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Infineon Technologies S71KS512SC0BHB003

Part No.:
S71KS512SC0BHB003
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS71KS512SC0BHB003.pdf
Description:
IC FLASH RAM 512MBIT PAR 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,269

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Product details

Overview

S71KS512SC0BHB003 from Cypress Semiconductor is a 1.8V HyperBus™ Multi-Chip Package integrating 512 Mb (64 MB) HyperFlash™ and 64 Mbit (8 MB) HyperRAM™ in a single FBGA-24 package. It serves as a high-bandwidth, low-pin-count memory subsystem for embedded applications requiring concurrent code execution and fast data buffering, with DDR operation up to 166 MHz (333 MB/s), differential clock interface (CK/CK#), and dual chip select (CS1#/CS2#) for independent Flash and RAM access.

For engineers reviewing the S71KS512SC0BHB003 datasheet, S71KS512SC0BHB003 pinout, S71KS512SC0BHB003 application, or S71KS512SC0BHB003 equivalent, key selection considerations include HyperBus interface timing compliance, 1.8V I/O voltage domain separation, RWDS bidirectional strobe/mask behavior, and FBGA-24 mechanical compatibility with 6 × 8 × 1.0 mm footprint and 0.4 mm ball pitch.

Technical Context

The device implements a dual-die MCP architecture with physically isolated HyperFlash and HyperRAM dies sharing a common HyperBus interface. It uses differential clocking (CK/CK#) for precise timing control and supports DDR transfers on DQ[7:0] with RWDS acting as both read data strobe and write data mask-only for HyperRAM writes.

Chip select signals CS1# and CS2# are dedicated per die, enabling independent command execution without bus arbitration. The RSTO# output provides configurable POR signaling, while INT# delivers open-drain interrupt notification exclusively from the HyperFlash die; RESET# affects only HyperFlash and places RWDS/DQ into Hi-Z.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Configuration512 Mb HyperFlash + 64 Mbit HyperRAM in single-package integration
Interface StandardHyperBus™: 12-signal, low-pin-count DDR interface with differential clock
Max Clock Rate166 MHz DDR → 333 MB/s peak bandwidth at 1.8V VCC
Supply Voltage1.8V core/I/O (VCC/VCCQ); separate VSS/VSSQ grounds for noise isolation
PackageFBGA-24, 6 × 8 × 1.0 mm, 0.4 mm ball pitch, 5×5 array footprint
RWDS FunctionBidirectional: output read strobe (all transactions), input write mask (HyperRAM only)
Chip SelectsCS1# for HyperFlash, CS2# for HyperRAM - no shared control logic

Pinout & Package

Package: ELA024 / VAA024 compliant FBGA-24, 6 mm × 8 mm × 1.0 mm body, 0.4 mm ball pitch, 5×5 ball array with two balls depopulated (A1 marked by chamfer/laser). VSS and VSSQ internally connected; CK# (B1) reserved for 1.8V devices only and RFU in 3V variants.

Pin/TerminalCircuit RoleDesign Meaning
CS1#InputActive-low chip select dedicated to HyperFlash die; initiates Flash commands
CS2#InputActive-low chip select dedicated to HyperRAM die; enables RAM access only
CK / CK#InputDifferential clock pair (1.8V only); defines DDR sampling edges for all bus transactions
RWDSI/OBidirectional strobe/mask: output during reads, input during HyperRAM writes
DQ[7:0]I/O8-bit bidirectional data bus carrying commands, addresses, and payload for both memories
RESET#InputHardware reset for HyperFlash only; forces Flash idle state and Hi-Z RWDS/DQ
INT#OutputOpen-drain interrupt from HyperFlash indicating internal event (e.g., erase completion)
RSTO#OutputOpen-drain POR signal from HyperFlash; user-configurable timeout before high-impedance release

Key Features

FeatureDesign Value
Multi-Chip IntegrationReduces PCB routing congestion by consolidating Flash + DRAM into one 24-ball footprint
HyperBus Interface12-signal DDR bus replaces legacy parallel NOR + PSRAM interfaces, cutting pin count by >50%
Dual Independent Chip SelectsEnables simultaneous memory arbitration at system level without internal bus contention
RWDS Bidirectional ControlEliminates need for separate RD/WR strobes or masks - simplifies timing-critical layout
Configurable RSTO# TimeoutAllows synchronization of system-level power-on sequencing with Flash initialization latency

Applications

Automotive Instrument ClustersIndustrial HMI Controllers

Use Scenario: Real-time rendering of vector graphics and firmware updates over CAN FD while maintaining UI responsiveness.

IC Role / Device Role / Timing Role: HyperFlash stores boot code and OTA update images; HyperRAM buffers frame buffers and touch event queues with sub-10ns RWDS-aligned access.

Use Value: Eliminates external PSRAM + NOR flash discrete solution, reducing BOM count and improving EMI margin via reduced trace length and fewer vias.

Use Scenario: Local edge inference on programmable logic controllers with dynamic model swapping and real-time logging.

IC Role / Device Role / Timing Role: HyperFlash hosts FPGA configuration bitstreams and firmware; HyperRAM caches inference weights and sensor history with self-refresh retention during low-power sleep modes.

Use Value: Enables deterministic <500 ns read latency for weight matrix fetches while sustaining 200+ MB/s sustained throughput during burst logging.

