Infineon Technologies S80KS2563GABHB020
- Part No.:
- S80KS2563GABHB020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S80KS2563GABHB020.pdf
- Description:
- IC PSRAM 256MBIT SPI/OCTL 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:636
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Product details
Overview
S80KS2563GABHB020 from Infineon Technologies is a 256 Mb self-refresh DRAM (HYPERRAM™) with Octal xSPI interface, operating at 1.8 V. It functions as pseudo-static RAM for microcontroller- and SoC-based systems requiring high-bandwidth, low-pin-count external memory-supporting up to 400 MBps throughput, 200 MHz DDR clock, and configurable burst lengths (16–128 bytes) in industrial and automotive applications.
For engineers reviewing the S80KS2563GABHB020 datasheet, S80KS2563GABHB020 pinout, S80KS2563GABHB020 application, or S80KS2563GABHB020 equivalent, this device delivers deterministic latency, on-die refresh management, and hybrid sleep/deep power-down modes-critical for real-time embedded systems where external memory must emulate SRAM behavior without host refresh intervention.
Technical Context
The S80KS2563GABHB020 implements an xSPI (Octal) DDR interface with 11–12 signal lines (including optional CK#/CS#/RWDS/DQ[7:0]/RESET#), supporting command-address-data transactions with 16-bit opcodes sent on both clock edges. Its internal logic handles full/partial array refresh autonomously during idle cycles or added latency windows signaled via RWDS high pulse.
It uses 25-nm DRAM technology with separate VCC (1.8 V core) and VCCQ (1.8 V I/O) supplies, supports linear and wrapped burst modes (8/16/32/64 clocks), and features configurable output drive strength and tACC ≤ 35 ns at 200 MHz-enabling seamless integration into resource-constrained MCU interfaces without dedicated DRAM controllers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 256 Mb (32 MB), organized as 4M × 64-bit; enables compact external memory expansion for MCUs with limited address bus width. |
| Interface | Octal xSPI DDR, 1.8 V LV-CMOS; reduces pin count vs parallel DRAM while delivering 2× data rate per clock edge. |
| Max clock rate | 200 MHz DDR; achieves 400 MBps peak bandwidth-sufficient for graphics frame buffers or firmware overlays in HMI systems. |
| Burst length | Configurable: 16/32/64/128 bytes (8/16/32/64 clocks); balances latency and throughput for streaming vs random-access workloads. |
| Access time (tACC) | ≤35 ns at 200 MHz; ensures predictable timing for deterministic real-time response in automotive ADAS subsystems. |
| Power modes | Hybrid sleep (1.55 mA @ 105 °C), deep power down (15 µA @ 105 °C); extends battery life in always-on telematics modules. |
| Operating temp | –40 °C to +105 °C (Industrial Plus); qualified for under-hood automotive ECUs and industrial gateways without derating. |
Pinout & Package
24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch), RoHS-compliant, with ball map matching JEDEC MO-276AA standard. Package supports automated reflow assembly and thermal performance suitable for high-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input (optional) | Enables noise-immune timing; CK# required only when differential mode enabled via configuration register. |
| CS# | Chip select (active-low) | Asserted to initiate all xSPI transactions; deassertion terminates command/address/data transfer sequence. |
| RWDS | Bidirectional read-write data strobe | Indicates refresh latency at transaction start; serves as read strobe or write mask depending on direction. |
| DQ[7:0] | Octal bidirectional data bus | Transfers 8 bits per half-cycle in DDR mode; supports command, address, and payload with no separate DQS line. |
| RESET# | Hardware reset input (active-low) | Forces device into known state and resets internal registers; required before initialization sequence. |
Key Features
| Feature | Design Value |
|---|---|
| Self-refresh DRAM architecture | Eliminates host-side refresh logic-appears as PSRAM to MCU, reducing firmware complexity and CPU overhead. |
| Configurable burst mode | Supports linear or wrapped bursts (16–128 bytes); optimizes cache line fills and DMA transfers without software tuning. |
| On-die refresh signaling (RWDS) | Signals required refresh latency at transaction start via RWDS high pulse-enables deterministic worst-case timing budgeting. |
| Hybrid sleep & deep power-down | Reduces standby current to 1.55 mA or 15 µA respectively-critical for battery-backed infotainment and remote sensors. |
| AEC-Q100 Grade 2 qualification | Validated for –40 °C to +105 °C operation with robust ESD/latch-up immunity-meets automotive functional safety requirements. |
Applications
| Automotive Instrument Cluster | Industrial HMI Display Buffer |
|---|---|
Use Scenario: Storing high-resolution GUI assets and dynamic widget data for real-time rendering on TFT-LCD panels. IC Role / Device Role / Timing Role: External PSRAM buffer interfaced directly to ARM Cortex-M7 MCU via xSPI, providing deterministic <35 ns access latency. Use Value: Eliminates need for external DRAM controller; enables 400 MBps frame buffer updates without CPU intervention or refresh scheduling. |
Use Scenario: Holding firmware overlays and localized language strings for multi-language industrial operator terminals. IC Role / Device Role / Timing Role: Non-volatile-capable memory extension for Cortex-A53 SoC running Linux, accessed via xSPI driver stack. Use Value: Reduces BOM cost vs LPDDR2 while maintaining sufficient bandwidth for UI asset streaming and OTA update staging. |
| Smart Home Gateway Cache | Medical Patient Monitor Data Log |
