Infineon Technologies S80KS2564GACHA040
- Part No.:
- S80KS2564GACHA040
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 49-VBGA
- Datasheet:
-
S80KS2564GACHA040.pdf
- Description:
- IC PSRAM 256MBIT HYPERBUS 49FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,594
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S80KS2564GACHA040 from Infineon Technologies is a 256 Mb pseudo-static RAM (PSRAM) with self-refresh DRAM architecture, implementing the HYPERBUS™ Extended-IO x16 interface. It operates at 1.8 V (1.7–2.0 V range), supports DDR transfers up to 200 MHz, delivers up to 800 MBps throughput, and features configurable burst lengths (16–128 words) and partial/full array refresh - deployed in automotive infotainment head units requiring low-pin-count, high-bandwidth external memory.
For engineers reviewing the S80KS2564GACHA040 datasheet, S80KS2564GACHA040 pinout, S80KS2564GACHA040 application, or S80KS2564GACHA040 equivalent, key selection criteria include HYPERBUS™ timing compliance, RWDS bidirectional strobe behavior, AEC-Q100 Grade 2 temperature support (–40°C to +105°C), and FBGA-49 package compatibility with high-density automotive PCB layouts.
Technical Context
The device integrates on-die refresh control logic that autonomously manages DRAM array refresh without host intervention, presenting a static RAM interface abstraction to the host controller. Its HYPERBUS™ Extended-IO interface uses only 20 signals (21 with optional differential clock), with command/address and data multiplexed over DQ[15:0], and RWDS serving dual roles: initial latency indicator during CA transfer and source-synchronous read strobe / write mask during data phases.
Transactions are burst-oriented with linear or wrapped addressing modes; wrapped bursts align to cache-line boundaries (e.g., 32-word wrap for 128-byte lines), while hybrid burst mode enables one wrapped segment followed by linear continuation. All I/Os are LV-CMOS compatible, and clocking supports both single-ended (CK) and differential (CK/CK#) configurations with center-aligned data capture.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 256 Mb (32 MB), organized as 2M × 16-bit, enabling compact code/data storage without external refresh management |
| Interface standard | HYPERRAM™ HYPERBUS™ Extended-IO x16, reducing signal count vs. parallel NOR/NAND while maintaining DDR bandwidth |
| Max clock rate | 200 MHz DDR - achieves 800 MBps peak throughput, sufficient for real-time graphics frame buffering in ADAS displays |
| Burst length | Configurable: 16/32/64/128 words (8/16/32/64 clocks); wrapped mode supports cache-line-aligned fetches |
| Operating voltage | 1.8 V nominal (1.7–2.0 V), compatible with automotive SoC I/O domains and low-power system rails |
| Temperature grade | AEC-Q100 Grade 2: –40°C to +105°C, qualified for engine bay–adjacent or under-dash automotive modules |
| Power modes | Hybrid Sleep and Deep Power Down (15 μA), enabling rapid wake-up and ultra-low standby in always-on systems |
Pinout & Package
Package: 49-ball FBGA (7 mm × 7 mm, 0.8 mm pitch), RoHS-compliant, optimized for thermal dissipation and high-density automotive PCB routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select input | Active-low enable for command/address and data transactions; deassertion terminates ongoing burst |
| CK / CK# | Clock inputs | Single-ended (CK) or differential (CK/CK#) edge-triggered timing reference for all DDR transfers |
| RWDS[1:0] | Bidirectional strobe/mask | Indicates initial latency during CA phase; serves as read data strobe (edge-aligned) or write mask (HIGH = masked) |
| DQ[15:0] | Data I/O bus | 16-bit multiplexed bus for command, address, and DDR data; LV-CMOS compatible, configurable drive strength |
| RESET# | Hardware reset input | Asynchronous active-low reset that clears internal state and forces re-initialization of memory controller interface |
| VCC / VCCQ | Power supplies | VCC powers core DRAM array; VCCQ powers I/O buffers - decoupling supports noise isolation in mixed-signal environments |
Key Features
| Feature | Design Value |
|---|---|
| Self-refresh DRAM core | Eliminates external refresh controller overhead and timing constraints, simplifying host firmware and SoC integration |
| HYPERBUS™ Extended-IO x16 | Reduces interface pin count to 20–21 signals versus >40 for legacy parallel interfaces, easing PCB layer count and EMI control |
| Configurable output drive strength | Allows optimization of signal integrity and power consumption per board trace length and loading conditions |
| Partial array refresh | Enables selective refresh of 1/8, 1/4, or 1/2 array segments during low-activity periods, cutting dynamic power by up to 60% |
| Hybrid burst mode | Combines wrapped burst (for cache line fill) with linear continuation (for streaming), improving memory subsystem efficiency in mixed workloads |
Applications
| Automotive Instrument Cluster Display | ADAS Camera Preprocessing Buffer |
|---|---|
Use Scenario: Real-time rendering of vehicle speed, navigation arrows, and warning icons with <10 ms latency. IC Role / Device Role / Timing Role: External frame buffer for GPU or display controller, interfaced via HYPERBUS™ to minimize SoC pin usage. Use Value: 200 MHz DDR bandwidth ensures full-HD UI updates at 60 fps; AEC-Q100 Grade 2 rating guarantees operation across cabin temperature extremes. | Use Scenario: Temporary storage of raw Bayer image frames before ISP pipeline processing in surround-view systems. IC Role / Device Role / Timing Role: High-throughput, low-latency scratchpad memory between image sensor interface and ISP engine. Use Value: Wrapped burst mode enables cache-line-aligned 32-word reads matching typical ISP line buffers; RWDS masking supports partial writes during dynamic exposure adjustment. |
| Infotainment Head Unit OS Storage | Telematics Control Unit Firmware Cache |
