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Infineon Technologies S70KS1282GABHA020

Part No.:
S70KS1282GABHA020
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS70KS1282GABHA020.pdf
Description:
IC PSRAM 128MBIT HYPERBUS 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,336

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Product details

Overview

S70KS1282GABHA020 from Infineon is a 128 Mb self-refresh DRAM (PSRAM) with HYPERBUS™ interface, operating at 1.8 V/3.0 V, supporting up to 200 MHz DDR clock rate and 400 MBps data throughput. It features 8-bit DQ bus, bidirectional RWDS strobe, configurable burst lengths (16–128 bytes), and hybrid sleep/deep power-down modes for low-power embedded systems requiring high-bandwidth external memory.

For engineers reviewing the S70KS1282GABHA020 datasheet, S70KS1282GABHA020 pinout, S70KS1282GABHA020 application, or S70KS1282GABHA020 equivalent, key selection factors include HYPERBUS™ timing compliance, RWDS phase alignment for read eye optimization, partial array refresh support, and AEC-Q100 Grade 2 automotive qualification (–40°C to +105°C).

Technical Context

This PSRAM implements a stacked-die architecture (two 64 Mb dies) with on-die self-refresh control logic, eliminating host-managed refresh cycles. It uses LV-CMOS signaling across all I/Os and supports both single-ended (CK) and optional differential (CK/CK#) clocking with 11–12 signal count depending on configuration.

The HYPERBUS™ interface transfers command/address and data over the same 8-bit DQ[7:0] bus using center-aligned CA capture and DDR data transfers. RWDS serves dual roles: as a read data strobe (phase-shifted for DCARS) and write data mask, with initial latency indication at transaction start to signal internal refresh needs.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density128 Mb (2 × 64 Mb stacked die)
Clock RateUp to 200 MHz DDR - enables 400 MBps peak bandwidth
Interface Voltage1.8 V or 3.0 V VCC/VCCQ - dual-supply compatibility for mixed-voltage SoC integration
Burst Length16/32/64/128 bytes (wrapped or linear) - balances latency and throughput per access pattern
Access Time (tACC)35 ns max - defines minimum time from address valid to first data valid
Deep Power Down Current330 µA @ 2.0 V, 105°C - enables ultra-low standby in battery-constrained applications
Operating Temp–40°C to +105°C (AEC-Q100 Grade 2) - qualified for under-hood automotive use

Pinout & Package

24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip SelectActive-low enable for command/address/data transactions; deassertion terminates current transaction
CK / CK#Clock InputDifferential clock pair for DDR timing reference; supports optional single-ended CK mode
RWDSRead-Write Data StrobeBidirectional: output as read strobe (DCARS-aligned), input as write mask; signals refresh latency at start of transaction
DQ[7:0]Data Bus8-bit bidirectional LV-CMOS bus for multiplexed command/address/data transfer
RESET#Hardware ResetAsynchronous active-low reset that clears internal state and forces re-initialization

Key Features

FeatureDesign Value
HYPERBUS™ Interface11–12 signal count DDR interface delivering PSRAM simplicity with DRAM density and bandwidth
DCARS SupportProgrammable DDR center-aligned read strobe phase shift improves timing margin in high-speed read operations
Configurable Drive StrengthAdjustable output drive on DQ/RWDS reduces signal integrity risk across varied PCB trace lengths and loads
Partial Array RefreshRefresh can be limited to 1/8, 1/4, or 1/2 of array - lowers average current during light traffic
Hybrid Sleep ModePer-die power gating allows one 64 Mb die to sleep while the other remains active - enables asymmetric memory partitioning

Applications

Automotive ADAS Camera ProcessingIndustrial HMI Display Buffering

Use Scenario: Real-time buffering of 1080p60 video frames between image sensor and SoC ISP pipeline.

IC Role / Device Role / Timing Role: External frame buffer providing low-latency, high-throughput memory expansion with deterministic tACC ≤35 ns.

Use Value: Enables seamless frame stitching without external refresh management, reducing CPU overhead and jitter in vision processing loops.

Use Scenario: Storing GUI assets and rendering buffers for 7-inch capacitive touch displays in factory HMIs.

IC Role / Device Role / Timing Role: PSRAM serving as unified code+data memory extension for ARM Cortex-M7 microcontrollers.

Use Value: Eliminates need for separate SRAM and Flash, simplifying BOM while maintaining 400 MBps pixel fill rate for smooth animation.

Medical Ultrasound BeamformingEdge AI Inference Accelerator

Use Scenario: Temporary storage of echo sample streams during real-time beam synthesis in portable ultrasound units.

