Infineon Technologies S70KS1281DPBHI020
- Part No.:
- S70KS1281DPBHI020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S70KS1281DPBHI020.pdf
- Description:
- IC PSRAM 128MBIT PAR 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,605
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Product details
Overview
S70KS1281DPBHI020 from Infineon Technologies (formerly Cypress) is a 128 Mb (16 MB) HyperRAM™ self-refresh DRAM with DDR interface, 1.8 V I/O supply, 12-signal bus, and 24-ball FBGA package. It delivers 333 MBps throughput at 166 MHz, supports wrapped/linear burst modes up to 128 bytes, and integrates autonomous refresh control for pseudo-static operation in embedded systems requiring high bandwidth and low pin count.
For engineers reviewing the S70KS1281DPBHI020 datasheet, S70KS1281DPBHI020 pinout, S70KS1281DPBHI020 application, or S70KS1281DPBHI020 equivalent, key selection factors include its HyperBus interface timing (DCARS), RWDS bidirectional strobe behavior, 1.8 V VCCQ compatibility, deep power-down current (20 µA), and dual-die stack architecture enabling 128 Mb density in a single 5×5 mm FBGA.
Technical Context
This device implements a dual-die stacked 64 Mb HyperRAM architecture in one package, operating as a single logical 128 Mb memory with unified command/address decoding and synchronized self-refresh. Its HyperBus interface uses center-aligned DDR transfers on DQ[7:0] with RWDS acting as both latency indicator and source-synchronous read strobe/write mask.
The DCARS (DDR Center-Aligned Read Strobe) function shifts RWDS phase relative to CK to align transitions within the read data eye, enabling reliable capture at 166 MHz. All transactions begin with CS# assertion and six-byte CA transfer, followed by configurable initial latency (1× or 2×) determined by RWDS level during CA phase.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 128 Mb (16 MB) - dual-die stack of two 64 Mb HyperRAM devices in single package |
| Interface | HyperBus DDR - 12-signal interface (CK/CK#, CS#, RWDS, DQ[7:0], VCC, VCCQ, VSS, VSSQ, RESET#) |
| Max Throughput | 333 MBps - achieved via double-data-rate transfers at 166 MHz clock (1.8 V VCCQ) |
| Burst Length | Configurable: 16/32/64/128 bytes - supports wrapped, linear, or hybrid burst types per transaction |
| Power Modes | Deep Power Down: 20 µA @ 1.8 V - enables ultra-low standby in battery-sensitive applications |
| Access Latency | tACC = 36 ns @ 166 MHz - defines minimum time from CK edge to valid first read data on DQ |
| Package | 24-ball FBGA, 5 × 5 mm, 0.8 mm pitch - surface-mount compatible with standard reflow profiles |
Pinout & Package
24-ball FBGA (5 × 5 mm, 0.8 mm pitch) with ball-out optimized for signal integrity and thermal dissipation in space-constrained designs. Pin functions validated per Infineon Document 001-97964 Rev. *N.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Source-synchronous timing reference for all DDR transfers; CK# enables robust noise immunity |
| CS# | Chip select input | Active-low enable for command/address/data transactions; deassertion terminates burst |
| RWDS | Bidirectional strobe/mask | Outputs initial latency indicator during CA phase; serves as read strobe or write mask during data phase |
| DQ[7:0] | Bi-directional data bus | 8-bit DDR data path carrying command, address, and payload; LV-CMOS compatible |
| RESET# | Hardware reset input | Asynchronous active-low reset that clears internal state and forces power-on initialization sequence |
| VCC / VCCQ | Power supplies | VCC = core voltage (1.8 V); VCCQ = I/O buffer voltage (1.8 V) - independent regulation required |
| VSS / VSSQ | GND references | VSS = core ground; VSSQ = I/O ground - separate planes recommended for noise isolation |
Key Features
| Feature | Design Value |
|---|---|
| Self-refresh DRAM core | Autonomous refresh logic eliminates host-level refresh management, presenting PSRAM-like simplicity |
| DCARS timing mode | RWDS phase shift relative to CK ensures optimal data capture window at 166 MHz DDR rates |
| Configurable burst type | Per-transaction selection of wrapped (cache-line fill) or linear (graphics streaming) burst behavior |
| Low-signal-count interface | 12-pin HyperBus replaces 30+ pin parallel interfaces, reducing PCB layer count and routing complexity |
| Deep Power Down mode | 20 µA shutdown current at 1.8 V enables multi-week battery operation in always-on edge nodes |
Applications
| Automotive Instrument Clusters | Industrial HMI Displays |
|---|---|
Use Scenario: Real-time rendering of vector graphics and animated gauges in digital dashboards with <50 ms UI response. IC Role / Device Role / Timing Role: High-bandwidth frame buffer memory interfaced to MCU's HyperBus controller; provides 333 MBps pixel data streaming. Use Value: Eliminates external SDRAM controller logic and reduces BOM cost while meeting ASIL-B timing predictability requirements. | Use Scenario: Local GUI rendering on 7-inch capacitive touch panels in factory HMIs with offline operation capability. IC Role / Device Role / Timing Role: Primary working memory for ARM Cortex-A53-based display processor; handles burst reads for bitmap overlays and font caching. Use Value: 128 MB density supports full-resolution UI assets; 20 µA deep power-down extends backup battery life beyond 48 hours. |
| Edge AI Inference Accelerators | Medical Imaging Preview Buffers |
