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Infineon Technologies S70GL02GT12FHVV23
- Part No.:
- S70GL02GT12FHVV23
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S70GL02GT12FHVV23.pdf
- Description:
- IC FLASH 2GBIT CFI 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,416
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Product details
Overview
S70GL02GT12FHVV23 from Infineon is a 2 Gb (256 MB) parallel NOR flash memory IC using 45 nm MIRRORBIT™ technology, configured as dual-die stack of two S29GL01GT dies in a 64-ball fortified-BGA package. It delivers 110 ns random access time, 20 ns page access time, and supports ×8/×16 data bus operation with 512-byte programming buffer for embedded boot code storage in industrial controllers.
For engineers reviewing the S70GL02GT12FHVV23 datasheet, S70GL02GT12FHVV23 pinout, S70GL02GT12FHVV23 application, or S70GL02GT12FHVV23 equivalent, key selection criteria include uniform 128-KB sector erase architecture, AEC-Q100 Grade 2 automotive qualification (–40°C to +105°C), 100,000 program-erase cycles, and versatile I/O voltage range (1.65 V to VCC).
Technical Context
This device implements a dual-die stacked architecture where two 1024 Mb S29GL01GT dies share common control signals (CE#, OE#, WE#, RESET#) and address/data buses, enabling unified 2-Gb addressing with internal die selection logic. The memory map comprises 2048 uniform 128-KB sectors mapped across 27-bit address space (A0–A26).
It supports three status monitoring methods-Status Register polling, data polling, and open-drain RY/BY# output-and integrates Advanced Sector Protection (ASP) with volatile/non-volatile locking per sector plus a dedicated 1024-byte OTP array with two lockable regions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gb (256 MB) total capacity, realized as dual 1024 Mb dies in single package |
| Access Time | 110 ns random access time at 3.0 V, enabling direct execution (XIP) from flash in real-time systems |
| Page Access | 20 ns page access time supports high-throughput boot code loading into processor cache |
| Sector Size | Uniform 128 KB sectors (2048 total), simplifying firmware update partitioning and wear leveling |
| Endurance | 100,000 program-erase cycles per sector ensures reliability in field-upgradable embedded firmware |
| Data Retention | 20-year data retention at +85°C, validated for long-lifecycle industrial deployments |
| Operating Temp | Industrial Plus grade: –40°C to +105°C, qualified per AEC-Q100 Grade 2 for under-hood automotive use |
Pinout & Package
Package: 64-ball LSH fortified BGA, 13 mm × 11 mm, RoHS-compliant, with thermal pad exposed on bottom side.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ0–DQ15 | Data I/O bus | 16-bit bidirectional data path; DQ15 doubles as A-1 LSB address in byte mode when BYTE# = VIL |
| A0–A26 | Address inputs | 27-bit address bus supporting full 2-Gb linear addressing; A26 selects upper die in dual-die stack |
| CE#, OE#, WE# | Control enables | Standard parallel flash control: CE# enables chip, OE# enables output drivers, WE# initiates write |
| RY/BY# | Open-drain status | Active-low busy signal; requires external pull-up; supports wired-OR multi-device ready detection |
| WP# | Hardware write protect | Protects highest 128-KB sector regardless of ASP settings; internal pull-up allows floating = unprotected |
| BYTE# | Bus width select | VIL = ×8 mode (DQ7–DQ0 active); VIH = ×16 mode (DQ15–DQ0 active) |
| VCC / VIO / VSS | Power supplies | VCC = 2.7–3.6 V core supply; VIO = 1.65–VCC I/O supply; separate VSS pins reduce noise coupling |
Key Features
| Feature | Design Value |
|---|---|
| 512-byte programming buffer | Enables single-command programming of up to 512 bytes, reducing host CPU overhead vs. byte-by-byte writes |
| Suspend/Resume capability | Allows read operations during background erase or program, critical for real-time interrupt handling |
| Advanced Sector Protection (ASP) | Per-sector volatile/non-volatile lock control prevents accidental firmware corruption during field updates |
| Common Flash Interface (CFI) | Standardized JEDEC-compliant query table enables OS/driver auto-detection without hard-coded parameters |
| Dedicated 1024-byte OTP array | Two lockable regions store immutable keys or calibration data, isolated from main array wear mechanisms |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated engine maps and diagnostic firmware in under-hood ECU modules. IC Role / Device Role / Timing Role: Non-volatile boot code and parameter storage with AEC-Q100 Grade 2 qualification. Use Value: 100,000-cycle endurance and 20-year data retention ensure firmware integrity over 15+ year vehicle lifetimes. | Use Scenario: Holding ladder logic programs and configuration data in modular programmable logic controllers. IC Role / Device Role / Timing Role: Parallel NOR flash for XIP-capable firmware execution with deterministic 110 ns access. Use Value: Uniform 128-KB sectors simplify field firmware patching without full reflash, minimizing downtime. |
| Medical Imaging System Boot ROM | Railway Signaling Controller Memory |
