Infineon Technologies S70KL1281DABHI023
- Part No.:
- S70KL1281DABHI023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S70KL1281DABHI023.pdf
- Description:
- IC PSRAM 128MBIT PAR 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,024
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Product details
Overview
S70KL1281DABHI023 from Infineon Technologies (formerly Cypress) is a 128 Mb (16 MB) HyperRAM™ self-refresh DRAM with HyperBus interface, functioning as a pseudo-static memory in embedded systems requiring high bandwidth and low pin count. It supports 1.8 V I/O, differential clock (CK/CK#), 8-bit DQ bus, bidirectional RWDS strobe/mask, and delivers up to 333 MBps at 166 MHz DDR operation.
For engineers reviewing the S70KL1281DABHI023 datasheet, S70KL1281DABHI023 pinout, S70KL1281DABHI023 application, or S70KL1281DABHI023 equivalent, key selection criteria include DDR timing compliance, DCARS read strobe phase alignment, deep power-down current (20 µA @ 1.8 V), configurable burst length (16–128 bytes), and FBGA-24 package compatibility with HyperBus host controllers.
Technical Context
This device implements a dual-die stacked architecture-two 64 Mb HyperRAM dies in one FBGA-24 package-enabling 128 Mb density while retaining identical HyperBus protocol, command set, and timing behavior as single-die variants. It uses internal refresh logic to eliminate host-managed refresh cycles, presenting a PSRAM-like interface.
The HyperBus interface operates with center-aligned DDR transfers on DQ[7:0], where RWDS serves dual roles: outputting initial latency indication during CA transfer, then acting as edge-aligned read data strobe or write mask signal. DCARS functionality shifts RWDS phase relative to CK to center it within the read data eye at 166 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 128 Mb (16 MB) - achieved via dual 64 Mb die stack in single package, preserving pinout and interface compatibility |
| Data Bus Width | 8-bit DQ[7:0] - low-signal-count interface reduces PCB routing complexity and EMI vs parallel SRAM/DDR |
| Max Throughput | 333 MBps - double-data-rate transfer at 166 MHz clock (1.8 V VCC/VCCQ), enabling real-time graphics/framebuffer use |
| Access Latency | 36 ns tACC at 166 MHz - defines minimum time from CS# assertion to first valid read data under worst-case timing |
| Deep Power-Down Current | 20 µA @ 1.8 V, 105 °C - enables ultra-low standby power in battery-backed or energy-constrained edge devices |
| Burst Configurability | 16/32/64/128-byte wrapped or linear bursts - supports cache-line fill (wrapped) and streaming media (linear) without firmware reconfiguration |
| Interface Voltage | 1.8 V I/O (VCCQ) with differential CK/CK# - ensures noise-immune clocking and signal integrity at high DDR rates |
Pinout & Package
Package: 24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC | Core Supply | 3.0 V nominal supply for internal logic; decoupling required per datasheet layout guidelines |
| VCCQ | I/O Supply | 1.8 V nominal supply for DQ/RWDS/CK/CK#/CS# buffers; independent of VCC for mixed-voltage system interfacing |
| VSS, VSSQ | GND Planes | Separate digital core (VSS) and I/O (VSSQ) ground pins reduce switching noise coupling into sensitive analog timing paths |
| CK, CK# | Differential Clock Input | LV-CMOS differential pair accepting 166 MHz DDR clock; used for all command, address, and data capture timing |
| CS# | Chip Select | Active-low enable controlling transaction initiation; must be asserted before CA transfer and held until transaction end |
| RWDS | Bidirectional Strobe/Mask | Output during CA phase (latency indicator), edge-aligned read strobe, or input write mask-no external pull-up/down required |
| DQ[7:0] | Bi-directional Data Bus | 8-bit DDR data path carrying command/address/data; center-aligned with CK for writes, edge-aligned with RWDS for reads |
| RESET# | Hardware Reset | Asynchronous active-low reset that clears internal state and forces power-on initialization sequence |
Key Features
| Feature | Design Value |
|---|---|
| Self-Refresh DRAM Core | Eliminates host refresh overhead; appears as PSRAM to system software while retaining DRAM density/cost advantage |
| DCARS Timing Architecture | Phase-shifts RWDS relative to CK to center strobe transitions in read data eye-critical for reliable 166 MHz DDR sampling |
| Configurable Burst Mode | Per-transaction selection of wrapped (cache line) or linear (streaming) burst, enabling dynamic optimization without register rewrites |
| Low-Power Deep Power-Down | 20 µA standby current at 1.8 V enables >1-year battery life in always-on IoT endpoints with infrequent memory access |
| HyperBus Interface Compliance | Standardized 12-signal interface (CK/CK#, CS#, DQ[7:0], RWDS, RESET#, VCC/VCCQ/VSS/VSSQ) simplifies host controller integration |
Applications
| Automotive Instrument Clusters | Industrial HMI Displays |
|---|---|
|
Use Scenario: Real-time rendering of animated gauges, navigation overlays, and ADAS alerts on 7–12 inch TFT-LCD panels. IC Role / Device Role / Timing Role: Framebuffer memory interfaced to MCU or GPU via HyperBus; provides low-latency pixel data access with deterministic 36 ns tACC. Use Value: Dual-die 128 Mb capacity supports full HD resolution at 32 bpp with alpha channel, while DCARS ensures stable read strobe alignment across temperature and voltage variation. |
Use Scenario: Local GUI storage for programmable logic controllers (PLCs) and HMIs running Qt or Embedded Wizard frameworks. IC Role / Device Role / Timing Role: Offload main processor memory bandwidth by hosting UI assets (bitmaps, fonts, widget states) with burst-optimized linear transfers. Use Value: 333 MBps throughput sustains 60 fps updates on 1024×600 displays; deep power-down mode cuts idle power by >99% versus parallel SRAM alternatives. |
| Edge AI Inference Accelerators | Medical Imaging Front-Ends |
|
