Infineon Technologies S70KL1282DPBHB030
- Part No.:
- S70KL1282DPBHB030
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S70KL1282DPBHB030.pdf
- Description:
- IC PSRAM 128MBIT HYPERBUS 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,953
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Product details
Overview
S70KL1282DPBHB030 from Infineon is a 128 Mb pseudo-static RAM (PSRAM) with self-refresh DRAM core, HYPERBUS™ DDR interface, 1.8 V/3.0 V dual-supply support, 200 MHz max clock rate, and 24-ball FBGA package. It serves as high-bandwidth, low-pin-count external memory for microcontrollers and SoCs in embedded systems requiring deterministic latency and simplified refresh management.
For engineers reviewing the S70KL1282DPBHB030 datasheet, S70KL1282DPBHB030 pinout, S70KL1282DPBHB030 application, or S70KL1282DPBHB030 equivalent, key selection criteria include HYPERBUS™ timing compliance, DCARS-enabled read strobe alignment, hybrid sleep/deep power down current specs, and die-stacked 64 Mb × 2 architecture behavior under burst boundary conditions.
Technical Context
The device implements a stacked-die architecture with two independent 64 Mb DRAM dies sharing a single HYPERBUS™ interface controller; only one die may enter hybrid sleep or deep power down at a time. Its DDR interface uses center-aligned command/address and bidirectional RWDS for read strobe/write mask functionality.
DCARS mode provides a phase-shifted clock to align RWDS transitions within the read data eye, improving timing margin at 200 MHz. Internal refresh logic operates autonomously during idle cycles, eliminating host-managed refresh but requiring host-enforced burst length limits (≤128 bytes) to guarantee refresh window availability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 128 Mb (2 × 64 Mb stacked dice), enabling compact high-capacity external memory without address bus expansion |
| Interface Standard | HYPERRAM™ with HYPERBUS™ DDR protocol - 11–12 signal count, LV-CMOS compatible, supports linear/wrapped bursts |
| Max Clock Rate | 200 MHz - delivers up to 400 MBps throughput via double-data-rate transfers on DQ[7:0] |
| Supply Voltages | VCC/VCCQ = 1.8 V or 3.0 V nominal - dual-voltage support simplifies integration with mixed-supply SoC platforms |
| Access Time | tACC ≤ 35 ns - defines worst-case initial latency for read transactions under full-speed operation |
| Deep Power Down Current | 330 µA @ 2.0 V, 105°C - enables ultra-low standby power in battery-sensitive edge devices |
| Operating Temperature | –40°C to +105°C (Industrial Plus grade) - validated for extended thermal environments without derating |
Pinout & Package
Package: 24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input pair | Enables DDR timing capture; optional single-ended CK mode reduces pin count to 11 signals |
| CS# | Chip select active-low | Asserted to initiate all HYPERBUS™ transactions; controls entry/exit from power modes |
| RWDS | Bidirectional read-write data strobe | Output as read strobe (center-aligned or DCARS-aligned); input as write mask during WR transactions |
| DQ[7:0] | 8-bit bidirectional data bus | Carries command, address, and data in time-multiplexed fashion; supports 16-bit internal word transfers |
| RESET# | Hardware reset input | Asynchronous active-low signal that forces device into known state and clears configuration registers |
Key Features
| Feature | Design Value |
|---|---|
| Self-refresh DRAM core | Eliminates host refresh overhead while retaining DRAM density/cost advantage - appears as SRAM to software |
| DCARS (DDR Center-Aligned Read Strobe) | Phase-shifts RWDS by one clock cycle to center strobe edge in read data eye, increasing setup/hold margin at 200 MHz |
| Configurable burst lengths | Supports 16/32/64/128-byte wrapped bursts and hybrid (wrapped + linear) mode - optimizes bandwidth vs. latency trade-off per access pattern |
| Dual-voltage I/O support | 1.8 V or 3.0 V VCCQ selection allows direct interfacing with both low-voltage MCUs and legacy 3.3 V logic families |
| Independent die power control | Each 64 Mb die can be placed in hybrid sleep or deep power down separately - enables partial memory retention during low-power operation |
Applications
| Automotive ADAS Camera Module | Industrial HMI Display Controller |
|---|---|
Use Scenario: Real-time buffering of 1080p60 video frames between image sensor and GPU before compression. IC Role / Device Role / Timing Role: External frame buffer providing deterministic 35 ns tACC and 400 MBps throughput via HYPERBUS™ DDR interface. Use Value: Eliminates need for external refresh controller; DCARS alignment ensures reliable read capture at full 200 MHz clock under thermal stress. | Use Scenario: Storing GUI assets, font tables, and touch event buffers in a fanless panel PC operating continuously at 85°C. IC Role / Device Role / Timing Role: Low-pin-count PSRAM replacing parallel SRAM to reduce PCB layer count and EMI emissions. Use Value: Hybrid sleep mode cuts active-idle current to 750 µA while preserving display content across UI transitions. |
| Edge AI Inference Accelerator | Medical Portable Ultrasound System |
