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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S70GL02GT12FHIV20

Name: S70GL02GT12FHIV20
Brand: Infineon Technologies
SKU: S70GL02GT12FHIV20
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S70GL02GT12FHIV20

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S70GL02GT12FHIV20.pdf

Description:: IC FLASH 2GBIT PARALLEL 64FBGA

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Product details

Overview

S70GL02GT12FHIV20 from Infineon is a 2 Gb (256 MB) parallel NOR flash memory IC built on 45-nm MIRRORBIT™ process, featuring 110 ns random access time, 20 ns page access time, and 512-byte programming buffer. It integrates two 1-Gb S29GL01GT dies in a single 64-ball fortified-BGA package and supports industrial (–40°C to +85°C) and automotive AEC-Q100 grade 3 operation for embedded boot code storage.

For engineers reviewing the S70GL02GT12FHIV20 datasheet, S70GL02GT12FHIV20 pinout, S70GL02GT12FHIV20 application, or S70GL02GT12FHIV20 equivalent, key selection criteria include uniform 128-KB sector erase architecture, dual-die stack density, VIO range of 1.65 V to VCC, OTP array with two lockable regions, and hardware write protection via WP# for the highest-address sector.

Technical Context

This device implements a dual-die stacked architecture where two independent S29GL01GT 1-Gb dies share common control signals (CE#, OE#, WE#, RESET#, RY/BY#, WP#, BYTE#) and operate as a unified 2-Gb address space. Address lines A0–A25 support full 128-MB ×16 addressing, while A26 selects between die banks.

The memory uses MIRRORBIT™ charge-trap technology enabling 100,000 program-erase cycles and 20-year data retention. Embedded algorithms handle sector erase and buffer programming autonomously, with status reported via RY/BY# open-drain output, status register, or data polling - all compliant with Common Flash Interface (CFI).

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	2 Gb (256 MB), organized as 2048 uniform 128-KB sectors
Access Time	110 ns random access (tACC), 20 ns page access (tPACC) at VIO = VCC = 3.0 V
Programming Buffer	512-byte buffer enables single-command multi-word programming, reducing effective write latency
Operating Voltage	VCC = 2.7–3.6 V (core & I/O); VIO = 1.65–VCC (flexible interface voltage scaling)
Endurance & Retention	100,000 program/erase cycles; 20-year data retention at +85°C
Temperature Grade	Industrial Plus (–40°C to +105°C) and Automotive AEC-Q100 Grade 2 qualified
OTP Array	1024-byte one-time-programmable region with two independently lockable sectors

Pinout & Package

Package: 64-ball LSH fortified BGA, 13 mm × 11 mm, RoHS-compliant, with thermal pad (VSSQ) and reserved/NC/DNU balls per Infineon specification.

Pin/Terminal	Circuit Role	Design Meaning
DQ0–DQ14, DQ15/A-1	Data I/O / LSB address in byte mode	16-bit bidirectional data bus; DQ15 doubles as A-1 in BYTE# = low configuration
A0–A25	Address inputs	26-bit address bus supporting full 128-MB ×16 memory map; A26 internal die select
CE#, OE#, WE#	Chip, Output, Write Enable controls	Standard parallel NOR control signals; CE# active-low chip select enables device operation
RY/BY#	Open-drain ready/busy status	Active-low during embedded operations; high-impedance when ready - requires external pull-up
WP#	Hardware write protect	Active-low protection for highest 128-KB sector, overriding ASP settings
BYTE#	Data bus width selector	Low = ×8 mode (DQ7–DQ0 active); High = ×16 mode (DQ15–DQ0 active)
RESET#	Hardware reset input	Active-low signal that forces device into standby state, clearing pending commands
VCC, VIO, VSS, VSSQ	Power and ground supplies	VCC powers core logic; VIO sets I/O voltage level; VSSQ is dedicated flash array ground

Key Features

Feature	Design Value
Dual-die stacked architecture	Two 1-Gb S29GL01GT dies in single BGA package deliver 2-Gb density without board area increase
Uniform 128-KB sector erase	2048 identical sectors simplify firmware partitioning and enable deterministic erase timing (245 KBps)
Versatile I/O voltage (VIO)	VIO range 1.65 V to VCC allows direct interfacing with 1.8 V, 2.5 V, or 3.3 V host controllers
Advanced sector protection (ASP)	Volatile and non-volatile locking per sector prevents accidental program/erase during power transitions
Common Flash Interface (CFI)	Standardized query table enables automatic driver detection and configuration in bootloader environments

Applications

Automotive Instrument Cluster

Industrial PLC Firmware Storage

Use Scenario: Storing calibrated gauge graphics, boot firmware, and over-the-air update images in digital dashboards.

IC Role / Device Role / Timing Role: Parallel NOR flash providing XIP-capable boot code execution and secure firmware storage.

Use Value: AEC-Q100 Grade 2 qualification ensures reliability at +105°C; WP# and ASP prevent corruption during ignition cycling.

Use Scenario: Holding real-time OS kernel, ladder logic programs, and configuration data in programmable logic controllers.

