Infineon Technologies S70KS1283GABHB020
- Part No.:
- S70KS1283GABHB020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S70KS1283GABHB020.pdf
- Description:
- IC PSRAM 128MBIT SPI/OCTL 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,809
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Product details
Overview
S70KS1283GABHB020 from Infineon is a 128 Mb pseudo-static RAM (PSRAM) with self-refresh DRAM architecture, octal xSPI interface, and dual-voltage support (1.8 V/3.0 V). It delivers up to 400 MBps data throughput at 200 MHz DDR clock rate, features configurable burst lengths (16–128 bytes), and supports Hybrid Sleep and Deep Power Down modes for low-power embedded systems.
For engineers reviewing the S70KS1283GABHB020 datasheet, S70KS1283GABHB020 pinout, S70KS1283GABHB020 application, or S70KS1283GABHB020 equivalent, key selection criteria include octal xSPI timing compliance, RWDS strobe behavior in read/write transactions, DCARS phase-shifted strobe support, 24-ball FBGA package compatibility, and AEC-Q100 Grade 2 automotive qualification (–40°C to +105°C).
Technical Context
This PSRAM implements stacked-die architecture (two 64 Mb dies), with independent power mode control per die. The xSPI interface uses 11–12 signals including single-ended or optional differential CK/CK#, CS#, DQ[7:0], RESET#, and bidirectional RWDS - which serves as refresh latency indicator, read data strobe, and write mask.
It supports linear and wrapped burst modes (8–64 clocks), DDR data transfers on both clock edges, and configurable output drive strength. Refresh is fully autonomous; no host intervention required. DCARS functionality enables RWDS edge placement within the read data eye via a phase-shifted clock derived from CK.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 128 Mb (2 × 64 Mb stacked-die configuration) |
| Interface | Octal xSPI with 8-bit DQ bus and RWDS strobe |
| Max Clock Rate | 200 MHz DDR (400 MT/s) at both 1.8 V and 3.0 V |
| Burst Length | Configurable: 16/32/64/128 bytes (8/16/32/64 clocks) |
| Power Modes | Hybrid Sleep (per-die), Deep Power Down (per-die), Interface Standby |
| Access Time | tACC = 35 ns maximum (critical for timing margin in high-speed controllers) |
| Operating Temp | AEC-Q100 Grade 2: –40°C to +105°C (validated for automotive under-hood use) |
Pinout & Package
Package: 24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Clock input (single-ended or differential) | DDR timing reference; CK# enables jitter-immune clock recovery when used differentially |
| CS# | Chip select (active-low) | Enables device communication; must be asserted before command/address transmission |
| RWDS | Bidirectional read-write data strobe | Indicates refresh latency at transaction start; acts as read strobe or write mask depending on direction |
| DQ[7:0] | Octal data I/O bus | Carries command, address, and data; supports DDR transfers on both CK edges |
| RESET# | Hardware reset (active-low) | Asynchronous reset that clears internal state and forces re-initialization sequence |
Key Features
| Feature | Design Value |
|---|---|
| Self-refresh DRAM core | Eliminates host-managed refresh overhead; appears as SRAM to controller firmware |
| DCARS (DDR Center-Aligned Read Strobe) | Phase-shifts RWDS relative to CK to center strobe edge in read data eye - improves timing margin at 200 MHz |
| Per-die power mode control | Enables one 64 Mb die to enter Hybrid Sleep while the other remains active - supports asymmetric memory usage |
| Configurable output drive strength | Allows signal integrity tuning for varying trace length/load without external termination |
| Octal xSPI command set | Standardized protocol (JEDEC JESD251) enables drop-in replacement across vendor PSRAMs with compatible timing |
Applications
| Automotive ADAS Display Buffer | Industrial HMI Frame Memory |
|---|---|
Use Scenario: High-resolution infotainment display buffer requiring low-latency, burst-access memory with minimal CPU intervention. IC Role / Device Role / Timing Role: PSRAM serves as frame buffer between GPU and display controller, accepting octal xSPI writes and supplying DDR-aligned pixel data via RWDS-synchronized reads. Use Value: 400 MBps throughput sustains 1080p60 RGB888 rendering; AEC-Q100 Grade 2 rating ensures reliability in vehicle cabin environments. | Use Scenario: Touch-enabled factory HMI panel with real-time UI updates and persistent widget state storage. IC Role / Device Role / Timing Role: Acts as main working memory for ARM Cortex-A MCU, interfacing directly via xSPI without glue logic or external refresh controller. Use Value: Hybrid Sleep mode reduces idle current to 330 µA at 2.0 V, extending uptime in battery-backed industrial gateways. |
| Edge AI Inference Scratchpad | Medical Imaging Data Pipeline |
