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Infineon Technologies S70KL1283DPBHA020

Part No.:
S70KL1283DPBHA020
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS70KL1283DPBHA020.pdf
Description:
IC PSRAM 128MBIT SPI/OCTL 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,890

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Product details

Overview

S70KL1283DPBHA020 from Infineon is a 128 Mb self-refresh DRAM (PSRAM) with octal xSPI interface, operating at 1.8 V or 3.0 V supply, supporting up to 200 MHz DDR clock rate and delivering 400 MBps data throughput. It integrates dual 64-Mb stacked dice, features RWDS-based timing control, configurable burst lengths (16–128 bytes), and supports Hybrid Sleep and Deep Power Down modes for low-power embedded systems.

For engineers reviewing the S70KL1283DPBHA020 datasheet, S70KL1283DPBHA020 pinout, S70KL1283DPBHA020 application, or S70KL1283DPBHA020 equivalent, key selection criteria include xSPI octal bus compatibility, 24-ball FBGA package fit, 1.8/3.0 V dual-voltage operation, RWDS-synchronized read/write strobing, and AEC-Q100 Grade 2 automotive qualification (–40°C to +105°C).

Technical Context

This PSRAM implements a true self-refresh DRAM core with on-die refresh controller, eliminating host-side refresh management. Its xSPI octal interface uses CK/CK# differential clocking (12-signal mode) or single-ended CK (11-signal mode), with RWDS serving as bidirectional strobe-output during reads (data valid indicator), input during writes (mask signal), and optional DCARS phase-shifted variant for improved read eye alignment.

The device supports linear and wrapped burst configurations across 8-bit DQ[7:0], with burst termination at die boundaries prohibited in linear mode. Memory space is organized as two independent 64-Mb dies; only one die may enter Hybrid Sleep or Deep Power Down at a time, requiring explicit die-select register access for power-state coordination.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density128 Mb (2 × 64 Mb stacked dice)
Interface StandardOctal xSPI (11- or 12-signal bus, CK/CK# optional)
Max Clock Rate200 MHz DDR (400 MT/s effective)
Data Throughput400 MBps (3200 Mbps) with 8-bit DQ and DDR transfers
Burst LengthsConfigurable: 16/32/64/128 bytes (8/16/32/64 clocks)
Power ModesHybrid Sleep (reduced current, retained data), Deep Power Down (330 µA @ 2.0 V)
Operating TempIndustrial Plus (–40°C to +105°C) and AEC-Q100 Grade 2 qualified

Pinout & Package

Package: 24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip SelectActive-low enable for command/address/data transactions; deassertion halts ongoing operations
CK / CK#Clock InputDifferential clock pair (optional); defines DDR edge timing for DQ and RWDS sampling
RWDSRead-Write Data StrobeBidirectional: output during reads (data valid strobe), input during writes (byte mask)
DQ[7:0]Data Bus8-bit bidirectional data path; transfers address, command, or memory data on both clock edges
RESET#Hardware ResetAsynchronous active-low reset; forces device into known state and clears configuration registers

Key Features

FeatureDesign Value
Self-refresh DRAM coreOn-die refresh controller eliminates host refresh overhead; appears as SRAM to system software
Configurable burst modeLinear or wrapped bursts (16–128 bytes) enable optimization for sequential vs. cache-line-aligned access
RWDS timing flexibilityRWDS serves as read strobe, write mask, and latency indicator-reducing need for external timing compensation
Dual-die power isolationIndependent Hybrid Sleep/Deep Power Down per 64-Mb die enables selective power gating in multi-die systems
DCARS supportPhase-shifted RWDS (offset by ½ CK) improves read data eye margin in high-speed layouts

Applications

Automotive ADAS Display BufferIndustrial HMI Frame Buffer

Use Scenario: Real-time rendering of high-resolution instrument cluster graphics with minimal CPU intervention.

IC Role / Device Role / Timing Role: PSRAM acts as frame buffer memory, interfacing directly with display controller via octal xSPI for burst pixel streaming.

Use Value: 400 MBps throughput sustains 1080p@60Hz RGB888 rendering; AEC-Q100 Grade 2 ensures reliability at +105°C under hood conditions.

Use Scenario: Local GUI rendering on factory-floor HMIs with intermittent connectivity and thermal constraints.

IC Role / Device Role / Timing Role: Offloads main MCU by storing UI assets and rendering buffers; uses Hybrid Sleep between screen updates.

Use Value: 330 µA Deep Power Down current extends battery life in portable HMIs; industrial temperature range supports uncooled enclosures.

Edge AI Inference CacheSmart Camera Video Preprocessing Buffer

Use Scenario: Temporary storage of intermediate neural network layer outputs during on-device inference.

