Infineon Technologies S80KS2562GABHI023
- Part No.:
- S80KS2562GABHI023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S80KS2562GABHI023.pdf
- Description:
- IC PSRAM 256MBIT HYPERBUS 24FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S80KS2562GABHI023 from Infineon Technologies is a 256 Mb self-refresh DRAM (HYPERRAM™) with HYPERBUS™ DDR interface, operating at 1.8 V, supporting 200 MHz clock rate, 400 MBps data throughput, and 24-ball FBGA package for industrial temperature range (–40 °C to +85 °C). It functions as pseudo-static RAM in embedded systems requiring high-bandwidth, low-pin-count memory expansion.
For engineers reviewing the S80KS2562GABHI023 datasheet, S80KS2562GABHI023 pinout, S80KS2562GABHI023 application, or S80KS2562GABHI023 equivalent, key selection criteria include HYPERBUS™ timing compliance, RWDS-driven read/write strobe behavior, burst configuration flexibility (linear/wrapped/hybrid), partial array refresh support, and deep power-down current (15 μA @ 105 °C).
Technical Context
The S80KS2562GABHI023 implements a self-refresh DRAM core with integrated refresh control logic, eliminating host-managed refresh cycles. Its HYPERBUS™ interface uses an 8-bit bidirectional DQ bus with source-synchronous RWDS for read strobe and write mask, and supports both single-ended (CK) and optional differential (CK/CK#) clocking.
Command/address and data share the same DQ[7:0] lines in time-multiplexed fashion; transactions begin with six CA bytes followed by configurable initial access latency (1× or 2× count), and support wrapped burst lengths of 16–128 bytes or hybrid burst modes for optimized memory access efficiency.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mb (32 MB), organized as 4M × 64-bit for efficient wide-data access in MCU offload scenarios |
| Interface Standard | HYPERRAM™ with HYPERBUS™ DDR protocol - enables 2-byte transfers per clock edge on 8-bit DQ bus |
| Max Clock Rate | 200 MHz - delivers up to 400 MBps sustained throughput with minimal signal count (11–12 pins) |
| Burst Configuration | Configurable linear/wrapped/hybrid bursts (16–128 bytes) - allows alignment with cache line sizes or DMA buffer boundaries |
| Power Modes | Hybrid sleep and deep power down (15 μA @ 105 °C) - supports ultra-low-power standby in battery-backed systems |
| Refresh Management | On-die self-refresh with partial array options (1/8, 1/4, 1/2) - reduces refresh overhead during partial memory usage |
| Operating Temp | Industrial grade: –40 °C to +85 °C - qualified for extended-temperature embedded control and display subsystems |
Pinout & Package
Package: 24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch), RoHS-compliant, suitable for high-density PCB layouts with thermal and signal integrity constraints.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for HYPERBUS™ transaction initiation; deassertion terminates all ongoing transfers |
| CK / CK# | Clock Input (optional differential) | Source-synchronous timing reference; CK# enables noise-immune clock reception in high-speed layouts |
| RWDS | Bidirectional Read/Write Strobe | Indicates initial latency before read data; serves as read data strobe or write byte mask (HIGH = masked) |
| DQ[7:0] | Bidirectional Data Bus | Time-multiplexed command/address/data path; LV-CMOS 1.8 V compatible, supports DDR transfers |
| RESET# | Hardware Reset Input | Asynchronous active-low reset that clears internal state and forces reinitialization sequence |
Key Features
| Feature | Design Value |
|---|---|
| Self-refresh DRAM architecture | Eliminates external refresh controller and timing overhead - presents as PSRAM to host processor |
| HYPERBUS™ DDR interface | Reduces pin count to 11–12 signals while sustaining 400 MBps - ideal for space-constrained MCU co-processor memory expansion |
| Configurable output drive strength | Allows optimization of signal integrity and EMI across varying trace lengths and load conditions |
| Partial array refresh | Enables dynamic power scaling by refreshing only used memory segments - extends battery life in intermittent-access applications |
| Deep power down mode | 15 μA quiescent current at 105 °C - meets stringent low-power requirements for always-on sensor hubs and edge nodes |
Applications
| Automotive Instrument Clusters | Industrial HMI Displays |
|---|---|
Use Scenario: Real-time rendering of vector graphics and animated UI elements in digital dashboards with limited MCU SRAM. IC Role / Device Role / Timing Role: Offloads frame buffer and asset storage from host MCU; provides deterministic 35 ns tACC and source-synchronous RWDS-aligned reads. Use Value: Enables smooth 60 Hz UI updates using wrapped 64-byte bursts without CPU intervention or refresh management. | Use Scenario: Local caching of GUI assets and operational logs in panel-mounted HMIs with ARM Cortex-A/M series processors. IC Role / Device Role / Timing Role: Acts as high-throughput, low-latency PSRAM replacement; supports hybrid burst mode for mixed read/write workloads. Use Value: Reduces external memory bus congestion by 60% vs. parallel NOR flash, while maintaining industrial temp reliability. |
| Edge AI Sensor Gateways | Medical Portable Monitors |