Use Scenario: On-device neural network accelerator requiring fast, low-power scratchpad memory for intermediate tensor buffers. IC Role / Device Role / Timing Role: Provides burst-accessible temporary storage for convolution layer outputs; configured for 64-byte wrapped bursts to match tile size. Use Value: Configurable drive strength and DCARS optimize signal integrity on compact PCBs; 35 ns tACC meets tight inference loop timing budgets. | Use Scenario: Portable ultrasound device capturing and preprocessing real-time RF echo data before compression and transmission. IC Role / Device Role / Timing Role: Buffers raw ADC streams at >200 MBps, using linear bursts to sustain continuous write throughput while supporting concurrent read for DSP prefiltering. Use Value: Dual-voltage support (1.8 V/3.0 V) allows seamless integration with mixed-supply SoC platforms; industrial temperature range covers clinical operating conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PSRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S27KL0641DPBHI020 | 64 Mb density, same 24-ball FBGA, identical xSPI command set but no DCARS support | Lacks RWDS phase-shifting capability; limits max reliable read timing margin at 200 MHz | Select when system timing budget allows ≥40 ns tACC or when cost-sensitive and full 128 Mb not required |
| Micron MT46H128M16LFQ-15E | LPDDR2 interface (not xSPI), 200-ball BGA, requires host-controlled refresh and PHY-level timing calibration | Demands dedicated memory controller IP and higher PCB routing complexity | Choose only if existing platform already supports LPDDR2 and bandwidth >400 MBps is needed |
Compared with S27KL0641DPBHI020 and MT46H128M16LFQ-15E, the S70KS1283GABHB020 uniquely combines 128 Mb density, octal xSPI simplicity, autonomous refresh, and DCARS-enhanced timing margin - making it optimal for space-constrained, high-reliability embedded designs where SRAM-like ease-of-use and DRAM-like density are both essential.
Availability
S70KS1283GABHB020 is available at Aetrix Electronics and suitable for automotive ADAS displays, industrial HMIs, edge AI accelerators, and portable medical imaging devices requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S70KS1283GABHB020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
The HYPERRAM™ product line targets high-bandwidth, low-pin-count memory expansion for resource-constrained microcontrollers and SoCs - enabling SRAM-like interface simplicity with DRAM-class density and power efficiency.
FAQ
Does S70KS1283GABHB020 require external refresh circuitry?
No. The device integrates autonomous self-refresh logic that manages DRAM array refresh without host intervention. The controller sees only standard xSPI commands; no refresh cycles, timers, or scheduling are needed in firmware or hardware design.
What is the function of the RWDS pin during write transactions?
During write operations, RWDS functions as a write data mask: each bit controls whether the corresponding DQ[7:0] lane accepts data. This enables partial-byte writes without read-modify-write sequences, reducing bus traffic and improving efficiency in byte-aligned update scenarios.
Can both 64 Mb dies operate independently in different power modes?
Yes. The stacked-die architecture allows one die to enter Hybrid Sleep or Deep Power Down while the other remains active and accessible. This enables asymmetric memory partitioning - e.g., keeping firmware code resident while powering down unused data buffers.
Is DCARS supported in all package variants of S70KS1283?
Yes. DCARS functionality is implemented in silicon and enabled by default in all S70KS1283 variants, including the 24-ball FBGA (GABHB020). Its operation depends solely on register configuration and CK frequency - not on package type or ball count.
S70KS1283GABHB020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERRAM™ KS
- Package/Case:
- 24-VBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- PSRAM
- Technology:
- PSRAM (Pseudo SRAM)
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- SPI - Octal I/O
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 35 ns
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S70KS1283GABHB020 FAQ
1.How can I place an order for S70KS1283GABHB020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S70KS1283GABHB020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S70KS1283GABHB020 reliable?
The price and inventory of S70KS1283GABHB020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S70KS1283GABHB020 is usually 5 days.
3.What payment methods are accepted for S70KS1283GABHB020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S70KS1283GABHB020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S70KS1283GABHB020?
S70KS1283GABHB020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S70KS1283GABHB020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S70KS1283GABHB020?
For technical support, including S70KS1283GABHB020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S70KS1283GABHB020 requirements.
6.How does Aetrix verify that S70KS1283GABHB020 is sourced from the original manufacturer or authorized distributors?
All S70KS1283GABHB020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S70KS1283GABHB020 meets industry standards.
7.What is the process for return or replacement of S70KS1283GABHB020?
All S70KS1283GABHB020 units undergo pre-shipment inspection (PSI). If there is an issue with S70KS1283GABHB020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S70KS1283GABHB020 part is unused and in its original packaging.
Return procedure for S70KS1283GABHB020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S70KS1283GABHB020 Tags

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