IC Role / Device Role / Timing Role: High-bandwidth cache between AI accelerator and DRAM; accessed via burst-aligned xSPI reads/writes.

Use Value: Wrapped 64-byte bursts match typical tensor tile sizes; 200 MHz DDR clock enables sub-µs latency for weight/activation fetches.

Use Scenario: Line-buffering and frame reordering in multi-sensor smart cameras before encoding.

IC Role / Device Role / Timing Role: Dual-die architecture allows one die to buffer incoming sensor data while the other feeds encoder pipeline.

Use Value: Independent die power control reduces dynamic power by 45% during partial-frame processing; RWDS-synchronized writes prevent FIFO underrun.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PSRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S27KL1283DPBHA020Same pinout, identical xSPI register map, but lacks DCARS support and AEC-Q100 Grade 2 qualificationNot suitable for automotive thermal environments > +85°C; requires external timing margining in 200 MHz layoutsSelect when automotive qualification is unnecessary and cost is prioritized over layout margin
Winbond W9825G6KH-15Parallel interface (32-bit bus), no xSPI support; 166 MHz max clock; higher pin count (96-pin TSOP)Requires dedicated memory controller with parallel bus; incompatible with xSPI-capable SoCs like i.MX RT117x or RZ/G2LSelect only for legacy parallel-memory designs where xSPI migration is not feasible

Compared with S27KL1283DPBHA020, this Infineon part adds DCARS and AEC-Q100 Grade 2 support-critical for automotive timing margin and thermal robustness. Against Winbond's parallel PSRAM, it enables smaller PCB footprint, lower signal count, and native integration with modern xSPI-enabled MCUs.

Availability

S70KL1283DPBHA020 is available at Aetrix Electronics and suitable for automotive ADAS displays, industrial HMIs, edge AI accelerators, and smart camera video pipelines requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S70KL1283DPBHA020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.

This part belongs to Infineon's HYPERRAM™ product line-designed specifically to replace parallel PSRAM and low-density LPDDR in resource-constrained, high-bandwidth embedded systems using simplified xSPI interfaces.

FAQ

Does S70KL1283DPBHA020 require external refresh circuitry?

No. The device contains an integrated self-refresh controller that automatically manages DRAM array refresh during idle periods. Host systems interact with it as a pseudo-static RAM-no refresh commands, timers, or scheduling logic are needed in firmware or hardware design.

Can both 64-Mb dice operate simultaneously in active mode?

Yes. Both dice share the same xSPI bus and respond to all commands unless explicitly isolated via die-select bits in Configuration Register 1. Concurrent access is not supported; arbitration is handled internally, and accesses are serialized per die.

What is the function of the RWDS signal during a WRITE transaction?

During WRITE, RWDS operates as an input byte mask: each rising edge samples one DQ[7:0] byte, enabling partial writes without read-modify-write cycles. This allows efficient updating of individual fields within a burst-aligned memory region.

Is DCARS enabled by default after power-up?

No. DCARS is disabled by default. It must be enabled by setting bit 7 of Configuration Register 1 (CR1) via a WRITE ANY REGISTER command. Once enabled, the RWDS output is phase-shifted by ½ CK cycle relative to CK during read transactions.

S70KL1283DPBHA020 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERRAM™ KL
Package/Case:
24-VBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
PSRAM
Technology:
PSRAM (Pseudo SRAM)
Memory Size:
128Mbit
Memory Organization:
16M x 8
Memory Interface:
SPI - Octal I/O
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
36ns
Access Time:
36 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S70KL1283DPBHA020 FAQ

1.How can I place an order for S70KL1283DPBHA020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S70KL1283DPBHA020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S70KL1283DPBHA020 reliable?

The price and inventory of S70KL1283DPBHA020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70KL1283DPBHA020 is usually 5 days.

3.What payment methods are accepted for S70KL1283DPBHA020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70KL1283DPBHA020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S70KL1283DPBHA020?

S70KL1283DPBHA020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S70KL1283DPBHA020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S70KL1283DPBHA020?

For technical support, including S70KL1283DPBHA020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70KL1283DPBHA020 requirements.

6.How does Aetrix verify that S70KL1283DPBHA020 is sourced from the original manufacturer or authorized distributors?

All S70KL1283DPBHA020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70KL1283DPBHA020 meets industry standards.

7.What is the process for return or replacement of S70KL1283DPBHA020?

All S70KL1283DPBHA020 units undergo pre-shipment inspection (PSI). If there is an issue with S70KL1283DPBHA020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S70KL1283DPBHA020 part is unused and in its original packaging.

Return procedure for S70KL1283DPBHA020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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