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Infineon Technologies S71KL512SC0BHV000

Part No.:
S71KL512SC0BHV000
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS71KL512SC0BHV000.pdf
Description:
IC FLASH RAM 512MBIT PAR 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:549

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Product details

Overview

S71KL512SC0BHV000 from Cypress Semiconductor is a 3.0V HyperBus™ Multi-Chip Package integrating 512 Mb (64 MB) HyperFlash™ NOR flash and 64 Mbit (8 MB) HyperRAM™ self-refresh DRAM in a single FBGA-24 package. It delivers high-speed DDR interface with up to 200 MB/s throughput, differential timing control via single-ended CK, and dual chip select (CS1#, CS2#) for independent memory access - deployed in embedded boot code storage and real-time frame buffer applications.

For engineers reviewing the S71KL512SC0BHV000 datasheet, S71KL512SC0BHV000 pinout, S71KL512SC0BHV000 application, or S71KL512SC0BHV000 equivalent, key selection criteria include 3.0V I/O compatibility, HyperBus™ signal mapping (CK, RWDS, DQ[7:0]), dual-memory arbitration behavior, and FBGA-24 mechanical footprint alignment with PCB layout constraints.

Technical Context

This MCP implements a shared HyperBus™ physical layer with separate command/address/data paths routed to two die: one HyperFlash™ for non-volatile program storage and one HyperRAM™ for volatile high-bandwidth data buffering. The interface uses a single-ended 3.0V clock (CK), bidirectional RWDS for read strobe/write mask, and dedicated chip selects (CS1# for Flash, CS2# for RAM) to isolate transaction domains.

Electrical operation requires strict sequencing: only one CS# may be asserted low at a time; RESET# affects HyperFlash only; RSTO# provides POR indication; and INT# signals internal Flash events. RWDS transitions at bus start indicate refresh latency, enabling deterministic timing for real-time systems.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Configuration 512 Mb HyperFlash + 64 Mbit HyperRAM in monolithic MCP
Interface Standard HyperBus™ v1.0: 11-signal, 3.0V I/O, single-ended CK clock
Max Throughput 200 MB/s (100 MHz DDR clock, 2 transfers/cycle)
Package FBGA-24, 6 × 8 × 1.0 mm, 5×5 ball array (ELA024)
Voltage Supply VCC = 3.0V ±0.3V (core), VCCQ = 3.0V ±0.3V (I/O)
Operating Temp −40 °C to +85 °C (industrial grade)
Chip Selects CS1# (HyperFlash), CS2# (HyperRAM), mutually exclusive activation

Pinout & Package

Package: ELA024 FBGA-24, 6 mm × 8 mm × 1.0 mm body, 0.4 mm ball pitch, 5×5 ball array with A1 corner marked by chamfer. VSS and VSSQ are internally connected; CK# (B1) is RFU in 3.0V devices.

Pin/Terminal Circuit Role Design Meaning
CS1# Input Active-low chip select for HyperFlash die; initiates Flash transactions
CS2# Input Active-low chip select for HyperRAM die; enables RAM read/write
CK Input Single-ended 3.0V clock; all data transfers edge-aligned to CK
RWDS Input/Output Bidirectional: output read strobe / input write mask; indicates initial latency at bus start
DQ[7:0] I/O 8-bit bidirectional data bus for command, address, and payload transfer
RESET# Input Hardware reset for HyperFlash only; places Flash into idle, forces DQ/RWDS to Hi-Z
INT# Output (open-drain) Flash-interrupt signal (e.g., erase completion); requires external pull-up
RSTO# Output (open-drain) Power-on reset indicator from HyperFlash; user-configurable low-time before Hi-Z
VCC / VCCQ Power VCC = core supply (3.0V), VCCQ = I/O supply (3.0V); decoupling required per datasheet
VSS / VSSQ Ground VSS = core ground, VSSQ = I/O ground; internally connected within package

Key Features

Feature Design Value
Integrated Flash + RAM Reduces PCB area by ~40% vs. discrete 512Mb Flash + 64Mb DRAM solutions
HyperBus™ Interface 11-pin interface replaces 30+ pins of legacy parallel NOR + PSRAM, lowering routing congestion
DDR Timing Control RWDS-driven strobe/mask eliminates setup/hold timing margin uncertainty in high-speed reads/writes
Independent Chip Selects Enables concurrent memory arbitration in SoC boot loaders without bus contention
Industrial Temp Range Validated operation from −40°C to +85°C supports automotive infotainment and industrial HMI

Applications

Automotive Infotainment Boot Industrial HMI Frame Buffer

Use Scenario: Fast boot of Linux-based head unit with secure firmware image and GUI assets.

IC Role / Device Role / Timing Role: HyperFlash stores signed bootloader and kernel; HyperRAM buffers rendered UI frames at 60 Hz.

Use Value: Eliminates dual-package layout; RWDS-synchronized reads achieve <12 ns jitter for deterministic display pipeline timing.

Use Scenario: Real-time visualization of PLC sensor data on 7-inch capacitive touchscreen.

IC Role / Device Role / Timing Role: HyperFlash holds FPGA configuration bitstream and application logic; HyperRAM serves as double-buffered pixel store.

