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Infineon Technologies S70GL02GT12FHVV20
- Part No.:
- S70GL02GT12FHVV20
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S70GL02GT12FHVV20.pdf
- Description:
- IC FLASH 2GBIT CFI 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,206
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Product details
Overview
S70GL02GT12FHVV20 from Infineon is a 2 Gb (256 MB) parallel NOR flash memory IC using 45 nm MIRRORBIT™ technology, configured as dual-die stack of two S29GL01GT dies in a 64-ball fortified BGA package. It delivers 110 ns random access time, 20 ns page access time, and supports ×8/×16 data bus operation with 512-byte programming buffer-enabling high-speed firmware storage in industrial control panels requiring deterministic boot code execution.
For engineers reviewing the S70GL02GT12FHVV20 datasheet, S70GL02GT12FHVV20 pinout, S70GL02GT12FHVV20 application, or S70GL02GT12FHVV20 equivalent, key selection criteria include uniform 128-KB sector erase architecture, AEC-Q100 Grade 2 qualification (–40°C to +105°C), 100,000 program-erase cycles, and dual-voltage I/O support (1.65 V to VCC).
Technical Context
This device implements a parallel interface NOR flash architecture with dual-die stacking to achieve 2 Gb density while maintaining pin compatibility with single-die S29GL01GT. Its embedded algorithms support suspend/resume during program and erase operations, and status reporting via RY/BY# open-drain output, Status Register, and data polling.
The memory map comprises 2048 uniform 128-KB sectors (SA00–SA2047), each individually protected via Advanced Sector Protection (ASP). The CFI-compliant interface enables host system auto-configuration, and BYTE# pin selects between byte (DQ7–DQ0 active, DQ15/A1 as LSB address) and word (DQ15–DQ0 active) modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 2 Gb (256 MB), realized as dual 1024 Mb die stack for footprint efficiency without interface change |
| Access time | 110 ns random access (tACC), enabling sub-10 MHz synchronous read timing in legacy microcontroller buses |
| Page access | 20 ns (tPACC), supporting burst reads from internal 16-word/32-byte read buffer |
| Programming buffer | 512 bytes, allowing single-command write of up to 256 words-reducing host CPU overhead vs. byte-by-byte writes |
| Erase granularity | Uniform 128-KB sectors (2048 total), simplifying firmware partitioning and field update management |
| Endurance & retention | 100,000 program-erase cycles and 20-year data retention at +85°C-validated for long-life industrial deployments |
| Operating voltage | VCC = 2.7–3.6 V (core + I/O), VIO = 1.65–VCC (flexible logic interfacing to mixed-voltage SoCs) |
Pinout & Package
Package: 64-ball LSH fortified BGA, 13 mm × 11 mm, RoHS-compliant, with thermal pad (VSSQ) and reinforced solder joints for automotive-grade reliability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ0–DQ15 | Data I/O (×16 mode) / DQ0–DQ7 + A1 (×8 mode) | Bidirectional data bus; A1 repurposed as LSB address in byte mode-enables shared PCB layout across configurations |
| A0–A26 | Address inputs | 27-bit addressing supports full 2 Gb linear map; A26 distinguishes upper/lower die in stacked configuration |
| CE#, OE#, WE# | Chip, Output, Write Enable controls | Standard parallel flash control signals; CE# gating enables multi-device bank selection without address decoding |
| RY/BY# | Open-drain Ready/Busy status | Active-low during embedded algorithms; wired-OR capable-allows system-level busy monitoring across multiple flashes |
| WP#, BYTE#, RESET# | Function control inputs | WP# protects top 128-KB sector independently of ASP; BYTE# configures bus width dynamically; RESET# forces hardware reset to known state |
| VCC, VIO, VSS, VSSQ | Power and ground terminals | Dual supply domains isolate core logic (VCC) from I/O (VIO); VSSQ is dedicated flash array ground-reduces noise coupling during high-current erase |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die stacked architecture | Two 1024 Mb S29GL01GT dies in single 64-ball BGA-delivers 2 Gb density without increasing board area or signal count |
| 512-byte programming buffer | Enables single-command write of up to 512 bytes, cutting effective programming time by >70% vs. byte-mode writes in firmware update scenarios |
| Advanced Sector Protection (ASP) | Independent volatile/non-volatile lock per 128-KB sector-supports secure bootloader partitioning and field-upgrade isolation |
| OTP array | 1024-byte one-time-programmable region with two lockable sections-used for unique device identifiers or calibration data storage |
| AEC-Q100 Grade 2 qualification | Validated for –40°C to +105°C operation with 100,000-cycle endurance-meets functional safety requirements for engine control units |
Applications
| Industrial PLC Firmware Storage | Automotive Engine Control Unit (ECU) |
|---|---|
Use Scenario: Storing real-time control firmware and calibration tables in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Nonvolatile code storage with deterministic 110 ns read access-ensuring cycle-accurate instruction fetch for hard real-time motion control loops. Use Value: Uniform 128-KB sector erase allows atomic firmware updates without runtime interruption; ASP prevents accidental overwrite of critical safety routines. | Use Scenario: Holding boot code and emission control algorithms in gasoline/diesel engine ECUs operating under under-hood thermal stress. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified parallel NOR flash providing reliable startup code execution at +105°C ambient. Use Value: 20-year data retention and 100,000-cycle endurance ensure compliance with 15-year vehicle service life; OTP array stores unique VIN-linked calibration data. |
| Railway Signaling System BIOS | Medical Imaging Device Boot ROM |