Use Scenario: Buffering intermediate tensors and activation maps during CNN inference on microcontrollers with NPU co-processors. IC Role / Device Role / Timing Role: High-bandwidth scratchpad memory accessed via DMA over HyperBus; supports back-to-back burst reads/writes with minimal CS# overhead. Use Value: Configurable 128-byte wrapped bursts align with typical convolution kernel tile sizes, reducing bus arbitration latency and improving MAC utilization. |
Use Scenario: Temporary storage of ultrasound RF data frames or X-ray detector line buffers prior to FPGA-based beamforming or compression. IC Role / Device Role / Timing Role: Low-jitter, deterministic-access memory for time-critical acquisition pipelines; RWDS-driven strobe eliminates setup/hold uncertainty in read capture. Use Value: 20 µA deep power-down allows safe retention during inter-frame idle periods in portable diagnostic devices, extending battery runtime without volatile data loss. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar pseudo-static memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S70KL1281DABHI020 | Same die stack and HyperBus interface, but rated for industrial temperature range (−40 °C to +85 °C) instead of automotive (−40 °C to +125 °C) | Lacks AEC-Q100 qualification; unsuitable for under-hood or safety-critical instrument cluster use | Select when operating environment stays below 85 °C and automotive qualification is not required |
| S70KS1281DABHI023 | Identical pinout and electrical specs, but uses 3.0 V I/O (VCCQ) instead of 1.8 V; requires CK (single-ended) rather than CK/CK# (differential) | Higher noise margin at lower speed (100 MHz max), but incompatible with 1.8 V HyperBus hosts and DCARS timing | Choose only if host controller lacks differential clock support and system voltage rails are fixed at 3.0 V |
Compared with S70KL1281DABHI023, the S70KL1281DABHI020 trades automotive qualification for cost-sensitive industrial use, while the S70KS1281DABHI023 sacrifices high-speed DCARS capability and 1.8 V compatibility for simpler single-ended clocking-neither is drop-in replaceable without hardware or firmware revision.
Availability
S70KL1281DABHI023 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMIs, edge AI accelerators, and medical imaging front-ends requiring stable component supply, AEC-Q100 qualification, and long-term lifecycle support.
Supply support for S70KL1281DABHI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensing, connectivity, and memory solutions for automotive, industrial, and IoT markets.
This part belongs to the HyperRAM™ product line, designed specifically to bridge the performance, density, and cost gap between PSRAM and mobile DDR in resource-constrained embedded systems with strict pin-count and power budgets.
FAQ
Is S70KL1281DABHI023 pin-compatible with S27KL0641 or S70KL0641?
No. S70KL1281DABHI023 is a 128 Mb dual-die device in 24-ball FBGA, whereas S27KL0641/S70KL0641 are 64 Mb single-die parts. Though both share HyperBus interface and identical pin functions, the 128 Mb variant requires no additional signals but is not physically interchangeable due to different internal die stacking and timing calibration requirements.
Does this device require external refresh control from the host processor?
No. S70KL1281DABHI023 contains fully autonomous self-refresh circuitry. The host processor accesses it as a pseudo-static RAM-no refresh commands, timers, or scheduling logic are needed. Internal refresh occurs transparently during idle cycles or added latency windows indicated by RWDS.
What is the significance of RWDS being bidirectional and its role in DCARS?
RWDS acts as an output during command/address transfer to signal whether extra latency is needed, then switches to edge-aligned read strobe or write mask. In DCARS mode, its rising/falling edges are phase-shifted relative to CK to land precisely in the center of the read data eye-this compensates for skew and enables reliable 166 MHz DDR sampling without complex board-level delay tuning.
Can S70KL1281DABHI023 operate with a single-ended clock instead of differential CK/CK#?
No. This specific variant (DABHI023) mandates differential CK/CK# for 1.8 V operation and DCARS functionality. Attempting single-ended clocking violates AC timing specifications and disables RWDS phase-shifting, resulting in read data capture failure at rated speeds. Use S70KS1281 for single-ended clock support.
S70KL1281DABHI023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERRAM™ KL
- Package/Case:
- 24-VBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- PSRAM
- Technology:
- PSRAM (Pseudo SRAM)
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 40 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S70KL1281DABHI023 FAQ
1.How can I place an order for S70KL1281DABHI023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70KL1281DABHI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70KL1281DABHI023 reliable?
The price and inventory of S70KL1281DABHI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70KL1281DABHI023 is usually 5 days.
3.What payment methods are accepted for S70KL1281DABHI023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70KL1281DABHI023 transactions.
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4.How is shipping managed for S70KL1281DABHI023?
S70KL1281DABHI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70KL1281DABHI023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70KL1281DABHI023?
For technical support, including S70KL1281DABHI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70KL1281DABHI023 requirements.
6.How does Aetrix verify that S70KL1281DABHI023 is sourced from the original manufacturer or authorized distributors?
All S70KL1281DABHI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70KL1281DABHI023 meets industry standards.
7.What is the process for return or replacement of S70KL1281DABHI023?
All S70KL1281DABHI023 units undergo pre-shipment inspection (PSI). If there is an issue with S70KL1281DABHI023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70KL1281DABHI023 part is unused and in its original packaging.
Return procedure for S70KL1281DABHI023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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