IC Role / Device Role / Timing Role: Low-power, high-bandwidth memory supporting burst-aligned DMA transfers synchronized to ADC sampling clocks.

Use Value: Hybrid sleep mode cuts idle current to 330 µA, extending battery life without compromising acquisition fidelity.

Use Scenario: Holding intermediate tensor buffers during convolutional layer execution on FPGA-based inference engines.

IC Role / Device Role / Timing Role: High-speed external memory mapped into AXI4 address space via HYPERBUS™ controller IP.

Use Value: Configurable burst length (up to 128 bytes) matches typical weight matrix tile sizes, minimizing bus turnaround overhead.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PSRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY15B104QN-SXIT4 Mb Quad SPI FRAM, 108 MHz max, no refresh required, 3.3 V onlyLower density, byte-level random writes, no burst optimization or RWDS timing controlSelect when deterministic write latency and infinite endurance outweigh bandwidth and capacity needs
IS66WV12816EBLL-15BLI128 Mb parallel async SRAM, 15 ns tAA, 3.3 V, 48-pin TSOPHigher pin count (48 vs 24), no built-in refresh, higher static power (≈25 mA standby)Select when legacy parallel bus interface exists and system clock domain cannot support HYPERBUS™ timing constraints

Compared with CY15B104QN-SXIT and IS66WV12816EBLL-15BLI, S70KS1282GABHA020 uniquely delivers DRAM-scale density with SRAM-like ease-of-use, HYPERBUS™'s low-pin-count DDR efficiency, and automotive-grade thermal/power behavior - making it optimal for bandwidth-constrained, safety-aware embedded systems.

Availability

S70KS1282GABHA020 is available at Aetrix Electronics and suitable for automotive ADAS subsystems, industrial HMI platforms, medical imaging modules, and edge AI accelerators requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S70KS1282GABHA020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.

S70KS1282GABHA020 belongs to the HYPERRAM™ product line, designed specifically to bridge the gap between SRAM simplicity and DRAM density for high-performance, low-pin-count external memory in resource-constrained embedded and automotive systems.

FAQ

Does S70KS1282GABHA020 require external refresh circuitry?

No. It integrates self-refresh logic that autonomously manages DRAM array refresh during idle periods. The host only needs to observe initial latency indications via RWDS and limit burst duration to allow internal refresh - no external refresh controller or timing software is required.

What is the purpose of the RWDS signal in read versus write operations?

In read operations, RWDS acts as a phase-shifted data strobe (DCARS) aligned to the center of the read data eye. In write operations, it functions as a write data mask, allowing selective byte enabling. Its assertion at transaction start also signals pending refresh latency to the host.

Can both 64 Mb dies operate simultaneously in S70KS1282GABHA020?

No. The two stacked dies share the same DQ, RWDS, and clock resources. Only one die is active per transaction. While hybrid sleep allows one die to power down independently, concurrent read/write to both dies is not supported by the HYPERBUS™ protocol or physical interface.

Is DCARS functionality enabled by default, and how is it configured?

DCARS is disabled by default. It is enabled by setting bit 7 of Configuration Register 1 (CR1). Once enabled, the internal phase shifter offsets RWDS by half a clock cycle relative to CK, improving setup/hold margins for high-speed reads - configuration is retained across power cycles if VCC remains applied.

S70KS1282GABHA020 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERRAM™ KL
Package/Case:
24-VBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
PSRAM
Technology:
PSRAM (Pseudo SRAM)
Memory Size:
128Mbit
Memory Organization:
16M x 8
Memory Interface:
HyperBus
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
35ns
Access Time:
35 ns
Voltage - Supply:
1.7V ~ 2V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S70KS1282GABHA020 FAQ

1.How can I place an order for S70KS1282GABHA020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S70KS1282GABHA020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S70KS1282GABHA020 reliable?

The price and inventory of S70KS1282GABHA020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70KS1282GABHA020 is usually 5 days.

3.What payment methods are accepted for S70KS1282GABHA020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70KS1282GABHA020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S70KS1282GABHA020?

S70KS1282GABHA020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S70KS1282GABHA020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S70KS1282GABHA020?

For technical support, including S70KS1282GABHA020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70KS1282GABHA020 requirements.

6.How does Aetrix verify that S70KS1282GABHA020 is sourced from the original manufacturer or authorized distributors?

All S70KS1282GABHA020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70KS1282GABHA020 meets industry standards.

7.What is the process for return or replacement of S70KS1282GABHA020?

All S70KS1282GABHA020 units undergo pre-shipment inspection (PSI). If there is an issue with S70KS1282GABHA020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S70KS1282GABHA020 part is unused and in its original packaging.

Return procedure for S70KS1282GABHA020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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