Use Scenario: Holding intermediate tensor outputs during multi-layer neural network execution on an FPGA-based accelerator. IC Role / Device Role / Timing Role: High-bandwidth scratchpad memory accessed via AXI-to-HYPERBUS™ bridge with burst-length optimization. Use Value: Configurable 128-byte wrapped bursts match typical convolution kernel tile sizes, minimizing bus turnaround overhead. | Use Scenario: Capturing and pre-processing real-time B-mode ultrasound scan lines before transfer to host processor. IC Role / Device Role / Timing Role: Low-latency, AEC-Q100 Grade 2 qualified memory supporting –40°C to +105°C operation in sealed handheld enclosure. Use Value: Deep power down current of 330 µA extends battery life during standby without compromising startup readiness. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PSRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S27KL0641DPBHB020 | 64 Mb density, same 24-ball FBGA, identical HYPERBUS™ timing but no DCARS support | Limited to lower-bandwidth applications where 200 MHz read margin is less critical | Select when memory capacity requirement is ≤64 Mb and cost sensitivity outweighs DCARS timing benefit |
| Infineon S70KL1282DPBHB020 | Same 128 Mb density and DCARS capability, but Industrial (–40°C to +85°C) grade instead of Industrial Plus | Not qualified for sustained 105°C ambient operation; reduced thermal headroom in enclosed systems | Choose for cost-optimized industrial designs where full +105°C rating is unnecessary |
Compared with S27KL0641DPBHB020 and S70KL1282DPBHB020, the S70KL1282DPBHB030 uniquely combines 128 Mb capacity, DCARS-enhanced timing margin, and Industrial Plus temperature qualification - making it optimal for thermally constrained, high-throughput edge computing applications.
Availability
S70KL1282DPBHB030 is available at Aetrix Electronics and suitable for automotive ADAS camera modules, industrial HMI display controllers, edge AI inference accelerators, and medical portable ultrasound systems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S70KL1282DPBHB030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, connectivity, and memory solutions for automotive, industrial, and IoT markets.
The HYPERRAM™ product line delivers high-density, low-pin-count PSRAMs optimized for MCU- and SoC-based systems needing SRAM-like simplicity with DRAM economics and HYPERBUS™-enabled bandwidth scalability.
FAQ
What is the function of the RWDS signal in S70KL1282DPBHB030?
RWDS is a bidirectional signal used as a read data strobe (output) during read transactions and as a write data mask (input) during write transactions. In DCARS mode, its timing is phase-shifted by one clock cycle relative to CK to center the strobe edge within the read data eye, improving timing margin at 200 MHz operation.
Can both 64 Mb dies operate independently in power modes?
No - while the device contains two physically separate 64 Mb dies, only one die may be placed into hybrid sleep or deep power down mode at a time. The other die remains active or in standby, preventing full 128 Mb retention in lowest-power states.
Is DCARS mode enabled by default after power-up?
No - DCARS mode is disabled by default. It must be explicitly enabled by setting bit 7 of Configuration Register 1 (CR1) via a HYPERBUS™ register write transaction. The mode persists until changed or reset.
How does the device handle refresh during long burst transfers?
The host must limit burst length to ≤128 bytes (64 clocks) to ensure sufficient idle cycles for internal refresh. If refresh is pending, the device inserts additional initial access latency before the first data transfer, signaled via RWDS assertion at transaction start.
S70KL1282DPBHB030 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERRAM™ KL
- Package/Case:
- 24-VBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- PSRAM
- Technology:
- PSRAM (Pseudo SRAM)
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- HyperBus
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- 36ns
- Access Time:
- 36 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S70KL1282DPBHB030 FAQ
1.How can I place an order for S70KL1282DPBHB030 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70KL1282DPBHB030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70KL1282DPBHB030 reliable?
The price and inventory of S70KL1282DPBHB030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70KL1282DPBHB030 is usually 5 days.
3.What payment methods are accepted for S70KL1282DPBHB030?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70KL1282DPBHB030 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70KL1282DPBHB030?
S70KL1282DPBHB030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70KL1282DPBHB030 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70KL1282DPBHB030?
For technical support, including S70KL1282DPBHB030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70KL1282DPBHB030 requirements.
6.How does Aetrix verify that S70KL1282DPBHB030 is sourced from the original manufacturer or authorized distributors?
All S70KL1282DPBHB030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70KL1282DPBHB030 meets industry standards.
7.What is the process for return or replacement of S70KL1282DPBHB030?
All S70KL1282DPBHB030 units undergo pre-shipment inspection (PSI). If there is an issue with S70KL1282DPBHB030, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70KL1282DPBHB030 part is unused and in its original packaging.
Return procedure for S70KL1282DPBHB030:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S70KL1282DPBHB030 Tags

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