Use Value: 200 MB/s bandwidth sustains 1080p@30fps rendering; CS2#-gated writes prevent visual tearing during buffer swaps.

Medical Imaging Edge Device Smart Gateway Firmware Storage

Use Scenario: Portable ultrasound device capturing and preprocessing B-mode frames before cloud upload.

IC Role / Device Role / Timing Role: HyperFlash retains FDA-certified DSP firmware; HyperRAM buffers raw ADC samples pre-FIR filtering.

Use Value: Single-package solution meets IEC 60601 creepage requirements; 3.0V operation simplifies power tree design.

Use Scenario: Cellular-connected smart meter storing OTA update images and encrypted metering logs.

IC Role / Device Role / Timing Role: HyperFlash hosts dual-bank firmware for safe rollback; HyperRAM caches AES-256 encryption keys and session tokens.

Use Value: CS1#/CS2# isolation prevents OTA update corruption during active log writes; deep power-down current <50 µA extends battery life.

Equivalent & Alternatives

The following parts are listed as comparable options for similar HyperBus™ MCP memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
S71KS512SC0BHV000 1.8V I/O, differential CK/CK#, same density (512Mb+64Mb), identical FBGA-24 Requires 1.8V I/O rail and differential clock generation; lower dynamic power Select when system already supports 1.8V I/O and needs reduced EMI in noise-sensitive environments
S71KL256SC0BHV000 3.0V I/O, same package, but 256Mb HyperFlash + 64Mb HyperRAM Halves non-volatile storage capacity; reduces cost and active current by ~25% Select when boot image size ≤32 MB and BOM cost sensitivity outweighs future firmware expansion needs

Compared with S71KL512SC0BHV000, the 1.8V S71KS512SC0 offers better signal integrity at higher frequencies but demands additional voltage translation; the lower-density S71KL256SC0 trades storage headroom for lower power and cost in resource-constrained edge nodes.

Availability

S71KL512SC0BHV000 is available at Aetrix Electronics and suitable for automotive infotainment boot, industrial HMI frame buffer, and medical imaging edge device applications requiring stable component supply across extended product lifecycles.

Supply support for S71KL512SC0BHV000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and microcontroller solutions for embedded systems, with expertise in non-volatile and volatile memory integration.

This part belongs to the HyperBus™ MCP family, engineered to replace discrete flash + PSRAM combinations in space-constrained, high-throughput embedded systems where deterministic timing and board-level integration are critical.

FAQ

Is S71KL512SC0BHV000 pin-compatible with S71KS512SC0BHV000?

Yes, both use identical ELA024 FBGA-24 package and ball map, including CS1#, CS2#, DQ[7:0], RWDS, and CK. However, S71KS512SC0 requires CK# (B1) for differential clocking and operates at 1.8V I/O, while S71KL512SC0 uses single-ended CK and 3.0V I/O - power and clock circuitry must be redesigned accordingly.

Can HyperFlash and HyperRAM be accessed simultaneously?

No. The HyperBus™ protocol mandates exclusive chip select activation: only CS1# or CS2# may be low at any time. Concurrent access would cause bus contention and undefined behavior. Arbitration must be handled by the host controller using sequential CS# assertion with appropriate inter-access delays.

What is the function of RWDS during HyperRAM write operations?

During HyperRAM writes, RWDS acts as a write data mask: each rising edge samples one byte of DQ[7:0], and the mask determines whether that byte is written to the target address. This enables partial writes without read-modify-write cycles, reducing latency and power in burst-oriented data logging.

Does RESET# affect HyperRAM functionality?

No. RESET# is connected only to the HyperFlash die. When asserted, it resets Flash state and forces DQ/RWDS to Hi-Z, but HyperRAM remains unaffected - its internal self-refresh continues, and CS2# remains functional. This allows safe Flash reinitialization without disrupting active RAM data buffers.

S71KL512SC0BHV000 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERFLASH™ + HYPERRAM™ KL
Package/Case:
24-VBGA
Packaging:
Tray
Product Status:
Last Time Buy
Programmable:
Not Verified
Memory Type:
Non-Volatile, Volatile
Memory Format:
FLASH, RAM
Technology:
FLASH, DRAM
Memory Size:
512Mbit (FLASH), 64Mbit (RAM)
Memory Organization:
-
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S71KL512SC0BHV000 FAQ

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Please submit a Request for Quotation (RFQ) for S71KL512SC0BHV000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of S71KL512SC0BHV000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S71KL512SC0BHV000 is usually 5 days.

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5.How can I obtain technical support or documentation for S71KL512SC0BHV000?

For technical support, including S71KL512SC0BHV000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S71KL512SC0BHV000 requirements.

6.How does Aetrix verify that S71KL512SC0BHV000 is sourced from the original manufacturer or authorized distributors?

All S71KL512SC0BHV000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S71KL512SC0BHV000 meets industry standards.

7.What is the process for return or replacement of S71KL512SC0BHV000?

All S71KL512SC0BHV000 units undergo pre-shipment inspection (PSI). If there is an issue with S71KL512SC0BHV000, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S71KL512SC0BHV000 part is unused and in its original packaging.

Return procedure for S71KL512SC0BHV000:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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