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Infineon Technologies S70KL1281DABHI020

Part No.:
S70KL1281DABHI020
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS70KL1281DABHI020.pdf
Description:
IC PSRAM 128MBIT PAR 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,063

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Product details

Overview

S70KL1281DABHI020 from Infineon Technologies (formerly Cypress) is a 128 Mb (16 MB) HyperRAM™ self-refresh DRAM with integrated refresh logic, operating as pseudo-static RAM (PSRAM) for seamless integration into memory-constrained embedded systems. It features an 8-bit DDR HyperBus interface, supports 1.8 V I/O with differential clock (CK/CK#), delivers up to 333 MBps throughput at 166 MHz, and uses a 24-ball FBGA package (5 mm × 5 mm). It is deployed in automotive instrument clusters requiring low-latency, high-bandwidth external memory with minimal pin count.

For engineers reviewing the S70KL1281DABHI020 datasheet, S70KL1281DABHI020 pinout, S70KL1281DABHI020 application, or S70KL1281DABHI020 equivalent, key selection criteria include DDR timing compliance, RWDS-based read/write strobe alignment, DCARS phase-shifted data capture, deep power-down current (20 µA at 1.8 V), and HyperBus command/address protocol compatibility with MCU HyperBus controllers such as those in Infineon's AURIX™ TC3xx series.

Technical Context

This device implements a dual-die stack of two 64 Mb HyperRAM dies in a single package, sharing common control and data signals while maintaining independent internal refresh management. Its HyperBus interface uses center-aligned command/address transfers and edge-aligned read data strobes via RWDS, with configurable initial latency (1× or 2×) signaled dynamically during CA phase.

The DDR architecture enables two 8-bit data transfers per clock cycle on DQ[7:0], supporting linear or wrapped burst lengths (16–128 bytes), selectable per transaction. RWDS serves three distinct roles: latency indicator during CA phase, source-synchronous read strobe during reads, and write mask during writes - all synchronized to a phase-shifted clock derived from CK for optimal data eye positioning.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 128 Mb (16 MB) - dual-die stacked architecture enabling higher capacity without increasing bus width or controller complexity
Data Bus Width 8-bit DDR (DQ[7:0]) - reduces PCB routing layers and signal integrity challenges versus parallel SRAM interfaces
Max Throughput 333 MBps at 166 MHz (1.8 V) - sufficient for real-time graphics buffering and firmware overlay in automotive HMI systems
Access Latency 36 ns tACC at 166 MHz - deterministic timing critical for time-sensitive display frame buffer access
Deep Power Down Current 20 µA at 1.8 V, 105 °C - enables ultra-low standby power in always-on vehicle subsystems
Interface Protocol HyperBus v2.0 - low-signal-count (12-pin), LV-CMOS-compatible interface with built-in refresh arbitration
Burst Configurability Wrapped (16/32/64/128 bytes) or linear - allows cache-line fill optimization and sequential DMA transfers in same system

Pinout & Package

Package: 24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/Terminal Circuit Role Design Meaning
CS# Chip Select Active-low enable for command/address/data transactions; deassertion terminates burst and triggers internal refresh arbitration
CK / CK# Differential Clock Input Source-synchronous timing reference for all DDR transfers; CK# enables jitter-resistant clock recovery in noisy automotive environments
RWDS Read/Write Data Strobe Bidirectional: indicates refresh latency during CA phase, acts as edge-aligned read strobe, and serves as byte-level write mask during DQ transfers
DQ[7:0] Data I/O Bus 8-bit double-data-rate bidirectional bus; carries command, address, and data; requires matched trace length for DDR timing closure
VCC / VCCQ Core & I/O Supply Separate 1.8 V supplies for core logic (VCC) and I/O buffers (VCCQ); enables mixed-voltage system integration with 3.3 V MCUs via level-shifting
RESET# Hardware Reset Asynchronous active-low reset that clears internal state and forces re-initialization of HyperBus interface and refresh controller

Key Features

Feature Design Value
Self-Refresh DRAM Architecture On-die refresh controller eliminates host CPU intervention, reducing software overhead and enabling true PSRAM behavior
DCARS Timing Support Phase-shifted RWDS generation aligns strobe edges within read data eye, relaxing setup/hold timing margins for high-speed DDR capture
Configurable Burst Type Per-transaction selection between wrapped (cache-line optimized) and linear (DMA-friendly) bursts enables runtime adaptation to workload
Low-Power Deep Power Down 20 µA standby current at 1.8 V allows >10-year battery-backed retention in telematics modules without external supervision
HyperBus v2.0 Compliance Standardized command set and timing model ensures interoperability across Infineon/AURIX, Renesas RH850, and NXP S32K HyperBus hosts

Applications

Automotive Digital Instrument Cluster Industrial HMI Display Controller

Use Scenario: Real-time rendering of vector-based gauges and animated UI elements at 60 Hz with zero frame drop.

IC Role / Device Role / Timing Role: External frame buffer memory interfaced directly to MCU's HyperBus controller; provides deterministic 36 ns access latency for pixel data fetch.

Use Value: Eliminates need for external SDRAM controller logic and refresh scheduling code, reducing BOM and firmware complexity.

Use Scenario: Buffering of high-resolution (1280×800) bitmap assets and font glyphs in factory-floor HMIs with intermittent power.

IC Role / Device Role / Timing Role: PSRAM replacement for legacy SRAM; leverages HyperBus's 12-pin interface to minimize PCB layer count in space-constrained panel designs.

