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Infineon Technologies S70KL1282DPBHB023

Part No.:
S70KL1282DPBHB023
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS70KL1282DPBHB023.pdf
Description:
IC PSRAM 128MBIT HYPERBUS 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,555

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Product details

Overview

S70KL1282DPBHB023 from Infineon is a 128 Mb self-refresh DRAM (PSRAM) with HYPERBUS™ interface, operating at 1.8 V or 3.0 V VCC/VCCQ, supporting 200 MHz DDR clocking, 400 MBps data throughput, and 24-ball FBGA package. It serves as high-bandwidth, low-pin-count external memory for microcontrollers and SoCs in automotive instrument clusters and industrial HMIs where SRAM density is insufficient and DRAM complexity must be hidden.

For engineers reviewing the S70KL1282DPBHB023 datasheet, S70KL1282DPBHB023 pinout, S70KL1282DPBHB023 application, or S70KL1282DPBHB023 equivalent, key selection criteria include HYPERBUS™ timing compliance, hybrid sleep mode current (330 µA @ 2.0 V), DCARS support for read-data eye alignment, and AEC-Q100 Grade 2 qualification for +105°C operation.

Technical Context

The device implements a stacked-die architecture (two 64 Mb dies) with independent refresh control per die and supports both single-ended (11-signal) and optional differential clock (12-signal) HYPERBUS™ configurations. RWDS functions bidirectionally - as output indicating refresh latency at transaction start and as read strobe or write mask during transfers.

DCARS mode shifts RWDS phase by one CK edge to center-align transitions within the read data eye, improving timing margin at 200 MHz. Burst lengths are configurable (16–128 bytes), and linear bursts across die boundaries are prohibited per datasheet constraint.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density128 Mb (2 × 64 Mb stacked die)
InterfaceHYPERRAM™ with HYPERBUS™ DDR protocol (8-bit DQ, CS#, CK/CK#, RWDS, RESET#)
Max Clock Rate200 MHz DDR → 400 MBps sustained throughput
Supply Voltage1.8 V or 3.0 V VCC/VCCQ (separate array/I/O rails)
Operating Temp–40°C to +105°C (AEC-Q100 Grade 2, Industrial Plus)
Power ModesHybrid sleep (330 µA @ 2.0 V), Deep power down (360 µA @ 3.6 V)
Access TimetACC ≤ 35 ns (measured from CK edge to valid DQ)

Pinout & Package

24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip SelectActive-low enable for command/address/data transactions; deassertion terminates ongoing burst
CK / CK#Clock InputDifferential clock pair for DDR timing capture; supports optional single-ended CK only mode
RWDSRead-Write Data StrobeBidirectional: output indicates refresh latency/start-of-read; input masks write data; DCARS shifts phase for eye-centering
DQ[7:0]Data I/O8-bit bidirectional LV-CMOS bus carrying CA and data; transfers 2 bytes/clock cycle in DDR mode
RESET#Hardware ResetAsynchronous active-low reset that clears internal state and forces re-initialization sequence

Key Features

FeatureDesign Value
Self-refresh DRAM coreEliminates host-managed refresh overhead; appears as SRAM to MCU/SoC firmware
HYPERBUS™ low-pin-count DDR12-signal interface delivers 400 MBps - replaces 16–32-bit parallel NOR/NAND or SRAM buses
Configurable burst length16/32/64/128-byte wrapped or linear bursts - optimizes bandwidth vs. latency trade-off per use case
DCARS timing enhancementPhase-shifted RWDS improves setup/hold margin on read data at 200 MHz, enabling robust high-speed operation
AEC-Q100 Grade 2Qualified for automotive under-hood applications up to +105°C ambient, with full temperature-range parametric validation

Applications

Automotive Instrument ClusterIndustrial HMI Display Buffer

Use Scenario: Real-time rendering of animated gauges and infotainment overlays in digital dashboards.

IC Role / Device Role / Timing Role: External frame buffer memory interfaced to MCU via HYPERBUS™, providing low-latency pixel data access.

Use Value: 400 MBps bandwidth sustains 1080p@60fps RGB888 updates without bus contention; hybrid sleep reduces idle power by >99% vs. PSRAM alternatives.

Use Scenario: Local graphics storage for touch-enabled factory operator panels with dynamic UIs.

IC Role / Device Role / Timing Role: High-density off-chip memory supplementing limited MCU internal RAM for bitmap caching and widget rendering.

Use Value: 128 Mb capacity enables multi-screen UI assets; 24-ball FBGA simplifies PCB layout vs. QFP or TSOP packages.

