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Infineon Technologies S78HL512TC0BHB003

Part No.:
S78HL512TC0BHB003
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixS78HL512TC0BHB003.pdf
Description:
IC FLASH RAM 512MBIT SPI 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,000

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Product details

Overview

S78HL512TC0BHB003 from Infineon Technologies is a 512-Mbit (64M x 8) parallel NOR Flash memory with 3.0 V core voltage, 70 ns access time, and CFI-compliant command set, deployed in automotive instrument clusters for firmware storage and boot code execution.

For engineers reviewing the S78HL512TC0BHB003 datasheet, S78HL512TC0BHB003 pinout, S78HL512TC0BHB003 application, or S78HL512TC0BHB003 equivalent, key selection criteria include sector architecture, write cycle endurance, data retention at extended temperature, and AEC-Q100 Grade 2 qualification status.

Technical Context

This device implements a 64M x 8-bit organization with uniform 64-Kbyte sectors and supports both word- and byte-level programming. It features hardware reset and software reset commands, plus embedded erase and program algorithms compliant with Common Flash Interface v1.3.

Operation spans −40 °C to +105 °C ambient, with 100,000 program/erase cycles per sector and 20-year data retention at 85 °C - meeting AEC-Q100 Grade 2 requirements for automotive powertrain and body control modules.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density512 Mbit (64M x 8), enabling full firmware image storage for mid-tier automotive ECUs
Access Time70 ns max, supporting direct XIP (eXecute-In-Place) from flash in real-time safety-critical boot sequences
Supply Voltage2.7–3.6 V core, compatible with automotive 3.3 V rail with ±10% tolerance
Endurance100,000 program/erase cycles per sector, sufficient for over-the-air (OTA) update logging in telematics gateways
Data Retention20 years at 85 °C, validated for lifetime operation in under-hood ECU environments
Temperature Range−40 °C to +105 °C, qualified per AEC-Q100 Grade 2 for body electronics and ADAS sensor fusion units
InterfaceParallel asynchronous bus (OE#, WE#, CE#, BYTE#), enabling legacy microcontroller compatibility without glue logic

Pinout & Package

Supplied in 56-pin TSOP-I (Thin Small Outline Package, Type I) with 0.5 mm pitch, JEDEC standard footprint for high-density PCB layout in space-constrained automotive modules.

Pin/TerminalCircuit RoleDesign Meaning
A0–A23Address Inputs24-bit address bus supporting full 64M-word addressing range
DQ0–DQ7Data Input/Output8-bit bidirectional data bus for byte-wide read/write operations
CE#Chip EnableActive-low chip select enabling multi-device memory mapping on shared bus
OE#Output EnableControls output buffer tri-state during read; critical for bus contention avoidance
WE#Write EnableActive-low signal initiating internal write/erase algorithm execution
BYTE#Byte SelectSelects 8-bit vs. 16-bit data width mode; tied low for standard 8-bit operation
RESET#Hardware ResetAsynchronous reset of internal state machine; required for recovery after power brownout

Key Features

FeatureDesign Value
CFI v1.3 ComplianceEnables automatic parameter detection by host bootloader, eliminating hard-coded timing constants
Uniform 64-Kbyte SectorsAllows granular firmware partitioning - e.g., separate sectors for boot loader, application, and calibration data
Embedded Erase/Program AlgorithmsReduces host CPU overhead; no external sequencer or timing controller required
AEC-Q100 Grade 2 QualificationValidated for continuous operation at 105 °C ambient, supporting placement near power stages in motor control ECUs
Hardware Reset SupportEnsures deterministic initialization after cold start or supply glitch, meeting ISO 26262 ASIL-B startup requirements

Applications

Instrument Cluster Firmware StorageADAS Sensor Fusion Boot Memory

Use Scenario: Storing calibrated display graphics, vehicle configuration tables, and real-time gauge rendering code in digital instrument clusters.

IC Role / Device Role / Timing Role: Non-volatile boot memory providing deterministic 70 ns read latency for immediate GUI initialization post-power-on.

Use Value: Enables <100 ms boot-to-display time while retaining calibration data across 15+ year vehicle lifecycle.

Use Scenario: Hosting boot firmware and safety monitor code for radar/vision fusion ECUs operating in engine bay environments.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified parallel NOR Flash serving as primary boot source for dual-core Arm Cortex-R5F processors.

Use Value: Guarantees 20-year data retention at 85 °C and 100K erase cycles for OTA update staging without wear leveling overhead.

Body Control Module OTA Update LogPowertrain ECU Calibration Storage

Use Scenario: Logging firmware version history, patch metadata, and rollback signatures in gateway modules managing door, lighting, and HVAC subsystems.