Use Scenario: Caching encrypted sensor fusion results and local AI inference outputs before cloud upload. IC Role / Device Role / Timing Role: Low-power external memory for RISC-V-based edge node, entering deep power-down between BLE/Wi-Fi transmission bursts. Use Value: Achieves 15 µA retention current-extending coin-cell battery life to >2 years in intermittent-monitoring deployments. |
Use Scenario: Buffering real-time ECG waveform samples prior to compression and secure storage on SD card. IC Role / Device Role / Timing Role: Deterministic-latency memory for ARM Cortex-M4F DSP subsystem, synchronized to ADC sampling clock via xSPI timing constraints. Use Value: Guarantees tACC ≤35 ns and zero refresh jitter-ensuring waveform integrity meets IEC 62304 Class C timing requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed, low-pin-count external memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress Semiconductors S27KS0641DPBHV020 | 64 Mb density, same 24-ball FBGA, 1.8 V xSPI interface, but lacks deep power-down mode (min standby 35 µA). | Lower capacity limits use in full-HD display buffers; insufficient for multi-app firmware partitioning. | Select when cost sensitivity outweighs capacity and ultra-low-power needs. |
| Winbond W958D8MBJX1I | 256 Mb LPDDR3, 1.2 V, 30-ball BGA; requires full DDR controller, higher pin count, and complex layout. | Demands dedicated memory controller IP and PCB routing for DQS/DQ groups-unsuitable for MCU-only designs. | Select only when system already includes LPDDR3 controller and board space allows larger package. |
Compared with S27KS0641DPBHV020 and W958D8MBJX1I, the S80KS2563GABHB020 uniquely combines 256 Mb density, xSPI simplicity, sub-20 µA deep power-down, and AEC-Q100 Grade 2 qualification-making it the only drop-in solution for automotive-grade MCU memory expansion without controller redesign.
Availability
S80KS2563GABHB020 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMIs, smart home gateways, and medical patient monitors requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S80KS2563GABHB020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q200.
The HYPERRAM™ product line targets MCU- and SoC-based systems needing high-bandwidth external memory without DRAM controller complexity-designed specifically for automotive, industrial, and IoT edge devices demanding reliability, low power, and small footprint.
FAQ
Does S80KS2563GABHB020 require external refresh circuitry?
No. The device integrates self-refresh logic that automatically manages DRAM array refresh during idle periods or inserted latency windows signaled via RWDS. Host processors interact with it as pseudo-static RAM-no refresh commands, timers, or scheduling are needed in firmware or hardware.
What is the function of the RWDS pin during read and write operations?
RWDS serves three roles: (1) signals required refresh latency at transaction start (driven HIGH), (2) acts as read data strobe during reads (output), and (3) functions as write data mask during writes (input). Its bidirectional behavior is controlled automatically by internal state machine based on transaction type.
Can S80KS2563GABHB020 operate with single-ended clock only?
Yes. The device supports single-ended CK input by default. Differential clock (CK/CK#) is optional and enabled only when bit [7] of Configuration Register 0 is set. No external termination or layout changes are required for single-ended mode.
Is S80KS2563GABHB020 compatible with standard SPI host controllers?
No. It requires an xSPI (Octal) DDR-capable host controller-such as Infineon's XMC4000 series, NXP i.MX RT1170, or Microchip SAM9X7 with xSPI peripheral. Standard SPI peripherals cannot generate the 16-bit opcode format, DDR timing, or RWDS protocol required for command execution.
S80KS2563GABHB020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERRAM™
- Package/Case:
- 24-VBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- PSRAM
- Technology:
- PSRAM (Pseudo SRAM)
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- SPI - Octal I/O
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 35 ns
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S80KS2563GABHB020 FAQ
1.How can I place an order for S80KS2563GABHB020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S80KS2563GABHB020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S80KS2563GABHB020 reliable?
The price and inventory of S80KS2563GABHB020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S80KS2563GABHB020 is usually 5 days.
3.What payment methods are accepted for S80KS2563GABHB020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S80KS2563GABHB020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S80KS2563GABHB020?
S80KS2563GABHB020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S80KS2563GABHB020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S80KS2563GABHB020?
For technical support, including S80KS2563GABHB020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S80KS2563GABHB020 requirements.
6.How does Aetrix verify that S80KS2563GABHB020 is sourced from the original manufacturer or authorized distributors?
All S80KS2563GABHB020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S80KS2563GABHB020 meets industry standards.
7.What is the process for return or replacement of S80KS2563GABHB020?
All S80KS2563GABHB020 units undergo pre-shipment inspection (PSI). If there is an issue with S80KS2563GABHB020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S80KS2563GABHB020 part is unused and in its original packaging.
Return procedure for S80KS2563GABHB020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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