IC Role / Device Role / Timing Role: Nonvolatile memory mapped directly to processor address bus for deterministic boot and runtime read access.

Use Value: 110 ns random access enables sub-µs instruction fetch; 20-year retention guarantees long-term field deployment without refresh.

Telecom Base Station BIOS

Medical Imaging System Boot ROM

Use Scenario: Hosting BIOS, FPGA configuration bitstreams, and calibration tables in 5G radio units operating in temperature-controlled enclosures.

IC Role / Device Role / Timing Role: High-density parallel flash serving as primary boot device for ARM-based baseband processors.

Use Value: 512-byte buffer programming accelerates field firmware updates; CFI support simplifies cross-platform BIOS porting.

Use Scenario: Storing certified boot loader, DICOM protocol stack, and safety-critical initialization routines in MRI and CT scanner mainboards.

IC Role / Device Role / Timing Role: Secure, tamper-resistant firmware repository with hardware-level write protection for regulatory compliance.

Use Value: OTP array with lockable regions stores cryptographic keys; WP# ensures highest sector (containing boot vector) remains immutable.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL01GT12FHIV20	Single-die 1-Gb version; identical 45-nm MIRRORBIT™ process, same 64-ball BGA footprint but half capacity	Lacks dual-die stacking; unsuitable for designs requiring >1 Gb in same package area	Select when board layout must retain pin compatibility but density requirement is ≤1 Gb
MX29GL256FHT2I-90G	256-MB (2-Gb) Macronix parallel NOR; 90 ns tACC, no OTP array, no ASP, JEDEC-standard BGA-64	Lower endurance (100K vs 100K), no AEC-Q100 qualification, lacks CFI query support	Choose for cost-sensitive industrial use where automotive qualification and advanced protection are not required

Compared with S29GL01GT12FHIV20, this part doubles density via dual-die stacking while retaining identical timing and package; versus MX29GL256FHT2I-90G, it adds automotive qualification, OTP security, and CFI compatibility at higher cost and slightly slower tACC.

Availability

S70GL02GT12FHIV20 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, telecom base station BIOS, and medical imaging system boot ROM requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S70GL02GT12FHIV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and nonvolatile memory solutions for mission-critical systems.

The GL-T series targets high-reliability embedded applications demanding AEC-Q100 qualification, deterministic timing, and long-term data integrity - especially in automotive, industrial automation, and communications infrastructure.

FAQ

What is the function of the RY/BY# pin?

RY/BY# is an open-drain ready/busy output indicating device status during embedded operations. When driven low, the device is executing program or erase; when high-impedance (requiring external pull-up), it is ready for read or new commands. Multiple devices can share this line for synchronized status monitoring.

Does S70GL02GT12FHIV20 support both ×8 and ×16 data bus widths?

Yes, via the BYTE# input: when low, DQ7–DQ0 are active for ×8 mode with DQ15/A-1 functioning as LSB address; when high, DQ15–DQ0 operate as a full ×16 bus. This flexibility allows seamless integration with 8-bit or 16-bit host memory controllers without redesign.

How does the WP# pin interact with Advanced Sector Protection (ASP)?

WP# provides hardware-level override protection for the highest 128-KB sector only, regardless of ASP volatile/non-volatile settings. If WP# is asserted low, that sector is locked against program/erase even if ASP bits are cleared - ensuring boot vector integrity under all conditions.

Is the OTP array accessible after factory programming?

Yes, the 1024-byte OTP array is readable at all times, but each 512-byte region can be permanently locked once programmed. Locking is irreversible and prevents further writes to that region, enabling secure storage of calibration data or cryptographic keys without risk of overwrite.

S70GL02GT12FHIV20 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-T

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 2Gbit

Memory Organization:: 256M x 8, 128M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: -

Access Time:: 120 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (11x13)

S70GL02GT12FHIV20 FAQ

1.How can I place an order for S70GL02GT12FHIV20 through Aetrix?

Please submit a Request for Quotation (RFQ) for S70GL02GT12FHIV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S70GL02GT12FHIV20 reliable?

The price and inventory of S70GL02GT12FHIV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70GL02GT12FHIV20 is usually 5 days.

3.What payment methods are accepted for S70GL02GT12FHIV20?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70GL02GT12FHIV20 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S70GL02GT12FHIV20?

S70GL02GT12FHIV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S70GL02GT12FHIV20 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S70GL02GT12FHIV20?

For technical support, including S70GL02GT12FHIV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70GL02GT12FHIV20 requirements.

6.How does Aetrix verify that S70GL02GT12FHIV20 is sourced from the original manufacturer or authorized distributors?

All S70GL02GT12FHIV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70GL02GT12FHIV20 meets industry standards.

7.What is the process for return or replacement of S70GL02GT12FHIV20?

All S70GL02GT12FHIV20 units undergo pre-shipment inspection (PSI). If there is an issue with S70GL02GT12FHIV20, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S70GL02GT12FHIV20 part is unused and in its original packaging.

Return procedure for S70GL02GT12FHIV20:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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