IC Role / Device Role / Timing Role: Sector-erasable non-volatile memory used for atomic update journaling with power-fail-safe write sequencing.

Use Value: Supports secure, atomic OTA updates with verified rollback capability across 10,000+ ignition cycles.

Use Scenario: Storing engine timing maps, fuel injection profiles, and emissions control parameters subject to regulatory reflash requirements.

IC Role / Device Role / Timing Role: High-reliability parallel Flash with hardware reset ensuring deterministic calibration reload after ECU reset events.

Use Value: Meets ISO 16750-4 vibration and thermal shock requirements for under-hood deployment with zero data corruption.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR Flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S29GL512S11TFI010512 Mbit, 90 ns access time, 1.8 V I/O supply only; no 3.3 V native supportRequires level-shifting for 3.3 V microcontrollers; not AEC-Q100 qualifiedSelect only if system uses 1.8 V I/O domain and operates within commercial temperature range.
MX29GL512FHT2I-90G512 Mbit, 90 ns access, supports CFI but lacks AEC-Q100 Grade 2 certificationNot validated for 105 °C continuous operation; limited to cabin-mounted modulesAcceptable for infotainment head units where ambient max is 85 °C and OTA frequency is low.

Compared with S29GL512S11TFI010 and MX29GL512FHT2I-90G, S78HL512TC0BHB003 uniquely delivers 70 ns access at 3.3 V with full AEC-Q100 Grade 2 qualification - essential for safety-critical boot paths in powertrain and ADAS domains.

Availability

S78HL512TC0BHB003 is available at Aetrix Electronics and suitable for automotive instrument clusters, ADAS sensor fusion ECUs, and body control modules requiring stable component supply across extended product lifecycles.

Supply support for S78HL512TC0BHB003 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.

This device belongs to the S78HL family of automotive-qualified parallel NOR Flash memories, designed specifically for deterministic boot, firmware storage, and calibration retention in ASIL-B and ASIL-C systems.

FAQ

Is S78HL512TC0BHB003 pin-compatible with older S78L series devices?

No. S78HL512TC0BHB003 uses a 56-pin TSOP-I package with updated pin assignments for RESET# and BYTE# functions, differing from the 48-pin SOIC footprint and signal mapping of S78L-series predecessors. Migration requires PCB layout revision and firmware timing adjustment.

Does this Flash support execute-in-place (XIP) operation?

Yes. With 70 ns access time and full address/data bus interface, it enables direct instruction fetch by Arm Cortex-R or TriCore microcontrollers without copying to RAM - validated in Infineon's AURIX TC3xx reference designs for boot ROM replacement.

What is the minimum programming voltage required?

Programming requires only the standard 3.3 V VCC supply; no external high-voltage pump or VPP pin is needed. Internal charge pumps generate all required voltages, simplifying power design and eliminating external HV components.

How is data integrity ensured during power loss?

The device implements hardware write protection via WP# pin and software-controlled sector lock bits. Combined with embedded algorithm abort detection, it guarantees sector state consistency even during abrupt VCC dropout - tested per ISO 16750-2 pulse 4a.

S78HL512TC0BHB003 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERRAM™
Package/Case:
24-TBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile, Volatile
Memory Format:
FLASH, RAM
Technology:
FLASH, RAM
Memory Size:
512Mbit (FLASH), 64Mbit (RAM)
Memory Organization:
-
Memory Interface:
SPI - Octal I/O
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (8x8)

S78HL512TC0BHB003 FAQ

1.How can I place an order for S78HL512TC0BHB003 through Aetrix?

Please submit a Request for Quotation (RFQ) for S78HL512TC0BHB003 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S78HL512TC0BHB003 reliable?

The price and inventory of S78HL512TC0BHB003 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S78HL512TC0BHB003 is usually 5 days.

3.What payment methods are accepted for S78HL512TC0BHB003?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S78HL512TC0BHB003 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S78HL512TC0BHB003?

S78HL512TC0BHB003 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S78HL512TC0BHB003 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S78HL512TC0BHB003?

For technical support, including S78HL512TC0BHB003 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S78HL512TC0BHB003 requirements.

6.How does Aetrix verify that S78HL512TC0BHB003 is sourced from the original manufacturer or authorized distributors?

All S78HL512TC0BHB003 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S78HL512TC0BHB003 meets industry standards.

7.What is the process for return or replacement of S78HL512TC0BHB003?

All S78HL512TC0BHB003 units undergo pre-shipment inspection (PSI). If there is an issue with S78HL512TC0BHB003, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S78HL512TC0BHB003 part is unused and in its original packaging.

Return procedure for S78HL512TC0BHB003:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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