Medical Imaging Control PanelEdge AI Inference Accelerator Cache

Use Scenario: Fast image thumbnail preloading and DICOM metadata buffering in portable diagnostic devices.

IC Role / Device Role / Timing Role: Low-power, high-throughput memory for bursty image data streaming between sensor interface and display controller.

Use Value: Deep power down (330 µA @ 2.0 V) extends battery life during standby; DCARS ensures reliable reads at max clock rate.

Use Scenario: On-device model weight caching for real-time vision inference on embedded SoCs.

IC Role / Device Role / Timing Role: External cache memory accessed via AXI-to-HYPERBUS™ bridge, reducing DDR bandwidth pressure.

Use Value: Linear burst mode enables contiguous weight fetches; 35 ns tACC meets tight timing budgets for accelerator pipelines.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PSRAM/HYPERRAM™ applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S27KL0641DPBHB02064 Mb density, same 24-ball FBGA, identical HYPERBUS™ timing and DCARS supportLower capacity suits cost-sensitive designs with <64 MB frame buffer needsSelect when memory footprint and BOM cost outweigh need for 128 Mb headroom
Infineon S70KL1282DPBHB020Same die, identical specs, but rated for Industrial (–40°C to +85°C) not Automotive Grade 2Lacks AEC-Q100 qualification; unsuitable for under-hood automotive deploymentsChoose only for non-automotive industrial applications requiring identical performance at lower qualification cost

Compared with S27KL0641DPBHB020 and S70KL1282DPBHB020, the S70KL1282DPBHB023 uniquely combines 128 Mb density, +105°C operation, and AEC-Q100 Grade 2 certification - making it the sole option for automotive-grade high-bandwidth PSRAM in thermally demanding environments.

Availability

S70KL1282DPBHB023 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMIs, medical control panels, and edge AI accelerators requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S70KL1282DPBHB023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with leadership in AEC-Q100-qualified components.

This part belongs to Infineon's HYPERRAM™ product line, designed specifically to replace parallel NOR/NAND and SRAM in bandwidth-constrained embedded systems while maintaining simple MCU interface requirements.

FAQ

What is the minimum initial access latency for a read transaction?

The minimum initial access latency is 4 clock cycles, as defined by the HYPERBUS™ specification and confirmed in Table 10 of the datasheet. This latency accommodates internal refresh arbitration and command decoding before first data transfer. Latency may increase if refresh is pending, signaled by RWDS assertion at transaction start.

Does S70KL1282DPBHB023 support partial array refresh?

Yes - the device supports configurable partial array refresh at fractions of the full array: 1/8, 1/4, and 1/2. This feature reduces average current consumption during light activity periods while maintaining data retention, and is controlled via Configuration Register 1 bits [11:8].

Can both 64 Mb dies enter deep power down simultaneously?

No - the datasheet explicitly states that only one die at a time can be programmed into hybrid sleep or deep power down mode. Simultaneous entry is prohibited due to internal power rail and control logic constraints in the stacked-die architecture.

Is DCARS enabled by default after power-up?

No - DCARS is disabled by default. It must be enabled via bit [15] of Configuration Register 0 (CR0), which is write-once after power-up. Once set, the phase shift applies to all subsequent read transactions until reset.

S70KL1282DPBHB023 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERRAM™ KL
Package/Case:
24-VBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
PSRAM
Technology:
PSRAM (Pseudo SRAM)
Memory Size:
128Mbit
Memory Organization:
16M x 8
Memory Interface:
HyperBus
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
36ns
Access Time:
36 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S70KL1282DPBHB023 FAQ

1.How can I place an order for S70KL1282DPBHB023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S70KL1282DPBHB023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S70KL1282DPBHB023 reliable?

The price and inventory of S70KL1282DPBHB023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70KL1282DPBHB023 is usually 5 days.

3.What payment methods are accepted for S70KL1282DPBHB023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70KL1282DPBHB023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S70KL1282DPBHB023?

S70KL1282DPBHB023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S70KL1282DPBHB023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S70KL1282DPBHB023?

For technical support, including S70KL1282DPBHB023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70KL1282DPBHB023 requirements.

6.How does Aetrix verify that S70KL1282DPBHB023 is sourced from the original manufacturer or authorized distributors?

All S70KL1282DPBHB023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70KL1282DPBHB023 meets industry standards.

7.What is the process for return or replacement of S70KL1282DPBHB023?

All S70KL1282DPBHB023 units undergo pre-shipment inspection (PSI). If there is an issue with S70KL1282DPBHB023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S70KL1282DPBHB023 part is unused and in its original packaging.

Return procedure for S70KL1282DPBHB023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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