Infineon Technologies S70KL1282DPBHI020

Overview

S70KL1282DPBHI020 from Infineon is a 128 Mb pseudo-static RAM (PSRAM) with self-refresh DRAM core, HYPERBUS™ DDR interface, 1.8 V/3.0 V dual-supply support, 200 MHz max clock rate, and 24-ball FBGA package. It serves as high-bandwidth, low-pin-count external memory for microcontrollers in automotive instrument clusters, industrial HMIs, and edge AI accelerators requiring deterministic latency and low-power standby.

For engineers reviewing the S70KL1282DPBHI020 datasheet, S70KL1282DPBHI020 pinout, S70KL1282DPBHI020 application, or S70KL1282DPBHI020 equivalent, key selection criteria include HYPERBUS™ timing compliance, RWDS strobe alignment behavior, hybrid sleep mode entry timing, and die-select limitations in stacked-die operation.

Technical Context

The device implements a stacked-die architecture with two independent 64 Mb DRAM dies sharing a single HYPERBUS™ interface; only one die may enter hybrid sleep or deep power down at a time. Internal refresh logic eliminates host-managed refresh cycles, presenting static RAM semantics to the controller.

HYPERBUS™ transactions use center-aligned command/address transfers on DQ[7:0], followed by initial access latency (tACC = 35 ns), then DDR data transfers synchronized to CK/CK#. RWDS operates bidirectionally: as read data strobe (phase-shifted for DCARS), write mask, and refresh latency indicator.

Key Specifications

Pinout & Package

24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3. Package supports automated optical inspection and fine-pitch PCB routing.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar PSRAM applications.

Compared with CY15B104QN-SXIT and AS4C128M16D3LA-12BIN, S70KL1282DPBHI020 uniquely balances 128 Mb density, HYPERBUS™'s 11-signal simplicity, deterministic tACC, and integrated self-refresh-making it optimal for MCU-based systems needing SRAM-like ease-of-use with DRAM-level capacity and bandwidth.

Availability

S70KL1282DPBHI020 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMIs, edge AI accelerators, and medical imaging front-ends requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S70KL1282DPBHI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.

S70KL1282DPBHI020 belongs to the HYPERRAM™ product line, designed specifically to replace parallel SRAM and QSPI Flash in resource-constrained embedded systems requiring high bandwidth, low pin count, and seamless integration with MCU memory-mapped interfaces.

FAQ

What is the function of the RWDS pin in read versus write operations?

RWDS is bidirectional: during reads, it outputs a phase-shifted strobe (DCARS) aligned to center the data eye; during writes, it acts as an input mask controlling which DQ bits are written; at transaction start, it pulses to indicate internal refresh latency. Its behavior is configured via Configuration Register 0 bit [11].

Does S70KL1282DPBHI020 require external refresh management from the host controller?

No. The device contains autonomous refresh logic that executes partial or full array refreshes during idle periods. The host only observes initial access latency (tACC = 35 ns) and must limit burst length to allow internal refresh windows-no refresh commands or timing control are needed.

Can both 64 Mb dies operate simultaneously in different power modes?

No. While the device contains two stacked 64 Mb dies, only one die may be placed into hybrid sleep or deep power down mode at a time. The other die remains in standby or active state, and die selection is controlled exclusively via CS# timing and internal address decoding.

What is the significance of the "PBH" suffix in the part number S70KL1282DPBHI020?

The "PBH" denotes the 24-ball FBGA package (PB), industrial-plus temperature grade (H), and lead-free, halogen-free construction (I). The "020" indicates tape-and-reel packaging with 2,000 units per reel, per Infineon's ordering nomenclature in document 002-29416 Rev. *D.