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Infineon Technologies S71KS512SC0BHV000

Part No.:
S71KS512SC0BHV000
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS71KS512SC0BHV000.pdf
Description:
IC FLASH RAM 512MBIT PAR 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:427

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Product details

Overview

S71KS512SC0BHV000 from Cypress Semiconductor is a 1.8V HyperBus™ Multi-Chip Package integrating 512 Mb (64 MB) HyperFlash™ and 64 Mbit (8 MB) HyperRAM™ in a single FBGA-24 package. It serves as a high-bandwidth, low-pin-count memory subsystem for embedded host processors requiring concurrent code execution and fast data buffering, with DDR interface, differential clock support, and integrated chip select isolation between Flash and RAM.

For engineers reviewing the S71KS512SC0BHV000 datasheet, S71KS512SC0BHV000 pinout, S71KS512SC0BHV000 application, or S71KS512SC0BHV000 equivalent, key selection criteria include HyperBus interface voltage (1.8V), dual-memory arbitration timing, RWDS latency signaling, CK/CK# differential clock compatibility, and FBGA-24 mechanical footprint compliance.

Technical Context

The device implements a shared 8-bit DDR data bus (DQ[7:0]) with separate chip selects (CS1# for HyperFlash, CS2# for HyperRAM), enabling time-multiplexed access without bus contention. RWDS functions bidirectionally: as read data strobe during Flash/RAM reads and as write mask only for HyperRAM writes.

It uses a 1.8V I/O interface with differential clock pair (CK/CK#), supporting up to 166 MHz operation (333 MB/s throughput). The internal architecture isolates power domains (VCC/VCCQ, VSS/VSSQ) and includes optional open-drain signals (INT#, RSTO#, RESET#) for system-level event notification and reset coordination.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Configuration512 Mb HyperFlash + 64 Mbit HyperRAM in single MCP
Interface StandardHyperBus™ DDR with 12-signal bus (CK/CK#, CS1#/CS2#, RWDS, DQ[7:0])
Supply Voltage1.8V core/I/O (VCC/VCCQ); supports differential clock only
Max Clock Rate166 MHz (333 MB/s effective bandwidth)
PackageFBGA-24, 6 mm × 8 mm × 1.0 mm, 5×5 ball array
RWDS FunctionBidirectional: read strobe (all transactions), write mask (HyperRAM only)
Chip SelectsCS1# (HyperFlash), CS2# (HyperRAM); mutually exclusive activation enforced

Pinout & Package

Package: FBGA-24, 6 × 8 × 1.0 mm, 5×5 ball array (ELA024 outline), with VSS/VSSQ internally connected and CK# marked RFU in 3V variants - confirmed active on this 1.8V part.

Pin/TerminalCircuit RoleDesign Meaning
CS1#InputActive-low chip select dedicated to HyperFlash memory
CS2#InputActive-low chip select dedicated to HyperRAM memory
CK / CK#InputDifferential clock pair; defines DDR edge alignment for all transactions
RWDSI/OBidirectional strobe/mask: indicates initial latency, aligns read data, masks HyperRAM writes
DQ[7:0]I/OShared 8-bit DDR data bus for command, address, and payload transfer
RESET#InputHardware reset for HyperFlash only; places DQ/RWDS in High-Z state
INT#Output (open-drain)Indicates internal HyperFlash events (e.g., erase completion)
RSTO#Output (open-drain)System-level POR indicator; user-configurable low-time before high-impedance release

Key Features

FeatureDesign Value
Dual-memory MCP integrationReduces PCB routing congestion by consolidating Flash+RAM into one 24-ball footprint
HyperBus DDR interfaceEnables 333 MB/s throughput with only 12 signal balls - cuts pin count vs. parallel NOR+DRAM
Independent chip select arbitrationGuarantees no bus contention between HyperFlash and HyperRAM via CS1#/CS2# separation
RWDS latency signalingEliminates fixed wait states by dynamically indicating refresh or initialization delay at transaction start
Optional system reset coordinationRSTO# provides synchronized POR release across host and memory subsystem

Applications

Automotive ADAS ECUIndustrial HMI Controller

Use Scenario: Real-time image processing pipeline with boot-from-Flash and frame-buffering in DRAM.

IC Role / Device Role / Timing Role: HyperFlash stores boot firmware and neural network weights; HyperRAM buffers sensor frames at 60 FPS with sub-100 ns access.

Use Value: Eliminates external bus arbitration logic and reduces board area by 40% vs. discrete Flash+DRAM solution.

Use Scenario: Touch-enabled factory panel running Linux with GUI rendering and local logging.

IC Role / Device Role / Timing Role: HyperFlash hosts OS kernel and application binaries; HyperRAM serves as graphics frame buffer and runtime heap.

Use Value: Enables deterministic DDR timing via RWDS-aligned reads, avoiding software polling delays in display refresh loops.

Medical Imaging Edge Node5G Small Cell Baseband

Use Scenario: Portable ultrasound device capturing and preprocessing RF echo data before transmission.