Use Value: 20 µA deep power-down current extends backup capacitor hold-up time by 3.2× versus standard LPDDR2 solutions.

Automotive ADAS Camera Preprocessing Medical Imaging Edge Node

Use Scenario: Temporary storage of raw Bayer sensor frames before ISP pipeline processing in rear-view camera modules.

IC Role / Device Role / Timing Role: High-bandwidth streaming buffer; supports 333 MBps DDR reads/writes synchronized to MIPI CSI-2 frame triggers.

Use Value: Wrapped burst mode enables cache-line-aligned access to 16-byte aligned pixel blocks, improving DMA efficiency by 22% over linear-only alternatives.

Use Scenario: Local buffering of DICOM image tiles during wireless transmission from portable ultrasound probes.

IC Role / Device Role / Timing Role: Low-noise, low-power external memory co-located with ARM Cortex-M7 MCU; operates at 1.8 V to minimize EMI in sensitive analog front-end zones.

Use Value: Differential CK/CK# input rejects common-mode noise from adjacent RF circuits, ensuring reliable 166 MHz operation in Class B medical EMC environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PSRAM/HyperBus memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
S70KL1281DABHI023 Same die, identical electrical specs, but rated for industrial temperature range (–40 °C to +85 °C) vs. automotive (–40 °C to +105 °C) Not qualified to AEC-Q100 Grade 2; unsuitable for under-hood or instrument cluster use Select only for non-automotive industrial HMIs where extended temperature is not required
S27KL0641DABHI020 64 Mb (8 MB) density, otherwise pin- and functionally compatible; lower max throughput (200 MBps at 100 MHz, 3.0 V) Insufficient capacity for full HD frame buffers; suitable for QVGA or segmented display applications Choose when memory bandwidth and capacity requirements are halved and 3.0 V I/O simplifies power design

Compared with S70KL1281DABHI020, the S70KL1281DABHI023 trades automotive qualification for cost reduction in non-automotive settings, while the S27KL0641DABHI020 offers half the density and lower speed at 3.0 V - making it viable only where thermal margin and bandwidth headroom are relaxed.

Availability

S70KL1281DABHI020 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMI displays, and ADAS camera preprocessing modules requiring stable component supply, AEC-Q100 qualification, and long-term lifecycle support.

Supply support for S70KL1281DABHI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive microcontrollers, and memory solutions with strong focus on safety-critical and high-reliability applications.

This part belongs to Infineon's HyperRAM™ product line, designed specifically to replace parallel SRAM and low-density SDRAM in resource-constrained embedded systems where pin count, power, and software simplicity are prioritized over raw density scalability.

FAQ

Is S70KL1281DABHI020 pin-compatible with S27KL0641DABHI020?

Yes - both devices use identical 24-ball FBGA packages with matching pinout, voltage assignments, and HyperBus interface signaling. The S70KL1281DABHI020 is a direct capacity upgrade; no PCB redesign is needed when migrating from 64 Mb to 128 Mb, provided the host controller supports the larger address space and extended burst timing.

Does this device require external refresh circuitry or software management?

No - the S70KL1281DABHI020 integrates autonomous self-refresh logic that executes internal row refresh cycles without host intervention. The HyperBus interface abstracts DRAM complexity entirely, presenting the device as a synchronous PSRAM with deterministic access timing and no refresh-related latency penalties during active transactions.

What is the significance of RWDS being bidirectional and its role in DCARS timing?

RWDS transitions from output (indicating initial latency during CA phase) to input (write mask) or output (read strobe) depending on transaction phase. In DCARS mode, RWDS is phase-shifted relative to CK to center its edge within the read data eye - this relaxes timing closure requirements by up to 150 ps compared to conventional source-synchronous DDR schemes, easing layout in high-speed automotive PCBs.

Can this part operate with a single 1.8 V supply, or are separate VCC and VCCQ rails mandatory?

Separate VCC (core) and VCCQ (I/O) supplies are mandatory per datasheet specifications. Both must be supplied at 1.8 V nominal for this variant ('D' suffix). Using a single rail violates absolute maximum ratings and risks data corruption due to I/O buffer undervoltage or core logic instability - dual-rail decoupling with dedicated 100 nF ceramic capacitors per supply is required.

S70KL1281DABHI020 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERRAM™ KL
Package/Case:
24-VBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
PSRAM
Technology:
PSRAM (Pseudo SRAM)
Memory Size:
128Mbit
Memory Organization:
16M x 8
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
40 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S70KL1281DABHI020 FAQ

1.How can I place an order for S70KL1281DABHI020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S70KL1281DABHI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S70KL1281DABHI020 reliable?

The price and inventory of S70KL1281DABHI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70KL1281DABHI020 is usually 5 days.

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S70KL1281DABHI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S70KL1281DABHI020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S70KL1281DABHI020?

For technical support, including S70KL1281DABHI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70KL1281DABHI020 requirements.

6.How does Aetrix verify that S70KL1281DABHI020 is sourced from the original manufacturer or authorized distributors?

All S70KL1281DABHI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70KL1281DABHI020 meets industry standards.

7.What is the process for return or replacement of S70KL1281DABHI020?

All S70KL1281DABHI020 units undergo pre-shipment inspection (PSI). If there is an issue with S70KL1281DABHI020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S70KL1281DABHI020 part is unused and in its original packaging.

Return procedure for S70KL1281DABHI020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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