Use Scenario: Storing compressed UI assets, voice recognition models, and navigation map tiles for fast decompression and execution. IC Role / Device Role / Timing Role: Execute-in-place (XIP)-capable PSRAM used as secondary code/data memory alongside internal flash. Use Value: Linear burst transfers accelerate sequential instruction fetch; Deep Power Down mode reduces idle current to 15 μA during Bluetooth audio-only operation. | Use Scenario: Caching OTA update packages and cryptographic keys prior to secure firmware validation and flashing. IC Role / Device Role / Timing Role: Secure, fast-access non-volatile adjunct memory supporting UDS diagnostic sessions and secure boot verification. Use Value: Hybrid Sleep mode allows sub-10 μs wake-up latency after CAN FD interrupt; FBGA-49 footprint fits constrained telematics module layouts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PSRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S27KL0641DPBHI020 | 64 Mb density, same HYPERBUS™ x16 interface, 166 MHz max clock, AEC-Q100 Grade 2 | Lower bandwidth (664 MBps) and capacity; suitable for cost-sensitive entry-tier clusters | Select when memory footprint and BOM cost outweigh peak throughput requirements |
| Winbond W9825G6JH-6I | 256 Mb LPDDR2, 400 MHz clock, 16-bit bus, but requires external refresh and 48-ball VFBGA | No integrated refresh logic; demands host-side refresh scheduling and tighter timing closure | Choose only if existing LPDDR2 PHY and controller infrastructure exists and HYPERBUS™ ecosystem adoption is not required |
Compared with S27KL0641DPBHI020, S80KS2564GACHA040 delivers 2× memory density and 20% higher throughput; versus W9825G6JH-6I, it eliminates host refresh overhead and reduces design complexity despite identical capacity - critical for ASIL-B–compliant automotive software stacks.
Availability
S80KS2564GACHA040 is available at Aetrix Electronics and suitable for automotive instrument clusters, ADAS camera preprocessing pipelines, and telematics control units requiring stable component supply across extended product lifecycles.
Supply support for S80KS2564GACHA040 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive microcontrollers, and memory solutions, with global manufacturing and automotive qualification expertise.
This device belongs to the HYPERRAM™ family - designed specifically to replace parallel NOR/NAND and SRAM in automotive and industrial systems where pin count, power, and ease of interface integration are critical constraints.
FAQ
What is the function of the RWDS[1:0] signal in S80KS2564GACHA040?
RWDS[1:0] is a bidirectional signal performing three distinct roles: (1) indicating initial access latency during command/address transfer, (2) acting as a source-synchronous read data strobe (edge-aligned with DQ), and (3) serving as a write data mask (HIGH = masked word, LOW = valid write). This eliminates need for separate RD/WR strobes and simplifies timing closure in high-speed automotive designs.
Does S80KS2564GACHA040 require external refresh circuitry?
No. The device contains fully autonomous on-die refresh logic that manages DRAM array refresh during idle cycles or configurable partial-array intervals. The host processor interacts with it as a static RAM - no refresh commands, timers, or scheduling are required, significantly reducing firmware complexity and qualification effort in automotive safety-critical systems.
How does the HYPERBUS™ Extended-IO interface reduce pin count compared to traditional parallel interfaces?
HYPERRAM™ uses a 16-bit multiplexed DQ bus for command, address, and data, combined with only 20–21 total signals (including CS#, CK/CK#, RWDS, RESET#). This replaces conventional 32+ pin parallel NOR/NAND interfaces, cutting PCB layer count, routing congestion, and EMI emissions - especially valuable in space-constrained automotive modules with strict EMC requirements.
What automotive qualification level does S80KS2564GACHA040 meet?
S80KS2564GACHA040 is qualified to AEC-Q100 Grade 2 (–40°C to +105°C), validated for use in under-hood and cabin-mounted electronic control units. It undergoes stress testing including HTOL, TC, and ESD per AEC-Q100 Rev G, and supports functional safety development per ISO 26262 ASIL-B requirements through documented failure modes and FIT rates in Infineon's reliability reports.
S80KS2564GACHA040 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERRAM™
- Package/Case:
- 49-VBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Memory Type:
- Volatile
- Memory Format:
- PSRAM
- Technology:
- PSRAM (Pseudo SRAM)
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- HyperBus
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 35 ns
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 49-FBGA (8x8)
S80KS2564GACHA040 FAQ
1.How can I place an order for S80KS2564GACHA040 through Aetrix?
Please submit a Request for Quotation (RFQ) for S80KS2564GACHA040 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S80KS2564GACHA040 reliable?
The price and inventory of S80KS2564GACHA040 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S80KS2564GACHA040 is usually 5 days.
3.What payment methods are accepted for S80KS2564GACHA040?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S80KS2564GACHA040 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S80KS2564GACHA040?
S80KS2564GACHA040 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S80KS2564GACHA040 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S80KS2564GACHA040?
For technical support, including S80KS2564GACHA040 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S80KS2564GACHA040 requirements.
6.How does Aetrix verify that S80KS2564GACHA040 is sourced from the original manufacturer or authorized distributors?
All S80KS2564GACHA040 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S80KS2564GACHA040 meets industry standards.
7.What is the process for return or replacement of S80KS2564GACHA040?
All S80KS2564GACHA040 units undergo pre-shipment inspection (PSI). If there is an issue with S80KS2564GACHA040, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S80KS2564GACHA040 part is unused and in its original packaging.
Return procedure for S80KS2564GACHA040:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S80KS2564GACHA040 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…

