT dies in one package deliver 2 Gb density while maintaining pin compatibility with 1 Gb variants |
| 512-byte programming buffer | Enables up to 256-word buffered writes, cutting typical firmware update time by >70% vs. unbuffered programming |
| Advanced Sector Protection (ASP) | Independent volatile/non-volatile locking per sector plus WP#-hardened top-sector protection for secure boot code |
| Common Flash Interface (CFI) | Standardized ID and parameter query mechanism enabling OS/driver auto-detection without vendor-specific code |
| OTP array with two lockable regions | 1024-byte one-time-programmable area segmented into two independently lockable blocks for secure key or calibration storage |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot loader, real-time OS kernel, and GUI assets in digital dashboard systems requiring AEC-Q100 compliance. IC Role / Device Role / Timing Role: Non-volatile code storage with deterministic 110 ns read latency for hard real-time instruction fetch. Use Value: 20-year data retention and 100K-cycle endurance ensure reliability over vehicle lifetime without field updates. | Use Scenario: Holding firmware, configuration tables, and safety-critical logic in programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: Parallel NOR flash providing direct XIP (eXecute-In-Place) capability for deterministic interrupt response. Use Value: Uniform 128 KB sectors simplify firmware versioning and allow atomic sector-level updates without runtime corruption risk. |
| Medical Imaging Boot Memory | Avionics Data Logger |
Use Scenario: Hosting secure boot ROM and diagnostic firmware in MRI/CT scanner mainboards operating in extended temperature environments. IC Role / Device Role / Timing Role: High-reliability code storage with hardware write protection (WP#) preventing accidental overwrite during power transients. Use Value: Industrial Plus grade (–40°C to +105°C) and 45 nm process ensure stable operation under thermal stress in enclosed chassis. | Use Scenario: Recording flight parameters and system health logs in black box recorders where data integrity must survive crash conditions. IC Role / Device Role / Timing Role: Non-volatile storage with CFI support enabling automatic driver initialization across avionics platforms. Use Value: Dual-die redundancy design improves fault tolerance; OTP regions store cryptographic keys for log authentication. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT12FHIV10 | Single-die 1 Gb variant; identical pinout, timing, and feature set except half capacity | Suitable where 128 MB suffices and board layout re-use is prioritized over density | Select when cost sensitivity outweighs need for 2 Gb density and dual-die thermal/power trade-offs are undesirable |
| S70GL02GT11FHIV10 | Same dual-die 2 Gb device but with 120 ns random access time (vs. 110 ns) and industrial-only temp grade (–40°C to +85°C) | Lacks Automotive AEC-Q100 grade 2/3 qualification; lower performance ceiling for high-speed bus interfaces | Choose for cost-optimized industrial designs where 10 ns slower access is acceptable and automotive qualification is unnecessary |
Compared with S29GL01GT12FHIV10 and S70GL02GT11FHIV10, the S70GL02GT12FHIV10 uniquely delivers automotive-grade 2 Gb density with fastest-in-class 110 ns access, making it optimal for next-generation ADAS and cockpit ECUs requiring both safety certification and high throughput.
Availability
S70GL02GT12FHIV10 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging systems, and avionics data loggers requiring stable component supply across extended product lifecycles.
Supply support for S70GL02GT12FHIV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for mission-critical applications.
The GL-T series targets high-reliability embedded systems needing deterministic parallel NOR flash with AEC-Q100 qualification, extended temperature operation, and robust data integrity features like ASP and OTP.
FAQ
What is the function of the RY/BY# pin, and how must it be interfaced?
RY/BY# is an open-drain ready/busy indicator that pulls low during active program/erase operations and floats high-impedance when idle. It requires an external pull-up resistor (typically 4.7 kΩ to VIO) to detect the ready state. Multiple devices can share a single RY/BY# line for synchronized status monitoring in multi-chip configurations.
How does the BYTE# pin affect data bus configuration and address mapping?
When BYTE# is driven low, the device operates in ×8 mode: DQ7–DQ0 become active data lines, and DQ15/A-1 functions as the LSB address input (A0). In ×16 mode (BYTE# = high), DQ15–DQ0 serve as the full data bus, and all 16 bits transfer simultaneously. This dual-mode flexibility supports legacy 8-bit microcontrollers and modern 16-bit bus architectures.
Can the WP# pin protect sectors other than the highest 128 KB?
No - WP# exclusively protects the highest-address 128 KB sector (SA2047). Other sectors require software-controlled Advanced Sector Protection (ASP) using command sequences written to the command register. ASP supports both volatile (power-loss reset) and non-volatile (persistent) locking per sector, independent of WP# state.
What is the purpose of the OTP array, and how is it secured?
The 1024-byte OTP array contains two independently lockable regions used for storing immutable data such as cryptographic keys, calibration coefficients, or device serial numbers. Each region is locked permanently via dedicated CFI commands; once locked, its contents cannot be erased or rewritten, ensuring tamper-resistant storage for security-critical parameters.
S70GL02GT12FHIV10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8, 128M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 120 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (11x13)
S70GL02GT12FHIV10 FAQ
1.How can I place an order for S70GL02GT12FHIV10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70GL02GT12FHIV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70GL02GT12FHIV10 reliable?
The price and inventory of S70GL02GT12FHIV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70GL02GT12FHIV10 is usually 5 days.
3.What payment methods are accepted for S70GL02GT12FHIV10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70GL02GT12FHIV10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70GL02GT12FHIV10?
S70GL02GT12FHIV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70GL02GT12FHIV10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70GL02GT12FHIV10?
For technical support, including S70GL02GT12FHIV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70GL02GT12FHIV10 requirements.
6.How does Aetrix verify that S70GL02GT12FHIV10 is sourced from the original manufacturer or authorized distributors?
All S70GL02GT12FHIV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70GL02GT12FHIV10 meets industry standards.
7.What is the process for return or replacement of S70GL02GT12FHIV10?
All S70GL02GT12FHIV10 units undergo pre-shipment inspection (PSI). If there is an issue with S70GL02GT12FHIV10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70GL02GT12FHIV10 part is unused and in its original packaging.
Return procedure for S70GL02GT12FHIV10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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