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Infineon Technologies S70GL02GT12FHIV13
- Part No.:
- S70GL02GT12FHIV13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S70GL02GT12FHIV13.pdf
- Description:
- IC FLASH 2GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,837
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Product details
Overview
S70GL02GT12FHIV13 from Infineon is a 2 Gb (256 MB) parallel NOR flash memory IC fabricated on 45-nm MIRRORBIT™ process, featuring 110 ns random access time, 20 ns page access time, and uniform 128-KB sectors (2048 total). It operates from a single 2.7–3.6 V supply with versatile I/O voltage (1.65–VCC), supports ×8/×16 data bus, and integrates a 512-byte programming buffer for accelerated write operations in embedded automotive and industrial control systems.
For engineers reviewing the S70GL02GT12FHIV13 datasheet, S70GL02GT12FHIV13 pinout, S70GL02GT12FHIV13 application, or S70GL02GT12FHIV13 equivalent, key selection criteria include industrial-plus temperature grade (–40°C to +105°C), AEC-Q100 Grade 2 qualification, fortified 64-ball LSH BGA package (13 mm × 11 mm), and dual-die stack architecture enabling high-density code storage with sector-level erase suspend/resume capability.
Technical Context
This device implements a dual-die stack of two S29GL01GT 1-Gb dies in a single package, sharing common control signals (CE#, OE#, WE#, RESET#) and using A26 as die select. Memory organization comprises 2048 uniform 128-KB sectors mapped across a 28-bit address space (A0–A26), with BYTE# configurable for byte/word mode operation and RY/BY# open-drain output supporting multi-device ready/busy arbitration.
It supports Common Flash Interface (CFI), advanced sector protection (volatile/non-volatile), and a dedicated 1024-byte OTP array with two lockable regions. Programming uses embedded algorithms with status register polling, data polling, and RY/BY# signaling - no external command sequencing logic required.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 2 Gb (256 MB), dual-die stack of two 1-Gb S29GL01GT dies |
| Access time | 110 ns random access, 20 ns page access - enables fast instruction fetch in boot ROM applications |
| Operating voltage | VCC = 2.7–3.6 V; VIO = 1.65–VCC - supports mixed-voltage host interfaces without level shifters |
| Temperature grade | Industrial Plus (–40°C to +105°C) and AEC-Q100 Grade 2 - qualified for under-hood automotive ECUs |
| Erase endurance | 100,000 program-erase cycles per sector - suitable for firmware update partitions |
| Data retention | 20 years at +85°C - ensures long-term reliability in sealed industrial modules |
| Package | 64-ball LSH fortified BGA, 13 mm × 11 mm - optimized for thermal dissipation and board-level reliability |
Pinout & Package
Package: 64-ball LSH fortified BGA (13 mm × 11 mm), RoHS-compliant, with enhanced mechanical robustness for automotive vibration environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ0–DQ14, DQ15/A-1 | Data I/O / LSB address in byte mode | 16-bit bidirectional data bus; DQ15 doubles as A-1 only when BYTE# = LOW - enables flexible bus-width configuration |
| A0–A26 | Address inputs | 27-bit address bus; A26 selects between stacked dies - critical for full 2-Gb addressing |
| CE#, OE#, WE# | Chip, Output, Write Enable controls | Standard parallel flash control interface - compatible with legacy memory controllers and FPGA glue logic |
| RY/BY# | Open-drain ready/busy indicator | Signals active programming/erase; requires external pull-up; supports wired-OR for multi-device synchronization |
| WP#, BYTE#, RESET# | Function control inputs | WP# protects top 128-KB sector; BYTE# configures ×8/×16 mode; RESET# forces hardware reset to standby state |
Key Features
| Feature | Design Value |
|---|---|
| 512-byte programming buffer | Enables burst programming of up to 512 bytes per command - reduces effective write time by >70% vs. byte-by-byte writes |
| Suspend/Resume for erase & program | Allows interrupting background operations to service high-priority reads - essential for real-time OS boot loaders |
| Advanced Sector Protection (ASP) | Independent volatile/non-volatile locking per sector - prevents accidental firmware corruption during field updates |
| Dedicated 1024-byte OTP array | Two lockable regions store immutable keys or calibration data - supports secure boot and device identity binding |
| Common Flash Interface (CFI) | Standardized query table at known address - enables automatic driver detection and configuration in Linux/U-Boot environments |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated engine maps and diagnostic firmware in an AEC-Q100 Grade 2 qualified module operating under hood temperatures up to +105°C. IC Role / Device Role / Timing Role: Non-volatile code storage with deterministic 110 ns read latency and sector-erase suspend capability during runtime diagnostics. Use Value: Ensures firmware integrity over 20-year vehicle lifetime and supports over-the-air (OTA) update partitioning via 128-KB uniform sectors. | Use Scenario: Holding ladder logic firmware and I/O configuration tables in a DIN-rail mounted programmable logic controller exposed to factory floor vibration and wide ambient swings. IC Role / Device Role / Timing Role: High-reliability parallel boot memory interfaced directly to ARM Cortex-M7 microcontroller with no external wait-state logic. Use Value: Fortified BGA package withstands mechanical stress; 100,000 erase cycles support frequent firmware revisions in production environments. |
| Medical Imaging System Boot ROM | Avionics Data Logger |
