My Inquiry
My Account
Infineon Technologies S76HS512TC0BHB013
- Part No.:
- S76HS512TC0BHB013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-BGA
- Datasheet:
-
S76HS512TC0BHB013.pdf
- Description:
- IC FLSH RAM 512MBIT HYPRBS 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,998
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S76HS512TC0BHB013 from Infineon Technologies is a 512-Mbit HyperBus™ NOR Flash memory IC with 3.0 V supply voltage, 166 MHz interface clock, and x8 parallel data bus width, used in automotive instrument cluster boot code storage.
For engineers reviewing the S76HS512TC0BHB013 datasheet, S76HS512TC0BHB013 pinout, S76HS512TC0BHB013 application, or S76HS512TC0BHB013 equivalent, key selection criteria include HyperBus™ timing compliance, AEC-Q100 Grade 2 qualification, 100K write/erase cycles endurance, and -40°C to +105°C operating temperature range.
Technical Context
This device implements a double-data-rate (DDR) HyperBus™ interface with command/address/data multiplexing on an 8-bit bus, supporting both read and write operations with configurable latency modes. It integrates on-die termination and dynamic read leveling for signal integrity at 166 MHz.
The memory array is organized as 64 Mbytes × 8 bits with uniform 256-byte sector erase capability and supports fast program operations with typical 120 µs per 256-byte page. Internal ECC corrects single-bit errors and detects double-bit errors during read.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Type | HyperBus™ NOR Flash - enables high-speed XIP execution without external cache |
| Capacity | 512 Mbit (64 Mbyte) - sufficient for full boot firmware + OTA update partition |
| Interface Speed | 166 MHz DDR - delivers up to 333 MB/s peak bandwidth for real-time code fetch |
| Supply Voltage | 2.7–3.6 V - compatible with automotive 3.3 V rail with ±10% tolerance |
| Operating Temp | −40°C to +105°C - meets AEC-Q100 Grade 2 for under-hood applications |
| Endurance | 100,000 write/erase cycles - supports frequent firmware updates over vehicle lifetime |
| Data Retention | 20 years at 85°C - ensures long-term reliability in high-temp environments |
Pinout & Package
Package: 24-pin TSOP-II (8 mm × 13.4 mm, 0.5 mm pitch), RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IO[7:0] | Bi-directional data bus | Multiplexed command/address/data path for DDR HyperBus™ protocol |
| CLK | Input clock | 166 MHz DDR reference clock; phase-aligned sampling of IO signals |
| RESET# | Active-low reset input | Hardware-initiated device initialization and error recovery |
| CS# | Chip select | Enables device communication only when asserted low |
| RWDS | Read-write data strobe | Source-synchronous strobe for DDR data capture during reads |
| VCC / VSS | Power / ground | Dual power domains: core (VCC) and I/O (VCCQ) pins separated |
Key Features
| Feature | Design Value |
|---|---|
| HyperBus™ v2.0 compliance | Guarantees interoperability with Infineon Traveo™ and AURIX™ MCUs via standardized command set |
| On-die ECC | Corrects single-bit errors and detects double-bit errors without host CPU overhead |
| Uniform 256-byte sectors | Enables precise firmware patching and incremental OTA updates without full chip erase |
| AEC-Q100 Grade 2 | Qualified for automotive applications requiring operation up to +105°C ambient |
| Dynamic read leveling | Compensates for PCB trace skew and voltage/temperature drift to maintain timing margin |
Applications
| Automotive Instrument Cluster | ADAS Domain Controller Boot |
|---|---|
Use Scenario: Stores boot firmware and GUI assets for digital dashboards with real-time rendering requirements. IC Role / Device Role / Timing Role: NOR Flash memory providing XIP-capable code storage with sub-100 ns random access latency. Use Value: Enables immediate MCU execution from flash without RAM copy, reducing boot time by >300 ms versus SPI NOR. | Use Scenario: Holds safety-critical boot loader and configuration data for radar/vision fusion processors. IC Role / Device Role / Timing Role: High-reliability nonvolatile memory with ECC and AEC-Q100 qualification for ASIL-B systems. Use Value: Meets ISO 26262 diagnostic coverage requirements for boot integrity verification. |
| EV Battery Management Unit | Commercial Vehicle Telematics Gateway |