Use Scenario: Buffering multi-channel sensor streams (ECG, SpO₂, temperature) prior to local inference or wireless upload. IC Role / Device Role / Timing Role: High-bandwidth, low-power memory buffer with deep power down between sampling intervals. Use Value: Achieves 15 μA standby current during idle periods while retaining full 256 Mb context across wake cycles. | Use Scenario: Storing waveform history and calibration data in Class II medical devices requiring AEC-Q100-compliant components. IC Role / Device Role / Timing Role: Industrial-grade HYPERRAM™ with –40 °C to +85 °C operation and built-in partial refresh for data retention assurance. Use Value: Meets IEC 60601-1 environmental stress requirements without derating or thermal margin penalties. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed, low-pin-count PSRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY15B104QN-PSOC | 4 Mb Quad SPI FRAM; no refresh needed, but lower density (4 Mb vs. 256 Mb) and 40 MBps max throughput | Best for small-code, fast-write logging; unsuitable for frame buffers or large DMA buffers | Select when write endurance >10¹⁴ cycles is required and bandwidth <50 MBps suffices |
| IS66WV51216EBLL-15BLI | 8 Mb asynchronous parallel SRAM; 15 ns access, 32-bit bus, no self-refresh, higher pin count (48-pin TSOP) | Used in legacy FPGA-based controllers; lacks HYPERBUS™ timing compatibility and power modes | Select only for drop-in replacement in existing parallel SRAM designs with no layout revision |
Compared with CY15B104QN-PSOC and IS66WV51216EBLL-15BLI, the S80KS2562GABHI023 uniquely balances 256 Mb density, 400 MBps DDR throughput, and ultra-low deep power down - making it the only viable option for modern MCU-based edge devices needing scalable, low-pin-count PSRAM.
Availability
S80KS2562GABHI023 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMI displays, and edge AI sensor gateways requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S80KS2562GABHI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and memory solutions for automotive, industrial, and IoT markets.
The HYPERRAM™ product line targets memory-constrained embedded systems needing high-bandwidth, low-pin-count PSRAM alternatives to legacy parallel SRAM and NOR flash.
FAQ
What is the role of the RWDS signal in read versus write operations?
RWDS serves dual roles: during reads, it acts as a source-synchronous strobe aligned with DQ data edges; during writes, it functions as a per-byte mask (HIGH = masked, LOW = written). This eliminates need for separate write-enable or byte-lane control signals, simplifying interface design while enabling precise byte-level write control.
Does the S80KS2562GABHI023 require external refresh circuitry?
No. The device integrates self-refresh logic that autonomously manages DRAM array refresh during idle periods. Host processors interact with it as pseudo-static RAM - no refresh commands, timers, or scheduling are required, reducing firmware complexity and CPU overhead.
How does burst length configuration affect system performance?
Burst length (16–128 bytes) directly impacts bus utilization and latency hiding. Shorter bursts reduce initial access delay but increase transaction overhead; longer bursts improve throughput for sequential access but may stall host if interrupted. Hybrid mode (wrapped + linear) optimizes for cache-line-aligned accesses common in ARM-based SoCs.
Can the S80KS2562GABHI023 operate with single-ended clock only?
Yes. The device supports single-ended CK input by default. CK# is optional and used only when differential clocking is implemented for improved noise immunity in electrically noisy environments. No hardware modification or configuration register change is needed to use single-ended mode.
S80KS2562GABHI023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERRAM™
- Package/Case:
- 24-VBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- PSRAM
- Technology:
- PSRAM (Pseudo SRAM)
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- HyperBus
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 35 ns
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S80KS2562GABHI023 FAQ
1.How can I place an order for S80KS2562GABHI023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S80KS2562GABHI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S80KS2562GABHI023 reliable?
The price and inventory of S80KS2562GABHI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S80KS2562GABHI023 is usually 5 days.
3.What payment methods are accepted for S80KS2562GABHI023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S80KS2562GABHI023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S80KS2562GABHI023?
S80KS2562GABHI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S80KS2562GABHI023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S80KS2562GABHI023?
For technical support, including S80KS2562GABHI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S80KS2562GABHI023 requirements.
6.How does Aetrix verify that S80KS2562GABHI023 is sourced from the original manufacturer or authorized distributors?
All S80KS2562GABHI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S80KS2562GABHI023 meets industry standards.
7.What is the process for return or replacement of S80KS2562GABHI023?
All S80KS2562GABHI023 units undergo pre-shipment inspection (PSI). If there is an issue with S80KS2562GABHI023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S80KS2562GABHI023 part is unused and in its original packaging.
Return procedure for S80KS2562GABHI023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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