Use Scenario: Secure boot image storage for MRI/CT scanner mainboards requiring certified firmware integrity. IC Role / Device Role / Timing Role: CFI-compliant flash with OTP region for cryptographic key storage and secure boot validation. Use Value: Dual-die stacking provides redundancy margin; ASP and WP# prevent unauthorized runtime modification. | Use Scenario: Storing safety-critical interlocking logic in EN 5012x-certified railway signaling hardware. IC Role / Device Role / Timing Role: Industrial Plus temperature grade flash with RY/BY# support for fail-safe status monitoring. Use Value: Open-drain RY/BY# enables wired-OR readiness detection across redundant controller pairs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT12FHVV10 | Single-die 1 Gb version in same 64-ball BGA; lacks dual-die stacking and A26 address line | Lower density suitable for cost-sensitive designs without need for >1 Gb firmware storage | Select when firmware size < 128 MB and board layout must reuse same footprint |
| MX29GL256FHTI-90G | 2 Gb Macronix device; 90 ns random access (vs. 110 ns); no AEC-Q100 qualification | Higher speed but unqualified for automotive; lacks OTP array and ASP granularity | Choose for non-automotive industrial apps needing faster access and lower cost |
Compared with S29GL01GT12FHVV10, this part doubles density via dual-die stacking while retaining pin compatibility; versus MX29GL256FHTI-90G, it trades 20 ns slower access for automotive qualification, OTP security, and finer-grained sector protection.
Availability
S70GL02GT12FHVV23 is available at Aetrix Electronics and suitable for automotive ECUs, industrial PLCs, medical imaging systems, and railway signaling controllers requiring stable component supply across extended product lifecycles.
Supply support for S70GL02GT12FHVV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for mission-critical applications.
This device belongs to the GL-T series of high-reliability parallel NOR flash products, designed specifically for automotive and industrial applications demanding AEC-Q100 qualification, long data retention, and robust sector protection.
FAQ
What is the function of the BYTE# pin on S70GL02GT12FHVV23?
BYTE# selects data bus width: at VIL, the device operates in ×8 mode with DQ7–DQ0 active and DQ15 repurposed as A-1 address input; at VIH, it operates in ×16 mode with full DQ15–DQ0 data path. This allows flexible interface design with 8-bit or 16-bit host processors without external multiplexing logic.
Does S70GL02GT12FHVV23 support simultaneous read while program/erase?
Yes - it supports suspend/resume commands for both program and erase operations. When suspended, the device immediately responds to read commands on the current sector, enabling real-time interrupt service routines to fetch code or data without waiting for background operations to complete.
How is the dual-die architecture managed internally?
The device uses A26 as the top address bit to select between the two stacked 1024 Mb dies. Address bits A0–A25 access individual sectors within the selected die; CE#, OE#, and WE# are shared, ensuring transparent 2-Gb linear addressing to the host system without additional die-select logic.
What protection mechanisms prevent accidental firmware overwrite?
Three layers: hardware WP# pin locks the highest 128-KB sector; Advanced Sector Protection (ASP) allows per-sector volatile/non-volatile locking; and the dedicated 1024-byte OTP array provides immutable storage for keys or calibration data that cannot be altered after programming.
S70GL02GT12FHVV23 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- CFI
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 120 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S70GL02GT12FHVV23 FAQ
1.How can I place an order for S70GL02GT12FHVV23 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70GL02GT12FHVV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70GL02GT12FHVV23 reliable?
The price and inventory of S70GL02GT12FHVV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70GL02GT12FHVV23 is usually 5 days.
3.What payment methods are accepted for S70GL02GT12FHVV23?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70GL02GT12FHVV23 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70GL02GT12FHVV23?
S70GL02GT12FHVV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70GL02GT12FHVV23 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70GL02GT12FHVV23?
For technical support, including S70GL02GT12FHVV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70GL02GT12FHVV23 requirements.
6.How does Aetrix verify that S70GL02GT12FHVV23 is sourced from the original manufacturer or authorized distributors?
All S70GL02GT12FHVV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70GL02GT12FHVV23 meets industry standards.
7.What is the process for return or replacement of S70GL02GT12FHVV23?
All S70GL02GT12FHVV23 units undergo pre-shipment inspection (PSI). If there is an issue with S70GL02GT12FHVV23, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70GL02GT12FHVV23 part is unused and in its original packaging.
Return procedure for S70GL02GT12FHVV23:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S70GL02GT12FHVV23 Tags
-
M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
Microchip Technology
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24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
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