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Infineon Technologies S71KL256SC0BHB000

Part No.:
S71KL256SC0BHB000
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS71KL256SC0BHB000.pdf
Description:
IC FLASH RAM 256MBIT PAR 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,738

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Product details

Overview

S71KL256SC0BHB000 from Cypress Semiconductor is a 3.0V HyperBus Multi-Chip Package integrating 256 Mb (32 MB) HyperFlash NOR memory and 64 Mb (8 MB) HyperRAM self-refresh DRAM in a single FBGA-24 package. It delivers high-speed DDR interface operation up to 100 MHz (200 MB/s), supports chip-select isolation between Flash and RAM, and enables compact embedded systems requiring concurrent code execution and fast data buffering.

For engineers reviewing the S71KL256SC0BHB000 datasheet, S71KL256SC0BHB000 pinout, S71KL256SC0BHB000 application, or S71KL256SC0BHB000 equivalent, key selection criteria include HyperBus interface timing compliance, dual-memory arbitration behavior, RWDS bidirectional strobe/mask functionality, and FBGA-24 mechanical compatibility with 6 × 8 × 1.0 mm footprint.

Technical Context

The device implements a shared HyperBus interface with separate chip selects (CS1# for HyperFlash, CS2# for HyperRAM), enabling independent access without bus contention. It uses a single-ended clock (CK) at 3.0V, with RWDS serving as both read data strobe and write data mask for HyperRAM only.

Internal power domains are segregated: VCC/VSS for core logic, VCCQ/VSSQ for I/O, and RESET# affects HyperFlash only while RSTO# provides system-level POR signaling. The MCP architecture maintains signal integrity by minimizing trace count versus discrete memory solutions.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Configuration256 Mb HyperFlash + 64 Mb HyperRAM in single package
Interface StandardHyperBus: 11-signal, 3.0V I/O, single-ended CK clock
Data Bus Width8-bit DQ[7:0] with DDR transfers (2 per clock cycle)
Max Clock Rate100 MHz → 200 MB/s sustained throughput
PackageFBGA-24, 6 × 8 × 1.0 mm, 5×5 ball array
RWDS FunctionBidirectional: read strobe (output) and HyperRAM write mask (input)
Chip SelectsCS1# (HyperFlash), CS2# (HyperRAM); mutually exclusive activation

Pinout & Package

Package: FBGA-24, 6 mm × 8 mm × 1.0 mm body, 5×5 ball array, pitch 0.4 mm, ELA024 outline.

Pin/TerminalCircuit RoleDesign Meaning
CS1#InputActive-low chip select for HyperFlash memory only
CS2#InputActive-low chip select for HyperRAM memory only
CKInputSingle-ended clock input for 3.0V operation; defines timing reference for all transactions
RWDSInput/OutputBidirectional: output during reads (data strobe), input during HyperRAM writes (data mask)
DQ[7:0]Input/Output8-bit bidirectional data bus for command, address, and payload transfer
RESET#InputHardware reset for HyperFlash only; places DQ/RWDS in High-Z state
RSTO#OutputOpen-drain POR indicator from HyperFlash; used for system-level reset coordination
INT#OutputOpen-drain interrupt output from HyperFlash for internal event notification
VCC / VSSPower / GroundCore supply (1.8V/3.0V) and ground; separate VCCQ/VSSQ for I/O domain

Key Features

FeatureDesign Value
Dual-memory integrationReduces PCB area and routing congestion vs. discrete HyperFlash + HyperRAM
HyperBus DDR interfaceEnables 200 MB/s bandwidth with only 11 signals - fewer than parallel NOR + PSRAM
Independent chip selectsAllows time-multiplexed access to Flash and RAM without arbitration logic
RWDS dual-role signalingEliminates need for separate RD/WR strobes or masks in controller design
System-level reset supportRSTO# output synchronizes host boot sequence with HyperFlash POR completion

Applications

Automotive Instrument ClustersIndustrial HMI Panels

Use Scenario: Real-time rendering of gauges, maps, and alerts with simultaneous firmware updates.

IC Role / Device Role / Timing Role: HyperFlash stores boot code and OTA update images; HyperRAM buffers graphics frame data and UI assets.

Use Value: Eliminates external bus arbitration and reduces layout complexity while sustaining >150 MB/s effective bandwidth for display refresh.

Use Scenario: Local data logging, configuration storage, and dynamic web UI serving on edge controllers.

IC Role / Device Role / Timing Role: HyperFlash holds application firmware and secure keys; HyperRAM caches HTTP session data and sensor history buffers.

Use Value: Enables deterministic boot from Flash and low-latency RAM access without external memory controller overhead.

Medical Imaging DisplaysAvionics Display Systems

Use Scenario: Concurrent loading of DICOM image metadata (Flash) and pixel buffer streaming (RAM) during diagnostic review.

