Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies S70KS1281DPBHV020

Part No.:
S70KS1281DPBHV020
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS70KS1281DPBHV020.pdf
Description:
IC PSRAM 128MBIT PAR 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,572

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

S70KS1281DPBHV020 from Infineon Technologies (formerly Cypress) is a 128 Mb (16 MB) HyperRAM™ self-refresh DRAM with DDR interface, 1.8 V I/O supply, differential clock support (CK/CK#), 8-bit data bus (DQ[7:0]), and bidirectional RWDS strobe/mask signal. It delivers 333 MBps throughput at 166 MHz, operates in FBGA-24 package, and targets high-bandwidth, low-pin-count memory expansion in embedded graphics and AI edge inference accelerators.

For engineers reviewing the S70KS1281DPBHV020 datasheet, S70KS1281DPBHV020 pinout, S70KS1281DPBHV020 application, or S70KS1281DPBHV020 equivalent, key selection criteria include DDR timing compliance (tACC ≤ 36 ns at 166 MHz), DCARS phase-shifted RWDS alignment, configurable burst length (16–128 bytes), deep power-down current (20 µA at 1.8 V), and HyperBus interface compatibility with PSoC™ and XMC™ host controllers.

Technical Context

This device implements a dual-die stacked architecture integrating two 64 Mb HyperRAM cores in one FBGA-24 package, enabling 128 Mb density without increasing signal count. It uses internal self-refresh logic to eliminate external refresh commands, presenting as pseudo-static RAM to the host while retaining DRAM density advantages.

The HyperBus interface employs center-aligned DDR transfers on DQ[7:0], with RWDS serving dual roles: outputting initial latency indication during CA transfer, then acting as source-synchronous read strobe or write mask during data phases. DCARS functionality shifts RWDS edge timing relative to CK to maximize read data eye margin.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 128 Mb (16 MB) - dual-die stack of two 64 Mb HyperRAM cores for compact high-capacity buffer memory
Data Bus Width 8-bit (DQ[7:0]) - low-signal-count interface reducing PCB routing complexity and EMI
Max Clock Rate 166 MHz at 1.8 V - enables 333 MBps DDR bandwidth for real-time frame buffering
Access Time tACC = 36 ns at 166 MHz - defines minimum time from CS# assertion to first valid read word
Deep Power-Down Current 20 µA at 1.8 V, 105 °C - supports ultra-low-power sleep states in battery-operated edge devices
Burst Length Configurable 16/32/64/128 bytes - matches cache line sizes and image tile dimensions
RWDS Function Bidirectional strobe/mask - indicates refresh latency pre-transfer, then aligns read data or masks write bytes

Pinout & Package

Package: 24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/Terminal Circuit Role Design Meaning
CS# Chip Select Input Active-low enable for command/address/data transactions; deassertion terminates burst
CK / CK# Differential Clock Input Source-synchronous DDR timing reference; CK rising/falling edges sample DQ and RWDS
RWDS Bidirectional Strobe/Mask Output during CA phase (latency indicator); input/output during data phase (read strobe/write mask)
DQ[7:0] Bi-directional Data Bus DDR data path carrying command, address, and payload; LV-CMOS compatible at 1.8 V
VCC / VCCQ Power Supplies VCC = 1.8 V core supply; VCCQ = 1.8 V I/O supply - decoupling required per datasheet layout guidelines
RESET# Hardware Reset Input Asynchronous active-low reset that clears internal state and forces power-on initialization sequence

Key Features

Feature Design Value
Self-Refresh DRAM Core Eliminates host-managed refresh overhead; maintains data integrity during idle periods without CPU intervention
DCARS Timing Mode Phase-shifts RWDS edge relative to CK to center it within read data eye, improving timing margin by ≥150 ps
Configurable Burst Type Per-transaction selection of wrapped (cache-line fill) or linear (image streaming) burst, enabling dynamic optimization
Dual-Voltage I/O Support 1.8 V only (S70KS1281DPBHV020) - optimized for low-power SoC interfaces with matched voltage domains
Deep Power-Down Mode Reduces standby current to 20 µA - extends battery life in always-on sensor fusion and voice wake-up systems

Applications

Embedded Graphics Frame Buffer AI Edge Inference Accelerator Memory

Use Scenario: Storing rendered UI frames and overlay buffers in automotive instrument clusters with limited PCB area.

IC Role / Device Role / Timing Role: High-bandwidth, low-pin-count PSRAM replacing LPDDR2 to simplify layout and reduce EMI.

Use Value: 333 MBps bandwidth sustains 1080p@60fps rendering; 24-ball FBGA fits tight space constraints behind display controller.

Use Scenario: Offloading intermediate tensor activations from NPU core during real-time object detection on smart cameras.

IC Role / Device Role / Timing Role: Burst-accessible scratchpad memory with deterministic latency for activation caching.

Use Value: Configurable 64-byte wrapped bursts match typical convolution kernel tile sizes; DCARS ensures reliable read capture at 166 MHz.

Industrial HMI Display Controller Medical Ultrasound Image Pipeline Buffer

Use Scenario: Holding GUI assets and animation sequences in programmable logic controller HMIs with flash-based firmware.

IC Role / Device Role / Timing Role: Non-volatile-equivalent memory accessed via HyperBus to avoid SRAM cost and density limits.

