Infineon Technologies S71GL064NB0BHW0P0

Overview

S71GL064NB0BHW0P0 from Spansion is a stacked Multi-Chip Product (MCP) integrating 64 Mb (4M × 16-bit) 3.0 V-only Page Mode Flash memory and 32 Mb (2M × 16-bit) Pseudo Static RAM in a single 56-ball FBGA package. It supports 90 ns Flash access, 70 ns pSRAM access, and operates across –25°C to +85°C for wireless applications requiring nonvolatile storage and fast SRAM-like execution.

For engineers reviewing the S71GL064NB0BHW0P0 datasheet, S71GL064NB0BHW0P0 pinout, S71GL064NB0BHW0P0 application, or S71GL064NB0BHW0P0 equivalent, key selection criteria include shared address/data bus operation, dual chip enable control (CE1#f/CE1#s/CE2s), boot sector configuration (Top Boot), and 2.7–3.3 V supply compatibility with separate VCCf/VCCS rails.

Technical Context

This MCP implements independent Flash and pSRAM die in a monolithic 7 × 9 mm FBGA, sharing DQ15–DQ0 and A20–A0 (with A21 active for 64 Mb Flash). The Flash uses MirrorBit® 110 nm process with bottom/top boot sector options; the pSRAM is Type 9 with UB#/LB# byte controls and asynchronous interface timing.

Operation requires separate power domains: VCCf (Flash) and VCCs (pSRAM), both rated 2.7–3.3 V. RY/BY# reports Flash busy state; RESET# is active-low hardware reset; WP#/ACC enables write protection or program acceleration. CE1#f selects Flash only; CE1#s and CE2s jointly enable pSRAM.

Key Specifications

Pinout & Package

56-ball Fine-Pitch Ball Grid Array (FBGA), 7 mm × 9 mm × 1.2 mm body, JEDEC-compliant TLC056 footprint with depopulated balls at A1,A8,D4,D5,E4,E5,H1,H8.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar stacked Flash+RAM MCP applications.

Compared with S71GL064NB0BHW0P0, the BF variant offers identical functionality with standard lead-free compliance, while the S71GL032NA0BHW0K0 reduces density and cost for less demanding applications-both retain shared bus architecture and Top Boot configuration.

Availability

S71GL064NB0BHW0P0 is available at Aetrix Electronics and suitable for wireless infrastructure, industrial HMI controllers, and automotive infotainment systems requiring stable component supply with guaranteed long-term lifecycle support.

Supply support for S71GL064NB0BHW0P0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Spansion Inc. was a fabless semiconductor company specializing in flash memory and microcontrollers, later acquired by Cypress Semiconductor in 2015 and integrated into Infineon Technologies.

The S71GL-N series targets embedded systems needing compact, low-power nonvolatile memory with integrated execution RAM-designed specifically for space-constrained wireless, industrial, and automotive applications where board real estate and power efficiency are critical.

FAQ

What is the function of the WP#/ACC pin on S71GL064NB0BHW0P0?

The WP#/ACC pin serves dual roles: pulled low, it enables hardware write protection for the Flash memory, preventing accidental program/erase operations; pulled high, it activates acceleration mode during programming to reduce pulse width requirements and improve write throughput. This pin does not affect pSRAM operation.

Can S71GL064NB0BHW0P0 operate with a single 3.0 V supply?

No-S71GL064NB0BHW0P0 requires two independent 2.7–3.3 V supplies: VCCf for the Flash die and VCCs for the pSRAM die. These rails must be separately decoupled and may be powered in any sequence, but both must be within specification before asserting CE signals to avoid undefined behavior or latch-up risk.

How does the CE1#s and CE2s pin combination control the pSRAM?

The pSRAM requires both CE1#s and CE2s to be asserted low simultaneously for device selection-neither alone enables the pSRAM. This dual-enable scheme prevents partial activation during bus contention and supports hierarchical memory mapping when multiple MCPs share the same address/data bus in larger systems.

Is the RY/BY# signal compatible with standard Flash ready/busy interfaces?

Yes-RY/BY# is an open-drain output that sinks current when Flash is busy (programming or erasing) and floats high when ready. It connects directly to standard MCU GPIO pins with pull-up resistors and is electrically and functionally compatible with industry-standard Flash RY/BY# timing specifications per JEDEC JESD22-A117.