Infineon Technologies S70KL1282GABHM020
- Part No.:
- S70KL1282GABHM020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S70KL1282GABHM020.pdf
- Description:
- IC PSRAM 128MBIT HYPERBUS 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,616
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Product details
Overview
S70KL1282GABHM020 from Infineon is a 128-Mbit Automotive Grade 1 (–40 °C to +125 °C) HyperRAM self-refresh DRAM with HyperBus DDR interface, 200 MHz max clock rate, 8-bit DQ bus, and 24-ball FBGA package. It delivers up to 400 MBps throughput, supports configurable burst lengths (16–128 bytes), and operates at 1.8 V or 3.0 V for VCC/VCCQ - used as high-bandwidth, low-pin-count external memory in automotive ADAS domain controllers.
For engineers reviewing the S70KL1282GABHM020 datasheet, S70KL1282GABHM020 pinout, S70KL1282GABHM020 application, or S70KL1282GABHM020 equivalent, key selection considerations include HyperBus timing compliance, dual-die refresh management, RWDS bidirectional strobe behavior, DCARS phase-shifted read strobe support, and AEC-Q100 Grade 1 thermal/power validation.
Technical Context
This device implements a stacked-die architecture with two 64-Mb DRAM dies sharing one HyperBus interface; only one die can enter Hybrid Sleep or Deep Power Down mode at a time. Its self-refresh logic eliminates host-managed refresh cycles, presenting pseudo-static behavior while maintaining true DRAM density and power efficiency.
The HyperBus interface uses center-aligned command/address transfers on DQ[7:0], edge-aligned RWDS for read data strobing, and center-aligned data during writes. DCARS mode introduces a phase-shifted clock to reposition RWDS transitions within the read data eye - critical for timing margin in high-speed automotive SoC interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 128 Mbit (dual 64-Mb stacked die) |
| Interface Standard | HyperBus DDR - 11-signal single-ended or 12-signal differential clock variant |
| Max Clock Rate | 200 MHz - enables 400 MBps peak throughput with DDR transfers |
| Burst Length Options | 16/32/64/128 bytes - wrapped or linear; hybrid burst supported on 64 Mb per die |
| Operating Temperature | –40 °C to +125 °C - AEC-Q100 Grade 1 qualified for automotive engine bay and ADAS modules |
| Supply Voltages | VCC/VCCQ = 1.8 V or 3.0 V nominal - separate array and I/O rail configuration |
| Access Time (tACC) | 35 ns - defines minimum latency between command assertion and first valid data |
| Package | 24-ball FBGA, 5 mm × 5 mm, 0.8 mm pitch - automotive-grade moisture sensitivity level 3 |
Pinout & Package
24-ball Fine-Pitch Ball Grid Array (FBGA) package with 5 mm × 5 mm footprint and 0.8 mm ball pitch. RoHS-compliant, lead-free, and qualified for automotive reflow profiles.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input pair | Provides source-synchronous timing reference; CK# optional for single-ended operation using CK only |
| CS# | Chip select active-low | Asserts transaction start; deassertion terminates all ongoing transfers and enters interface standby |
| RWDS | Bidirectional read/write data strobe | Outputs initial latency indicator and read data strobe; inputs write mask during burst writes |
| DQ[7:0] | 8-bit bidirectional data bus | Carries command, address, and data in time-multiplexed fashion; LV-CMOS compatible |
| RESET# | Hardware reset input | Asynchronous active-low signal that forces device into known state and clears internal registers |
| VCC / VCCQ | Power supply rails | VCC powers core DRAM array; VCCQ powers I/O buffers - independently configurable at 1.8 V or 3.0 V |
| VSS | Ground terminals | Four dedicated ground balls ensure low-impedance return path for high-speed switching noise suppression |
Key Features
| Feature | Design Value |
|---|---|
| Self-refresh DRAM architecture | Eliminates host refresh overhead; appears as PSRAM to controller while retaining DRAM density and cost efficiency |
| Configurable output drive strength | Allows optimization of signal integrity and EMI across varying PCB trace lengths and loading conditions |
| DCARS (DDR Center-Aligned Read Strobe) | Phase-shifted clock moves RWDS edge into center of read data eye - improves setup/hold margin at 200 MHz |
| Hybrid Sleep Mode | Reduces active current to ~10 µA per die while retaining data; enables fast wake-up without full initialization |
| Partial array refresh control | Supports 1/8, 1/4, or 1/2 array refresh - lowers average power during low-activity periods without data loss |
| AEC-Q100 Grade 1 qualification | Validated for continuous operation from –40 °C to +125 °C ambient - suitable for radar, camera, and gateway ECUs |
Applications
| Automotive ADAS Camera Module | Infotainment Head Unit Memory Expansion |
|---|---|
Use Scenario: High-resolution image buffering in 8 MP camera pipelines with real-time ISP processing. IC Role / Device Role / Timing Role: External frame buffer providing low-latency, burst-accessible storage for rolling shutter correction and HDR merging. Use Value: 400 MBps throughput sustains 60 fps 4K capture; DCARS timing margin ensures reliable reads under ECU thermal stress. | Use Scenario: Offloading GUI assets and application code from eMMC to faster external memory in Linux-based head units. IC Role / Device Role / Timing Role: High-bandwidth PSRAM replacement enabling direct XIP-like execution and reduced boot latency. Use Value: 200 MHz DDR interface reduces pin count vs. parallel NOR/NAND; AEC-Q100 Grade 1 supports dashboard mounting near display drivers. |
| Automotive Radar Signal Processor | Vehicle Gateway ECU Data Buffering |