IC Role / Device Role / Timing Role: HyperFlash stores FPGA configuration bitstreams and calibration tables; HyperRAM buffers real-time beamforming samples.

Use Value: Differential CK/CK# ensures noise-immune clocking in mixed-signal medical environment, meeting IEC 60601 immunity requirements.

Use Scenario: LTE/NR baseband unit performing L1 processing with bursty data buffering and firmware updates.

IC Role / Device Role / Timing Role: HyperFlash holds protocol stack firmware; HyperRAM caches OFDM symbol buffers and MAC layer queues.

Use Value: 166 MHz DDR bandwidth sustains 200+ MB/s sustained read/write for real-time PHY layer processing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-memory subsystem applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S71KL512SC0BHV0003.0V I/O, single-ended CK, same density combo (512Mb+64Mb), FBGA-24Requires single-ended clock design; higher VCCQ increases IO power but simplifies clock treeSelect when system already uses 3.0V I/O rails and lacks differential clock routing capability
S26KS512SDPBHV000 + S27KS0641DPBV000Discrete HyperFlash + HyperRAM pair; same densities, separate FBGA-24 packagesAllows independent timing control and voltage scaling; adds ~12 mm² PCB area and 24 extra tracesSelect when memory access patterns require simultaneous Flash+RAM access or independent power gating

Compared with S71KL512SC0BHV000, the 3V variant trades differential noise immunity for simpler clocking; compared with discrete pairing, the MCP sacrifices flexibility for space and signal integrity - optimal where board area and EMI are critical constraints.

Availability

S71KS512SC0BHV000 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial HMIs, medical imaging edge nodes, and 5G small cell baseband designs requiring stable component supply and long-term lifecycle assurance.

Supply support for S71KS512SC0BHV000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and microcontroller solutions for embedded systems, emphasizing signal integrity, low-power operation, and automotive-grade reliability.

This part belongs to the HyperBus™ MCP product line, engineered to replace parallel NOR+DRAM combinations in space-constrained, high-throughput applications where DDR bandwidth and minimal pin count are critical.

FAQ

What is the function of RWDS in S71KS512SC0BHV000?

RWDS serves three distinct roles: (1) at transaction start, it outputs a latency indicator (1 = additional wait state required); (2) during HyperFlash/HyperRAM reads, it acts as edge-aligned read data strobe; (3) during HyperRAM writes, it functions as input write data mask. It is never used as mask for HyperFlash writes.

Can CS1# and CS2# be asserted simultaneously?

No. The device architecture enforces mutual exclusion: asserting both CS1# and CS2# simultaneously violates timing and may cause undefined bus behavior or data corruption. The HyperBus specification requires only one chip select active per transaction, and the MCP's internal logic does not arbitrate concurrent access.

Is CK# required for proper operation?

Yes - for S71KS512SC0BHV000 (1.8V variant), CK# is mandatory. This part uses differential clocking; CK/CK# crossing edges define DDR sampling points. Leaving CK# unconnected or mismatched terminates reliable operation. CK# is RFU only on 3.0V variants like S71KL512SC0.

Does RESET# affect HyperRAM functionality?

No. RESET# is connected exclusively to the HyperFlash die within the MCP. When asserted, it resets only the Flash portion, placing its DQ and RWDS pins in High-Z. HyperRAM remains fully operational and unaffected - its reset path is independent and controlled solely by power sequencing.

S71KS512SC0BHV000 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERFLASH™ + HYPERRAM™ KL
Package/Case:
24-VBGA
Packaging:
Tray
Product Status:
Last Time Buy
Programmable:
Not Verified
Memory Type:
Non-Volatile, Volatile
Memory Format:
FLASH, RAM
Technology:
FLASH, DRAM
Memory Size:
512Mbit (FLASH), 64Mbit (RAM)
Memory Organization:
-
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S71KS512SC0BHV000 FAQ

1.How can I place an order for S71KS512SC0BHV000 through Aetrix?

Please submit a Request for Quotation (RFQ) for S71KS512SC0BHV000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S71KS512SC0BHV000 reliable?

The price and inventory of S71KS512SC0BHV000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S71KS512SC0BHV000 is usually 5 days.

3.What payment methods are accepted for S71KS512SC0BHV000?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S71KS512SC0BHV000 transactions.

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4.How is shipping managed for S71KS512SC0BHV000?

S71KS512SC0BHV000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S71KS512SC0BHV000 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S71KS512SC0BHV000?

For technical support, including S71KS512SC0BHV000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S71KS512SC0BHV000 requirements.

6.How does Aetrix verify that S71KS512SC0BHV000 is sourced from the original manufacturer or authorized distributors?

All S71KS512SC0BHV000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S71KS512SC0BHV000 meets industry standards.

7.What is the process for return or replacement of S71KS512SC0BHV000?

All S71KS512SC0BHV000 units undergo pre-shipment inspection (PSI). If there is an issue with S71KS512SC0BHV000, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S71KS512SC0BHV000 part is unused and in its original packaging.

Return procedure for S71KS512SC0BHV000:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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