IC Role / Device Role / Timing Role: HyperFlash serves as nonvolatile image index database; HyperRAM acts as real-time pixel FIFO with self-refresh retention.

Use Value: Maintains sub-50 ns read latency for metadata lookups while sustaining 160+ MB/s pixel throughput via DDR HyperBus.

Use Scenario: DO-254-compliant flight display units requiring certified code storage and transient graphics buffering.

IC Role / Device Role / Timing Role: HyperFlash stores certified boot loader and configuration tables; HyperRAM buffers synthetic vision frames and HUD overlays.

Use Value: Meets ASIL-B timing constraints through deterministic CS#-gated access and no hidden refresh stalls.

Equivalent & Alternatives

The following parts are listed as comparable options for similar HyperBus MCP memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S71KL512SC0BHB000512 Mb HyperFlash + 64 Mb HyperRAM; same package and interfaceHigher Flash density for larger firmware or multi-image storageSelect when boot image size exceeds 32 MB or dual-application partitioning is required
S27KL0641FABHI020Standalone 64 Mb HyperRAM (no integrated Flash); TFBGA-24Requires separate Flash IC; adds board space and signal routingChoose only if Flash and RAM must be independently upgraded or replaced

Compared with S71KL512SC0BHB000, this part trades Flash capacity for cost-sensitive designs needing exactly 32 MB code space; compared with S27KL0641FABHI020, it eliminates interconnect complexity and timing skew between discrete memories but fixes Flash/RAM ratio.

Availability

S71KL256SC0BHB000 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMI panels, and medical imaging displays requiring stable component supply across extended product lifecycles.

Supply support for S71KL256SC0BHB000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and microcontroller solutions for embedded systems, emphasizing interface efficiency and system integration.

This part belongs to the HyperBus MCP product line, engineered to replace discrete Flash + RAM combinations in space-constrained, high-bandwidth applications such as automotive dashboards and industrial HMIs.

FAQ

What is the function of the RWDS pin on S71KL256SC0BHB000?

RWDS is a bidirectional pin: it outputs a read data strobe synchronized to HyperFlash or HyperRAM reads, and inputs a write data mask during HyperRAM writes only. At transaction start, RWDS indicates initial latency (1 = extra cycle). It is not used as a mask for HyperFlash writes.

Can S71KL256SC0BHB000 operate with a differential clock (CK/CK#)?

No. This 3.0V variant uses only single-ended CK; CK# is reserved (RFU) and unconnected. Differential clock operation is exclusive to 1.8V HyperBus MCP parts like S71KS512SC0. Using CK# on this part violates electrical specifications and may cause interface failure.

How does chip select isolation work between HyperFlash and HyperRAM?

CS1# controls HyperFlash; CS2# controls HyperRAM. Only one may be asserted low at a time. The datasheet mandates mutual exclusion - simultaneous activation causes undefined behavior and violates timing margins. Hardware or firmware must enforce strict time-multiplexing.

Is RESET# connected to HyperRAM in this MCP?

No. RESET# is connected exclusively to the HyperFlash die. It has no effect on HyperRAM operation or state. HyperRAM remains powered and retains self-refresh capability during HyperFlash reset. RSTO# and INT# also originate solely from the HyperFlash section.

S71KL256SC0BHB000 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERFLASH™ + HYPERRAM™ KL
Package/Case:
24-VBGA
Packaging:
Tray
Product Status:
Last Time Buy
Programmable:
Not Verified
Memory Type:
Non-Volatile, Volatile
Memory Format:
FLASH, RAM
Technology:
FLASH, DRAM
Memory Size:
256Mbit (FLASH), 64Mbit (RAM)
Memory Organization:
-
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S71KL256SC0BHB000 FAQ

1.How can I place an order for S71KL256SC0BHB000 through Aetrix?

Please submit a Request for Quotation (RFQ) for S71KL256SC0BHB000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S71KL256SC0BHB000 reliable?

The price and inventory of S71KL256SC0BHB000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S71KL256SC0BHB000 is usually 5 days.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S71KL256SC0BHB000?

For technical support, including S71KL256SC0BHB000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S71KL256SC0BHB000 requirements.

6.How does Aetrix verify that S71KL256SC0BHB000 is sourced from the original manufacturer or authorized distributors?

All S71KL256SC0BHB000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S71KL256SC0BHB000 meets industry standards.

7.What is the process for return or replacement of S71KL256SC0BHB000?

All S71KL256SC0BHB000 units undergo pre-shipment inspection (PSI). If there is an issue with S71KL256SC0BHB000, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S71KL256SC0BHB000 part is unused and in its original packaging.

Return procedure for S71KL256SC0BHB000:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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