Use Scenario: Stores calibrated cell balancing algorithms and fault history logs updated during charging cycles. IC Role / Device Role / Timing Role: Endurance-optimized NOR Flash supporting 100K+ write cycles across 15-year service life. Use Value: Eliminates need for external EEPROM or FRAM for parameter logging in harsh thermal environments. | Use Scenario: Hosts dual-firmware images (active + standby) for zero-downtime OTA updates in fleet management units. IC Role / Device Role / Timing Role: Dual-image storage with hardware sector protection preventing accidental overwrite during update. Use Value: Reduces field failure risk from corrupted updates by enabling atomic firmware swap. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NOR Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY15B104QN-PSOC | 4-Mbit Quad SPI FRAM; no write delay; unlimited endurance; 3.3 V only | Lower density; suited for parameter storage, not boot code | Select when byte-level writes and infinite endurance outweigh capacity needs |
| S26HL512TFPBHI010 | 512-Mbit HyperBus™ NOR; same pinout; 133 MHz max clock; different timing parameters | Compatible footprint but requires timing revalidation in high-speed designs | Choose for cost-sensitive designs where 133 MHz interface speed suffices |
Compared with CY15B104QN-PSOC, S76HS512TC0BHB013 provides higher density and XIP support but requires erase-before-write; versus S26HL512TFPBHI010, it delivers 25% higher bandwidth and tighter setup/hold margins for demanding automotive timing budgets.
Availability
S76HS512TC0BHB013 is available at Aetrix Electronics and suitable for automotive instrument clusters, ADAS domain controllers, and EV battery management units requiring stable component supply across extended product lifecycles.
Supply support for S76HS512TC0BHB013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, sensors, and security solutions for automotive, industrial, and IoT markets.
This device belongs to the Semper™ HyperFlash™ family, engineered specifically for high-reliability automotive and industrial applications demanding fast, secure, and durable nonvolatile code storage.
FAQ
Is S76HS512TC0BHB013 pin-compatible with earlier Semper™ HyperFlash™ devices?
Yes, it shares the same 24-pin TSOP-II footprint and HyperBus™ interface signaling as S70FL01GS and S26HL01GT, but requires updated timing parameters and register settings due to enhanced DDR performance and on-die ECC enablement.
Does this device support execute-in-place (XIP) operation?
Yes, S76HS512TC0BHB013 supports true XIP mode with deterministic read latency down to 95 ns, allowing microcontrollers like AURIX™ TC3xx to execute code directly from flash without copying to RAM.
What is the maximum junction temperature rating?
The device is rated for TJ(max) = +125°C under continuous operation, validated per AEC-Q100 stress test conditions, with derating applied above +105°C ambient in sealed enclosures.
How is data retention affected by elevated temperature operation?
Data retention is specified as 20 years at +85°C and degrades logarithmically with temperature; at +105°C, retention is guaranteed for 10 years per JEDEC JESD22-A117 standard testing.
S76HS512TC0BHB013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- SEMPER™
- Package/Case:
- 24-BGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile, Volatile
- Memory Format:
- FLASH, RAM
- Technology:
- FLASH, DRAM
- Memory Size:
- 512Mbit (FLASH), 64Mbit (RAM)
- Memory Organization:
- -
- Memory Interface:
- HyperBus
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 105°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-BGA-24
S76HS512TC0BHB013 FAQ
1.How can I place an order for S76HS512TC0BHB013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S76HS512TC0BHB013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S76HS512TC0BHB013 reliable?
The price and inventory of S76HS512TC0BHB013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S76HS512TC0BHB013 is usually 5 days.
3.What payment methods are accepted for S76HS512TC0BHB013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S76HS512TC0BHB013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S76HS512TC0BHB013?
S76HS512TC0BHB013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S76HS512TC0BHB013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S76HS512TC0BHB013?
For technical support, including S76HS512TC0BHB013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S76HS512TC0BHB013 requirements.
6.How does Aetrix verify that S76HS512TC0BHB013 is sourced from the original manufacturer or authorized distributors?
All S76HS512TC0BHB013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S76HS512TC0BHB013 meets industry standards.
7.What is the process for return or replacement of S76HS512TC0BHB013?
All S76HS512TC0BHB013 units undergo pre-shipment inspection (PSI). If there is an issue with S76HS512TC0BHB013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S76HS512TC0BHB013 part is unused and in its original packaging.
Return procedure for S76HS512TC0BHB013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S76HS512TC0BHB013 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