Use Scenario: Storing certified boot loader and safety-critical initialization routines in Class II medical imaging equipment requiring traceable 20-year data retention. IC Role / Device Role / Timing Role: Secure, tamper-resistant code execution memory with OTP region for cryptographic key storage and ASP for bootloader lock. Use Value: CFI compliance simplifies FDA audit documentation; non-volatile sector protection prevents unauthorized runtime modification. | Use Scenario: Recording flight parameter snapshots and fault logs in DO-160G-compliant airborne data acquisition units operating at –40°C to +85°C. IC Role / Device Role / Timing Role: High-endurance logging memory supporting cyclic overwrite of 128-KB sectors with guaranteed 100K cycle life. Use Value: RY/BY# open-drain output enables synchronized log commit across multiple sensor nodes; low 400 µA standby current extends battery backup duration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT12FHIV10 | Single-die 1 Gb version, identical timing and package but half capacity; no A26 die-select functionality | Used where firmware size < 128 MB and cost sensitivity outweighs future scalability needs | Select when system memory map does not require >1 Gb contiguous address space or dual-die management logic |
| MX29GL256FHT2I-90G | Micron 256 Mb device; 90 ns access time, 48-ball TSOP package; lacks AEC-Q100 qualification and OTP array | Targeted at cost-sensitive industrial HMI panels with lower reliability requirements | Choose only for non-automotive, non-safety-critical designs where footprint and qualification are secondary |
Compared with S29GL01GT12FHIV10, the S70GL02GT12FHIV13 delivers double density with unified addressing via A26, while MX29GL256FHT2I-90G offers lower cost and smaller footprint but sacrifices automotive qualification, endurance, and security features like OTP and ASP.
Availability
S70GL02GT12FHIV13 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware upgrades, and avionics data logger production requiring stable component supply across extended temperature and lifecycle conditions.
Supply support for S70GL02GT12FHIV13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions for mission-critical systems.
The GL-T series targets automotive and industrial applications demanding AEC-Q100 qualification, extended temperature operation, and long-term data integrity - designed specifically for code storage in safety-aware embedded platforms.
FAQ
What is the function of the A26 pin on S70GL02GT12FHIV13?
A26 serves as the die-select signal in this dual-die stack configuration. When A26 = HIGH, the upper 1-Gb die (higher address space) is accessed; when LOW, the lower 1-Gb die is selected. This enables seamless 2-Gb addressing without external multiplexing logic and is essential for correct memory mapping across the full 28-bit address range.
Does S70GL02GT12FHIV13 support both ×8 and ×16 data bus widths?
Yes, it supports both configurations via the BYTE# input. With BYTE# = LOW, DQ7–DQ0 are active and DQ15 functions as A-1 for byte-mode addressing. With BYTE# = HIGH, all DQ0–DQ15 operate as a 16-bit data bus. This flexibility allows direct interface to 8-bit or 16-bit microcontrollers without external data-width conversion circuitry.
How is write protection implemented on S70GL02GT12FHIV13?
Write protection is implemented through two independent mechanisms: WP# pin hardware protection for the highest 128-KB sector, and Advanced Sector Protection (ASP) software-controlled locking for any sector. WP# is active-low and has an internal pull-up; ASP supports both volatile (power-cycle reset) and non-volatile (permanent until unlocked) modes, configurable via command sequences defined in the datasheet.
Is the RY/BY# pin compatible with standard open-drain bus wiring?
Yes, RY/BY# is an open-drain output requiring an external pull-up resistor (typically 4.7 kΩ to VIO). Multiple S70GL02GT12FHIV13 devices can have their RY/BY# pins tied together to form a wired-OR "all-ready" signal - the bus goes HIGH-Z only when every device completes its operation, enabling efficient multi-chip programming and erase coordination in dense memory subsystems.
S70GL02GT12FHIV13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8, 128M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 120 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (11x13)
S70GL02GT12FHIV13 FAQ
1.How can I place an order for S70GL02GT12FHIV13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70GL02GT12FHIV13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70GL02GT12FHIV13 reliable?
The price and inventory of S70GL02GT12FHIV13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70GL02GT12FHIV13 is usually 5 days.
3.What payment methods are accepted for S70GL02GT12FHIV13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70GL02GT12FHIV13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70GL02GT12FHIV13?
S70GL02GT12FHIV13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70GL02GT12FHIV13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70GL02GT12FHIV13?
For technical support, including S70GL02GT12FHIV13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70GL02GT12FHIV13 requirements.
6.How does Aetrix verify that S70GL02GT12FHIV13 is sourced from the original manufacturer or authorized distributors?
All S70GL02GT12FHIV13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70GL02GT12FHIV13 meets industry standards.
7.What is the process for return or replacement of S70GL02GT12FHIV13?
All S70GL02GT12FHIV13 units undergo pre-shipment inspection (PSI). If there is an issue with S70GL02GT12FHIV13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70GL02GT12FHIV13 part is unused and in its original packaging.
Return procedure for S70GL02GT12FHIV13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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