Medical Imaging Front-Ends5G Small Cell Baseband Processors

Use Scenario: High-speed acquisition of ultrasound echo data with on-device preprocessing before transmission to host.

IC Role / Device Role / Timing Role: HyperRAM buffers raw ADC samples at 125 MSPS; HyperFlash stores calibration profiles and DSP microcode updated via secure boot.

Use Value: Achieves zero-copy DMA transfers between ADC peripherals and HyperRAM using RWDS-aligned strobes, avoiding FIFO bottlenecks.

Use Scenario: L1/L2 protocol stack execution with dynamic radio parameter loading and real-time interference mitigation tables.

IC Role / Device Role / Timing Role: HyperFlash executes baseband firmware from XIP mode; HyperRAM holds channel estimation matrices and beamforming coefficients updated every 10 ms.

Use Value: Supports 166 MHz DDR operation to sustain >300 MB/s read bandwidth required for multi-carrier LTE/NR symbol processing pipelines.

Equivalent & Alternatives

The following parts are listed as comparable options for similar HyperBus memory subsystem applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S71KL512SC0BHB0033.0V-only interface; single-ended CK (no CK#); same density and packageRequires 3.0V I/O rail; lacks differential clock noise immunity for high-EMI environmentsSelect when system lacks 1.8V I/O supply but needs identical capacity and footprint
S26KS512SDPBH003Standalone 512 Mb HyperFlash (no HyperRAM); same 1.8V HyperBus interface and FBGA-24No integrated RAM - requires external PSRAM or DDR for data bufferingSelect when application uses external DRAM and only needs high-speed code storage

Compared with S71KL512SC0BHB003 and S26KS512SDPBH003, the S71KS512SC0BHB003 uniquely delivers co-located Flash+RAM with differential clocking, enabling tighter timing margins in automotive and industrial systems where EMI resilience and board space are critical constraints.

Availability

S71KS512SC0BHB003 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMIs, and medical imaging front-ends requiring stable component supply across extended temperature ranges (−40°C to +105°C) and long lifecycle support.

Supply support for S71KS512SC0BHB003 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and microcontroller solutions for automotive, industrial, and IoT applications, with emphasis on signal integrity, low-power operation, and system-level integration.

The HyperBus™ product line targets memory-constrained embedded systems needing high bandwidth without parallel bus complexity - specifically enabling XIP-capable Flash + self-refresh DRAM co-location in space-sensitive designs.

FAQ

What is the function of RWDS in S71KS512SC0BHB003?

RWDS is a bidirectional signal: it outputs a read data strobe aligned with DQ[7:0] during all read transactions, and acts as a write data mask input exclusively for HyperRAM writes. At transaction start, RWDS indicates initial latency requirement (1 = additional cycle, 0 = none), and is never used as a mask for HyperFlash operations.

Can S71KS512SC0BHB003 operate with only one memory active?

Yes - only one chip select (CS1# or CS2#) may be asserted low at a time. When CS1# is active, HyperFlash responds and HyperRAM enters standby; when CS2# is active, HyperRAM operates and HyperFlash remains in standby. Both memories share DQ/RWDS/CK but are electrically isolated via dedicated selects.

Is CK# required for proper operation of S71KS512SC0BHB003?

Yes - CK# is mandatory for 1.8V operation as it forms the differential clock pair with CK. The device relies on crossing-edge detection of CK/CK# for DDR timing; omitting or mismatching CK# skew violates setup/hold requirements and causes bus failure. CK# (B1) is RFU only in 3V variants like S71KL512SC0.

Does RESET# affect HyperRAM functionality in S71KS512SC0BHB003?

No - RESET# is connected solely to the HyperFlash die. It forces HyperFlash into idle state and places RWDS/DQ[7:0] into high-impedance, but has no electrical connection to HyperRAM. HyperRAM remains powered and retains self-refresh state unless VCC/VCCQ are cycled or CS2# is deasserted.

S71KS512SC0BHB003 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERFLASH™ + HYPERRAM™ KL
Package/Case:
24-VBGA
Packaging:
Tape & Reel (TR)
Product Status:
Last Time Buy
Programmable:
Not Verified
Memory Type:
Non-Volatile, Volatile
Memory Format:
FLASH, RAM
Technology:
FLASH, DRAM
Memory Size:
512Mbit (FLASH), 64Mbit (RAM)
Memory Organization:
-
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S71KS512SC0BHB003 FAQ

1.How can I place an order for S71KS512SC0BHB003 through Aetrix?

Please submit a Request for Quotation (RFQ) for S71KS512SC0BHB003 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S71KS512SC0BHB003 reliable?

The price and inventory of S71KS512SC0BHB003 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S71KS512SC0BHB003 is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S71KS512SC0BHB003 transactions.

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S71KS512SC0BHB003 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S71KS512SC0BHB003 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S71KS512SC0BHB003?

For technical support, including S71KS512SC0BHB003 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S71KS512SC0BHB003 requirements.

6.How does Aetrix verify that S71KS512SC0BHB003 is sourced from the original manufacturer or authorized distributors?

All S71KS512SC0BHB003 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S71KS512SC0BHB003 meets industry standards.

7.What is the process for return or replacement of S71KS512SC0BHB003?

All S71KS512SC0BHB003 units undergo pre-shipment inspection (PSI). If there is an issue with S71KS512SC0BHB003, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S71KS512SC0BHB003 part is unused and in its original packaging.

Return procedure for S71KS512SC0BHB003:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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