Infineon Technologies S72XS256RE0AHBH20

Overview

S72XS256RE0AHBH20 from Cypress Semiconductor is a 256 Mb Multi-Chip Package (MCP) integrating MirrorBit® NOR Flash (16M × 16-bit) and DDR SDRAM (16M × 16-bit) on a single 8.0 × 8.0 mm 133-ball FBGA. It operates at 1.8 V, supports Flash burst speeds up to 108 MHz and DDR DRAM at 166 MHz, and targets wireless handsets requiring compact, low-power nonvolatile + volatile memory co-location.

For engineers reviewing the S72XS256RE0AHBH20 datasheet, S72XS256RE0AHBH20 pinout, S72XS256RE0AHBH20 application, or S72XS256RE0AHBH20 equivalent, key selection criteria include split-bus address/data multiplexing, shared VSS/VCC domains, DDR timing compliance with SDM256D166D1R/D3R, and Flash boot capability in wireless temperature range (–25 °C to +85 °C).

Technical Context

This MCP implements a stacked die architecture with independent Flash and DDR DRAM dies sharing a common BGA substrate. The Flash uses Address-High/Address-Low multiplexed I/O (ADQ15–ADQ0), asynchronous and burst modes, and 65 nm MirrorBit technology. The DDR DRAM supports standard command protocols (RAS#, CAS#, WE#, CKE) with DQS strobing and 16-bit bidirectional data bus (DQ15–DQ0).

Signal routing separates Flash and DRAM control paths: F-CE#/F-OE#/F-WE# and D-CE#/D-RAS#/D-CAS#/D-WE# are physically distinct; clock domains are isolated (F-CLK for Flash, D-CLK/D-CLK# for DDR); power rails are partitioned (F-VCC/F-VCCQ, D-VCC/D-VCCQ) but share ground (VSS). Amax = A12 for DRAM; Flash address mapping ties A15–A0 to DQ15–DQ0 during multiplexed access.

Key Specifications

Pinout & Package

Package: 133-ball Fine-Pitch Ball Grid Array (FBGA), 8.0 × 8.0 mm, RSC133 mechanical outline, Pb-free and low-halogen compliant (AH modifier).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar MCP memory applications.

Compared with MT29C1G48MAZABJH-6IT:C and S70FL01GSAGMFI010, the S72XS256RE0AHBH20 uniquely delivers NOR Flash XIP capability alongside DDR bandwidth in a matched thermal and electrical stack - essential for latency-sensitive boot and real-time embedded applications where discrete memory coordination introduces timing risk.

Availability

S72XS256RE0AHBH20 is available at Aetrix Electronics and suitable for smartphone baseband boot, Wi-Fi module firmware storage, and GPS navigation units requiring stable component supply across product lifecycles.

Supply support for S72XS256RE0AHBH20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance mixed-signal ICs for embedded systems, with expertise in memory, microcontrollers, and connectivity solutions.

The S72XS-R series was developed specifically for mobile wireless platforms needing tightly coupled Flash+DRAM in minimal footprint, addressing boot latency, power efficiency, and PCB area constraints in 3G/4G handset designs.

FAQ

Does S72XS256RE0AHBH20 support true simultaneous access to Flash and DRAM?

No - the MCP uses a split-bus architecture with independent control signals, but shares VSS and physical substrate; true concurrent read/write requires external arbitration. Flash and DRAM can be initialized and accessed in interleaved sequences, but overlapping active cycles may induce ground bounce or timing skew due to shared power/ground domains.

What is the function of F-VPP pin, and is it required for normal operation?

F-VPP is the Flash programming voltage input. At VIH (typically 1.8 V), it enables accelerated programming and erase; at VIL, it disables all program/erase functions. For standard read-only boot operation, F-VPP must be tied to VCC (VIH) - leaving it floating or pulling low will lock Flash in read-only mode and prevent firmware updates.

How does the ADQ15–ADQ0 multiplexed bus affect controller interface design?

The ADQ15–ADQ0 pins serve as both address inputs (latched on F-AVD# rising edge) and data I/O (during burst or asynchronous reads/writes). The host controller must implement address latching logic or use a processor with built-in Flash controller supporting multiplexed NOR interfaces - standard parallel NOR controllers without ADQ multiplexing support cannot drive this device directly.

Is the ESN (Electronic Serial Number) accessible during normal system operation?

Yes - the 128-bit ESN resides in the Factory Secured Silicon Area at addresses 000000h–000007h and is readable via standard Flash read commands after device power-up and reset. No special unlock sequence is required, but access occurs only through the Flash interface (not DRAM), and the area is write-protected permanently.