Use Scenario: On-device inference for vision analytics using lightweight CNNs on microcontrollers with limited external memory support. IC Role / Device Role / Timing Role: Off-chip weight and activation buffer for neural network execution; accessed via burst reads/writes aligned to tensor dimensions. Use Value: Wrapped burst mode enables cache-line-aligned access to convolution kernel weights, improving MAC efficiency by 18% vs. linear bursts. | Use Scenario: Real-time preview rendering of ultrasound or endoscopic video streams before full-frame storage to NAND. IC Role / Device Role / Timing Role: Low-latency line buffer for video pipeline preprocessing (gamma correction, noise reduction) prior to compression. Use Value: 36 ns tACC and DCARS timing ensure sub-microsecond pixel fetch latency, preventing frame tearing in 60 fps preview. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed low-pin-count memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S70KL1281DPBHI020 | 3.0 V I/O variant; higher tACC (56 ns), lower max throughput (200 MBps) | Preferred where legacy 3.0 V system rails exist and 166 MHz timing not required | Select when existing power architecture prohibits 1.8 V VCCQ implementation |
| IS66WV1288GBLL-15BLI | Parallel SRAM interface (32-pin), no self-refresh, 15 ns async access | Used in deterministic real-time control loops where DDR latency variability is unacceptable | Choose only if system lacks HyperBus controller and requires true zero-wait-state access |
Compared with S70KL1281DPBHI020, the 1.8 V S70KS1281DPBHI020 offers 66% higher bandwidth and 30% lower active current but requires differential clock routing; versus IS66WV1288GBLL-15BLI, it trades deterministic latency for 4× density and 70% lower pin count at the cost of DDR protocol complexity.
Availability
S70KS1281DPBHI020 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMIs, and edge AI accelerators requiring stable component supply, long-term lifecycle assurance, and qualified automotive-grade packaging.
Supply support for S70KS1281DPBHI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, sensing, and connectivity solutions for automotive, industrial, and IoT markets.
This part belongs to the HyperRAM™ product line, designed specifically to replace parallel PSRAM and low-density SDRAM in resource-constrained embedded systems needing high bandwidth with minimal board area and signal count.
FAQ
What is the function of the RWDS pin during HyperBus read and write operations?
RWDS serves three distinct roles: during command/address transfer, it outputs a level indicating required initial latency; during read bursts, it acts as a source-synchronous edge-aligned read strobe; during write bursts, it functions as a byte mask (HIGH = masked, LOW = written). This bidirectional behavior is fundamental to HyperBus timing compliance and must be correctly terminated per Infineon layout guidelines.
Does S70KS1281DPBHI020 require external refresh management from the host controller?
No. The device contains fully autonomous self-refresh circuitry that executes internal refresh cycles without host intervention. The host sees only a pseudo-static interface - no refresh commands, counters, or scheduling are needed. However, the host must honor RWDS-driven initial latency indications and avoid excessively long bursts that could block internal refresh windows.
Can S70KS1281DPBHI020 operate with single-ended clock instead of differential CK/CK#?
No. This 1.8 V variant mandates differential clock signaling (CK/CK#) as specified in the HyperBus standard. Single-ended clock operation is only supported on 3.0 V variants like S70KL1281. Attempting single-ended drive on S70KS1281DPBHI020 will violate setup/hold timing and cause transaction failures.
What is the significance of "Not Recommended for New Designs" (NRND) status for this part?
Infineon has designated S70KS1281DPBHI020 as NRND per document 001-97964 Rev. *N, indicating future production may be limited. Aetrix Electronics maintains active inventory and supply chain continuity support, including last-time-buy planning and migration path guidance to next-generation HyperRAM devices such as the S70KL/S70KS series with extended lifecycle commitments.
S70KS1281DPBHI020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERRAM™ KS
- Package/Case:
- 24-VBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- PSRAM
- Technology:
- PSRAM (Pseudo SRAM)
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 36 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S70KS1281DPBHI020 FAQ
1.How can I place an order for S70KS1281DPBHI020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70KS1281DPBHI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70KS1281DPBHI020 reliable?
The price and inventory of S70KS1281DPBHI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70KS1281DPBHI020 is usually 5 days.
3.What payment methods are accepted for S70KS1281DPBHI020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70KS1281DPBHI020 transactions.
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4.How is shipping managed for S70KS1281DPBHI020?
S70KS1281DPBHI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70KS1281DPBHI020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70KS1281DPBHI020?
For technical support, including S70KS1281DPBHI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70KS1281DPBHI020 requirements.
6.How does Aetrix verify that S70KS1281DPBHI020 is sourced from the original manufacturer or authorized distributors?
All S70KS1281DPBHI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70KS1281DPBHI020 meets industry standards.
7.What is the process for return or replacement of S70KS1281DPBHI020?
All S70KS1281DPBHI020 units undergo pre-shipment inspection (PSI). If there is an issue with S70KS1281DPBHI020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70KS1281DPBHI020 part is unused and in its original packaging.
Return procedure for S70KS1281DPBHI020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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