Use Value: Self-refresh eliminates refresh interrupt servicing; deep power-down mode cuts system idle power by >40%.

Use Scenario: Temporarily storing beamformed RF data before FFT processing in portable ultrasound probes.

IC Role / Device Role / Timing Role: Low-latency, high-throughput memory buffer synchronized to ADC sampling clock via CK/CK#.

Use Value: 36 ns tACC enables sub-microsecond access to critical echo samples; RWDS masking supports partial write of incomplete scan lines.

Equivalent & Alternatives

The following parts are listed as comparable options for similar self-refresh DRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
S70KL1281DPBHV020 3.0 V I/O supply (VCCQ), same 128 Mb density and FBGA-24 package Requires 3.0 V I/O rail; higher tACC (56 ns at 100 MHz) limits bandwidth-critical use cases Select when legacy 3.0 V host interface exists and 200 MBps throughput suffices
S27KS0641DPBHV020 64 Mb density, identical 1.8 V I/O, FBGA-24, and DCARS support Half memory capacity; lower burst current (60 mA vs. 72 mA) eases thermal design Choose for cost-sensitive designs where 8 MB buffer meets application requirements

Compared with S70KL1281DPBHV020 and S27KS0641DPBHV020, S70KS1281DPBHV020 uniquely balances 128 Mb density, 1.8 V low-power operation, and 333 MBps bandwidth-making it optimal for next-generation edge AI and graphics subsystems requiring both capacity and speed within strict pin and power budgets.

Availability

S70KS1281DPBHV020 is available at Aetrix Electronics and suitable for embedded graphics frame buffers, AI edge inference accelerators, industrial HMI display controllers, and medical ultrasound image pipeline buffers requiring stable component supply and long-term lifecycle support.

Supply support for S70KS1281DPBHV020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensing, connectivity, and memory solutions for automotive, industrial, and IoT markets.

This part belongs to Infineon's HyperRAM™ product line-designed specifically to replace SRAM and low-density DDR in resource-constrained embedded systems where signal count, power, and board space are critical constraints.

FAQ

Is S70KS1281DPBHV020 pin-compatible with S27KS0641DPBHV020?

Yes-both use identical 24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch) footprint and share identical pin assignments for CS#, CK/CK#, RWDS, DQ[7:0], RESET#, and power terminals. The only difference is memory density (128 Mb vs. 64 Mb), allowing drop-in replacement where capacity permits.

Does this device require external refresh circuitry?

No-S70KS1281DPBHV020 integrates autonomous self-refresh logic that executes internal row refresh cycles without host intervention. The host sees it as pseudo-static RAM; no refresh commands, timers, or scheduling are needed.

What is the purpose of the RWDS signal in read versus write operations?

In reads, RWDS acts as a source-synchronous strobe edge-aligned with DQ transitions to capture data reliably. In writes, it serves as a byte mask: HIGH prevents writing to the corresponding DQ byte, enabling partial-word updates without read-modify-write cycles.

Can DCARS mode be disabled?

No-DCARS (DDR Center-Aligned Read Strobe) is a fixed hardware feature of the HyperRAM architecture. The phase shift between RWDS and CK is internally generated and cannot be bypassed; it is essential for meeting tACC and setup/hold timing at 166 MHz.

S70KS1281DPBHV020 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERRAM™ KS
Package/Case:
24-VBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
PSRAM
Technology:
PSRAM (Pseudo SRAM)
Memory Size:
128Mbit
Memory Organization:
16M x 8
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
36 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S70KS1281DPBHV020 FAQ

1.How can I place an order for S70KS1281DPBHV020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S70KS1281DPBHV020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S70KS1281DPBHV020 reliable?

The price and inventory of S70KS1281DPBHV020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70KS1281DPBHV020 is usually 5 days.

3.What payment methods are accepted for S70KS1281DPBHV020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70KS1281DPBHV020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S70KS1281DPBHV020?

S70KS1281DPBHV020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S70KS1281DPBHV020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S70KS1281DPBHV020?

For technical support, including S70KS1281DPBHV020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70KS1281DPBHV020 requirements.

6.How does Aetrix verify that S70KS1281DPBHV020 is sourced from the original manufacturer or authorized distributors?

All S70KS1281DPBHV020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70KS1281DPBHV020 meets industry standards.

7.What is the process for return or replacement of S70KS1281DPBHV020?

All S70KS1281DPBHV020 units undergo pre-shipment inspection (PSI). If there is an issue with S70KS1281DPBHV020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S70KS1281DPBHV020 part is unused and in its original packaging.

Return procedure for S70KS1281DPBHV020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S70KS1281DPBHV020 Tags

  • S70KS1281DPBHV020
  • S70KS1281DPBHV020 PDF
  • S70KS1281DPBHV020 Datasheet
  • S70KS1281DPBHV020 Specifications
  • S70KS1281DPBHV020 Images
  • Infineon Technologies
  • Infineon Technologies S70KS1281DPBHV020
  • Buy S70KS1281DPBHV020
  • S70KS1281DPBHV020 Price
  • S70KS1281DPBHV020 Distributor
  • S70KS1281DPBHV020 Supplier
  • S70KS1281DPBHV020 Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER