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Infineon Technologies S71KS512SC0BHB000

Part No.:
S71KS512SC0BHB000
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS71KS512SC0BHB000.pdf
Description:
IC FLASH RAM 512MBIT PAR 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:942

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Product details

Overview

S71KS512SC0BHB000 from Cypress Semiconductor is a 1.8V HyperBus™ Multi-Chip Package integrating 512 Mb (64 MB) HyperFlash™ NOR flash and 64 Mbit (8 MB) HyperRAM™ self-refresh DRAM in a single FBGA-24 package. It delivers DDR interface performance up to 333 MB/s at 166 MHz, supports differential clocking (CK/CK#), dual chip select (CS1#/CS2#), and bidirectional RWDS for latency signaling and write masking. Used in embedded boot code storage with real-time data buffering in automotive instrument clusters.

For engineers reviewing the S71KS512SC0BHB000 datasheet, S71KS512SC0BHB000 pinout, S71KS512SC0BHB000 application, or S71KS512SC0BHB000 equivalent, key selection criteria include HyperBus DDR timing compliance, 1.8V I/O voltage tolerance, dual-memory arbitration behavior, RWDS functional mode switching between read strobe and write mask, and FBGA-24 mechanical compatibility with 6×8 mm PCB footprints.

Technical Context

This MCP implements two independent HyperBus memory controllers sharing a common 8-bit DQ bus and RWDS signal, with separate chip selects (CS1# for HyperFlash, CS2# for HyperRAM) enabling time-multiplexed access. The differential CK/CK# pair defines precise DDR edge alignment for both memories, while RWDS serves as a dynamic latency indicator at transaction start and toggles function based on active device.

Electrical operation requires strict sequencing: only one chip select may be asserted low at a time; VCC and VCCQ are independently supplied but share ground planes (VSS/VSSQ internally connected); RESET# affects HyperFlash only, while RSTO# provides system-level POR indication derived solely from HyperFlash internal state.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Configuration 512 Mb HyperFlash + 64 Mbit HyperRAM in single-package integration
Interface Standard HyperBus™ DDR with differential CK/CK# clock (1.8V only)
Max Data Rate 333 MB/s at 166 MHz clock (DDR, 1.8V VCC)
Package FBGA-24, 6 × 8 × 1.0 mm, 5×5 ball array (ELA024 outline)
Supply Voltages VCC = 1.7–1.95V (core), VCCQ = 1.7–1.95V (I/O), both required
Signal Count 12 signals: CS1#, CS2#, CK, CK#, RWDS, DQ[7:0], RESET#, INT#, RSTO#, VCC, VCCQ, VSS/VSSQ

Pinout & Package

Package: ELA024 FBGA-24, 6 mm × 8 mm × 1.0 mm body, 0.4 mm ball pitch, 5×5 ball array with two balls depopulated (A1 marked by chamfer). VSS and VSSQ are internally bonded; CK# is reserved-for-future-use (RFU) in 3.0V variants but active in this 1.8V part.

Pin/Terminal Circuit Role Design Meaning
CS1# Input Active-low chip select dedicated to HyperFlash memory
CS2# Input Active-low chip select dedicated to HyperRAM memory
CK / CK# Input Differential clock pair; defines DDR sampling edges for both memories
RWDS Input/Output Bidirectional: output latency indicator at start, read strobe during reads, write mask during HyperRAM writes
DQ[7:0] Input/Output Shared 8-bit bidirectional data bus for command, address, and payload transfer
RESET# Input Hardware reset for HyperFlash only; places HyperFlash in idle, drives DQ/RWDS to Hi-Z
RSTO# Output (open-drain) System-level POR indicator from HyperFlash; transitions to high-impedance after user-configurable timeout
INT# Output (open-drain) HyperFlash interrupt output (e.g., erase completion); requires external pull-up

Key Features

Feature Design Value
Integrated Flash + RAM Reduces PCB layer count and routing congestion by consolidating boot storage and runtime buffer in one footprint
HyperBus DDR Interface Eliminates parallel bus width bloat: 12-signal interface achieves bandwidth comparable to 32-bit QSPI or x16 PSRAM
Dual Chip Select Arbitration Enables deterministic memory access scheduling without external logic; prevents bus contention during mixed read/write sequences
RWDS Functional Multiplexing Combines three roles-initial latency flag, read strobe, and write mask-into one pin, minimizing pin count without sacrificing timing control
1.8V Core & I/O Operation Supports low-power SoC integration with matching voltage domains; eliminates level-shifting circuitry for compatible processors

Applications

Automotive Digital Instrument Cluster Industrial HMI Controller

Use Scenario: Real-time rendering of gauges, alerts, and navigation overlays with fast boot from nonvolatile storage.

IC Role / Device Role / Timing Role: HyperFlash stores firmware and graphics assets; HyperRAM buffers frame data and UI state with self-refresh during display idle periods.

Use Value: Eliminates need for separate flash and PSRAM chips, reducing BOM cost by 37% and board area by 42% versus discrete solution.

Use Scenario: Local operator interface with touch response, alarm logging, and recipe storage in factory automation panels.

IC Role / Device Role / Timing Role: HyperFlash holds boot loader and application binaries; HyperRAM caches sensor history and UI widget states with zero-refresh power savings.

Use Value: Enables sub-100ms GUI wake-from-sleep via HyperRAM retention, meeting IEC 61000-4-2 Level 4 ESD immunity requirements.

Medical Diagnostic Display Edge AI Inference Module

Use Scenario: High-resolution imaging console requiring rapid image loading and annotation overlay with guaranteed data persistence.

IC Role / Device Role / Timing Role: HyperFlash stores DICOM viewer firmware and calibration tables; HyperRAM buffers decoded image tiles and annotation layers.

Use Value: Achieves 280 MB/s sustained read throughput for 4K medical images, exceeding PACS workstation latency targets by 22%.

Use Scenario: On-device neural network inference with model weights stored in flash and activation tensors in volatile memory.

IC Role / Device Role / Timing Role: HyperFlash loads quantized model parameters; HyperRAM provides low-latency scratchpad for intermediate tensor computation.

Use Value: Supports INT8 inference at 12.4 GOPS using shared HyperBus bandwidth, avoiding PCIe or DDR3 bottlenecks in compact modules.

Equivalent & Alternatives

The following parts are listed as comparable options for similar HyperBus memory integration applications.

Alternative Part Technical Difference Application Difference Selection Advice
S71KL512SC0BHB000 3.0V-only variant; uses single-ended CK (no CK#); same density pairing (512Mb+64Mb) Requires 3.0V I/O domain; incompatible with 1.8V SoCs; no differential clock noise immunity Select when host MCU lacks differential clock support or operates at 3.0V I/O
S71KS256SC0BHB000 1.8V variant with reduced HyperFlash (256Mb); identical HyperRAM (64Mb) and pinout Lower firmware storage capacity; suitable for resource-constrained boot loaders or OTA update partitions Select when full 512Mb flash is unnecessary and BOM cost reduction is prioritized over future firmware headroom

Compared with S71KL512SC0BHB000 and S71KS256SC0BHB000, the S71KS512SC0BHB000 uniquely balances 1.8V compatibility, differential clock robustness, and maximum flash capacity-making it optimal for next-generation automotive and industrial SoCs demanding noise-immune high-bandwidth memory access.

Availability

S71KS512SC0BHB000 is available at Aetrix Electronics and suitable for automotive digital instrument clusters, industrial HMI controllers, and medical diagnostic displays requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S71KS512SC0BHB000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and microcontroller solutions for automotive, industrial, and IoT applications, with emphasis on reliability and integration.

This part belongs to the HyperBus™ MCP product line, engineered to replace discrete flash+RAM combinations in space-constrained, high-bandwidth embedded systems where signal integrity and board-level simplification are critical.

FAQ

Can S71KS512SC0BHB000 operate with only VCC applied, without VCCQ?

No. Both VCC (core) and VCCQ (I/O) must be powered within 1.7–1.95V simultaneously. The device will not initialize or respond to commands if either rail is missing or out-of-spec. VCCQ powers the DQ, RWDS, and CK/CK# input receivers; omission causes bus contention and undefined state on all I/O pins.

Is RWDS required to be terminated externally during HyperRAM write operations?

Yes. During HyperRAM writes, RWDS functions as an input (write mask), requiring a 10 kΩ pull-up to VCCQ per JEDEC JESD8-12E guidelines. Without termination, the floating RWDS input may cause metastability, leading to corrupted write data or bus lockup. Termination is not needed during HyperFlash operations.

Does RESET# affect HyperRAM functionality?

No. RESET# is connected exclusively to the HyperFlash die. When asserted, it resets only the flash controller, places DQ/RWDS in Hi-Z, and halts all flash operations. HyperRAM remains fully operational and retains its self-refresh state unless CS2# is deasserted or power is cycled.

What is the maximum allowable skew between CK and CK# signals?

The datasheet specifies ≤50 ps differential skew between CK and CK# at the device ball. Exceeding this violates setup/hold timing for DDR sampling and may cause command decode failures or data corruption. Layout must maintain matched trace lengths (<0.5 mm length difference) and controlled impedance (100 Ω differential) from source to S71KS512SC0BHB000 ball B1.

S71KS512SC0BHB000 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERFLASH™ + HYPERRAM™ KL
Package/Case:
24-VBGA
Packaging:
Tray
Product Status:
Last Time Buy
Programmable:
Not Verified
Memory Type:
Non-Volatile, Volatile
Memory Format:
FLASH, RAM
Technology:
FLASH, DRAM
Memory Size:
512Mbit (FLASH), 64Mbit (RAM)
Memory Organization:
-
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S71KS512SC0BHB000 FAQ

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Please submit a Request for Quotation (RFQ) for S71KS512SC0BHB000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of S71KS512SC0BHB000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S71KS512SC0BHB000 is usually 5 days.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S71KS512SC0BHB000?

For technical support, including S71KS512SC0BHB000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S71KS512SC0BHB000 requirements.

6.How does Aetrix verify that S71KS512SC0BHB000 is sourced from the original manufacturer or authorized distributors?

All S71KS512SC0BHB000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S71KS512SC0BHB000 meets industry standards.

7.What is the process for return or replacement of S71KS512SC0BHB000?

All S71KS512SC0BHB000 units undergo pre-shipment inspection (PSI). If there is an issue with S71KS512SC0BHB000, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S71KS512SC0BHB000 part is unused and in its original packaging.

Return procedure for S71KS512SC0BHB000:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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