Use Scenario: Storing fail-safe BIOS and diagnostic firmware in wayside signaling controllers certified to EN 5012x standards. IC Role / Device Role / Timing Role: High-reliability code storage with suspend/resume capability-allowing safe interruption of sector erase during emergency system reset. Use Value: RY/BY# open-drain output enables centralized busy monitoring across redundant flash banks; WP# hardware lock secures boot sector against corruption. | Use Scenario: Hosting boot firmware and FPGA configuration bitstreams in CT/MRI scanner mainboards requiring zero-failure startup. IC Role / Device Role / Timing Role: Parallel interface flash delivering sub-120 ns read latency for rapid system initialization after power-on. Use Value: 64-ball fortified BGA withstands thermal cycling in air-cooled chassis; CFI support enables automatic detection by UEFI-compatible bootloaders. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT12FHIV20 | Single-die 1 Gb version in identical 64-ball BGA; lacks A26 and dual-die address mapping | Suitable only for designs where 1 Gb density suffices and no dual-die stacking is required | Select when cost sensitivity outweighs density need and board layout must remain unchanged |
| MX29GL256FHTI-90G | 2 Gb Macronix parallel NOR; 90 ns tACC, no AEC-Q100 qualification, different CFI ID and command set | Not suitable for automotive AEC-Q100 Grade 2 systems; requires firmware driver rework | Consider only for industrial-only applications where qualification is not mandated and timing margin allows 90 ns access |
Compared with S29GL01GT12FHIV20, the S70GL02GT12FHVV20 doubles density within the same footprint and adds AEC-Q100 Grade 2 support; versus MX29GL256FHTI-90G, it provides guaranteed automotive qualification, tighter 110 ns timing, and Infineon's ASP/OTP feature set for secure firmware management.
Availability
S70GL02GT12FHVV20 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ECU boot code, railway signaling BIOS, and medical imaging device boot ROM requiring stable component supply across extended product lifecycles.
Supply support for S70GL02GT12FHVV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
The GL-T series targets high-reliability embedded systems requiring deterministic parallel NOR flash performance, specifically engineered for automotive, industrial control, and transportation infrastructure applications demanding AEC-Q100 qualification and long-term data integrity.
FAQ
What is the function of the BYTE# pin on S70GL02GT12FHVV20?
The BYTE# pin selects data bus width: at VIL, the device operates in byte mode (DQ7–DQ0 active, DQ15/A1 becomes LSB address); at VIH, it operates in word mode (DQ15–DQ0 active). This allows flexible interface design with 8-bit or 16-bit microcontrollers without changing PCB layout-critical for platform reuse across product tiers.
Does S70GL02GT12FHVV20 support hardware write protection for sectors other than the top 128 KB?
Yes-via Advanced Sector Protection (ASP), which provides both volatile (power-cycle reset) and non-volatile (permanent) lock per 128-KB sector. WP# only protects the highest-address sector; ASP enables independent protection of any sector, including bootloader, configuration, and application partitions-essential for secure firmware updates.
How does the dual-die stack affect address mapping and command execution?
A26 acts as die select: low addresses (A26 = 0) access the lower 1 Gb die; high addresses (A26 = 1) access the upper 1 Gb die. All commands-including program, erase, and read-are executed per-die; the device presents a seamless 2 Gb linear address space to the host, eliminating software complexity in managing stacked dies.
What is the purpose of the RFU and DNU balls in the 64-ball BGA package?
Balls C1, D1, E1, G1 are Reserved for Future Use (RFU)-unconnected internally and must remain un-routed on PCB to preserve compatibility with future revisions. Ball E1 is Do Not Use (DNU), connected internally to a test signal; it may be tied to VSS via series resistor but must never be used for system signal routing to avoid interference with internal test functions.
S70GL02GT12FHVV20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- CFI
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 120 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S70GL02GT12FHVV20 FAQ
1.How can I place an order for S70GL02GT12FHVV20 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70GL02GT12FHVV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70GL02GT12FHVV20 reliable?
The price and inventory of S70GL02GT12FHVV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70GL02GT12FHVV20 is usually 5 days.
3.What payment methods are accepted for S70GL02GT12FHVV20?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70GL02GT12FHVV20 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70GL02GT12FHVV20?
S70GL02GT12FHVV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70GL02GT12FHVV20 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70GL02GT12FHVV20?
For technical support, including S70GL02GT12FHVV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70GL02GT12FHVV20 requirements.
6.How does Aetrix verify that S70GL02GT12FHVV20 is sourced from the original manufacturer or authorized distributors?
All S70GL02GT12FHVV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70GL02GT12FHVV20 meets industry standards.
7.What is the process for return or replacement of S70GL02GT12FHVV20?
All S70GL02GT12FHVV20 units undergo pre-shipment inspection (PSI). If there is an issue with S70GL02GT12FHVV20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70GL02GT12FHVV20 part is unused and in its original packaging.
Return procedure for S70GL02GT12FHVV20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S70GL02GT12FHVV20 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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