Use Scenario: Storing FFT outputs and CFAR detection results in 77 GHz radar front-end modules. IC Role / Device Role / Timing Role: Low-power, high-throughput scratchpad memory interfaced directly to DSP subsystem via HyperBus. Use Value: Hybrid Sleep Mode cuts idle power by >99% vs. standard DRAM; partial refresh maintains data during intermittent processing bursts. | Use Scenario: Aggregating CAN FD, Ethernet AVB, and LIN messages before protocol translation and cloud upload. IC Role / Device Role / Timing Role: Dual-die memory acting as ring buffer for multi-source telemetry with deterministic access latency. Use Value: Stacked-die architecture allows independent die power control - one die buffers incoming data while the other services host reads. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar self-refresh DRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY14B108L-BA25XI | 8-Mbit nvSRAM with battery backup; parallel x8 interface; no DDR or HyperBus support | Non-volatile retention required; lower bandwidth (≤40 MBps); no automotive temperature grade | Select only if data persistence through power loss is mandatory and throughput <50 MBps suffices |
| IS66WV12816EBLL-15BLI | 128-Mbit async SRAM; 15 ns access; 32-bit bus; no self-refresh or DDR | Legacy controller compatibility; higher static power; no AEC-Q100 qualification | Choose when HyperBus interface is unavailable and board space permits larger 48-pin TSOP-II package |
Compared with CY14B108L-BA25XI and IS66WV12816EBLL-15BLI, S70KL1282GABHM020 uniquely combines automotive-grade reliability, DDR bandwidth, and self-refresh simplicity - making it optimal for new ADAS and gateway designs where pin count, power, and thermal robustness are constrained.
Availability
S70KL1282GABHM020 is available at Aetrix Electronics and suitable for automotive ADAS camera modules, infotainment head units, and radar signal processors requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S70KL1282GABHM020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
This part belongs to Infineon's HyperRAM product line - engineered specifically for automotive and industrial systems needing high-density, low-pin-count, self-refreshing memory with guaranteed AEC-Q100 compliance and DDR-level throughput.
FAQ
What is the function of the RWDS signal in S70KL1282GABHM020?
RWDS is a bidirectional strobe: during reads, it acts as an edge-aligned read data strobe and initial latency indicator; during writes, it serves as a byte-level write mask (HIGH = masked, LOW = written). Its behavior changes dynamically per transaction phase and is essential for timing alignment in both linear and wrapped bursts.
Does S70KL1282GABHM020 require external refresh commands from the host controller?
No. The device contains integrated self-refresh logic that autonomously manages DRAM array refresh during idle periods. The host sees pseudo-static behavior - no refresh commands, counters, or scheduling are needed, simplifying firmware and reducing CPU overhead in safety-critical automotive systems.
Can both 64-Mb dies operate simultaneously in S70KL1282GABHM020?
No. While the device presents a unified 128-Mb address space, only one die can be active at a time for read/write operations or power modes. Concurrent access or independent Deep Power Down entry is not supported - transactions are internally serialized across the two dies.
Is DCARS functionality enabled by default in S70KL1282GABHM020?
DCARS is optional and must be configured via HyperBus register write to the Device Configuration Register (DCR). When enabled, it applies a fixed phase shift to generate the DCARS clock; disabling it reverts RWDS to standard edge-aligned operation. Configuration persists across power cycles if stored in non-volatile register bits.
S70KL1282GABHM020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERRAM™ KL
- Package/Case:
- 24-VBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- PSRAM
- Technology:
- PSRAM (Pseudo SRAM)
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- HyperBus
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 35 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S70KL1282GABHM020 FAQ
1.How can I place an order for S70KL1282GABHM020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70KL1282GABHM020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70KL1282GABHM020 reliable?
The price and inventory of S70KL1282GABHM020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70KL1282GABHM020 is usually 5 days.
3.What payment methods are accepted for S70KL1282GABHM020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70KL1282GABHM020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70KL1282GABHM020?
S70KL1282GABHM020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70KL1282GABHM020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70KL1282GABHM020?
For technical support, including S70KL1282GABHM020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70KL1282GABHM020 requirements.
6.How does Aetrix verify that S70KL1282GABHM020 is sourced from the original manufacturer or authorized distributors?
All S70KL1282GABHM020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70KL1282GABHM020 meets industry standards.
7.What is the process for return or replacement of S70KL1282GABHM020?
All S70KL1282GABHM020 units undergo pre-shipment inspection (PSI). If there is an issue with S70KL1282GABHM020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70KL1282GABHM020 part is unused and in its original packaging.
Return procedure for S70KL1282GABHM020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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