Infineon Technologies S80KS2564GACHB040
- Part No.:
- S80KS2564GACHB040
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 49-VBGA
- Datasheet:
-
S80KS2564GACHB040.pdf
- Description:
- IC PSRAM 256MBIT HYPERBUS 49FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,347
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S80KS2564GACHB040 from Infineon is a 256 Mb pseudo-static RAM (PSRAM) implementing self-refresh DRAM architecture with HYPERBUS™ Extended-IO x16 interface, 1.8 V nominal supply, 200 MHz max clock rate, and AEC-Q100 Grade 2 automotive qualification (–40°C to +105°C). It delivers up to 800 MBps throughput via DDR transfers on DQ[15:0], uses bidirectional RWDS for read strobe/write mask, and supports configurable burst lengths (16–128 words) in linear or wrapped mode.
For engineers reviewing the S80KS2564GACHB040 datasheet, S80KS2564GACHB040 pinout, S80KS2564GACHB040 application, or S80KS2564GACHB040 equivalent, key selection criteria include HYPERBUS™ timing compliance, RWDS-driven latency handling, partial array refresh configuration, and FBGA-49 thermal-mechanical suitability for automotive ADAS and infotainment memory expansion.
Technical Context
This PSRAM integrates dynamic DRAM cells with on-die refresh control logic, eliminating host-managed refresh while maintaining static RAM-like interface behavior. Its HYPERBUS™ Extended-IO protocol uses center-aligned command/address and edge-aligned read data with RWDS, supporting both single and dual-clock (CK/CK#) configurations across 20–21 signal counts.
The device implements hybrid power modes including Hybrid Sleep and Deep Power Down, with configurable output drive strength and partial array refresh (1/8, 1/4, 1/2), enabling precise trade-offs between latency, bandwidth, and current draw (e.g., 1.55 μA standby, 15 μA deep power down).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mb (32 MB), organized as 16 M × 16-bit for direct x16 bus mapping |
| Interface Standard | HYPERRAM™ HYPERBUS™ Extended-IO x16, LV-CMOS compatible, DDR signaling |
| Max Clock Rate | 200 MHz - enables 800 MBps peak throughput with double-data-rate transfers |
| Access Latency | tACC ≤ 35 ns - defines minimum time from CK edge to valid DQ output during reads |
| Burst Config | Linear or wrapped bursts of 16/32/64/128 words - supports cache-line fill and streaming access patterns |
| Operating Temp | AEC-Q100 Grade 2: –40°C to +105°C - qualified for under-hood and display controller environments |
| Supply Voltage | VCC/VCCQ = 1.7–2.0 V (1.8 V typical) - matches automotive SoC I/O voltage domains |
Pinout & Package
Package: 49-ball FBGA (7 mm × 7 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select input | Active-low enable for command/address/data transactions; deassertion terminates burst |
| CK / CK# | Clock inputs | Differential clock pair (optional); single-ended CK supported for reduced signal count |
| RWDS[1:0] | Bidirectional strobe/mask | Indicates initial latency during CA phase; serves as read data strobe or write mask during data phase |
| DQ[15:0] | Data I/O bus | 16-bit DDR bidirectional data path; carries commands, addresses, and payload in time-multiplexed fashion |
| RESET# | Hardware reset input | Asynchronous active-low reset that clears internal state and initiates power-up initialization sequence |
Key Features
| Feature | Design Value |
|---|---|
| Self-refresh DRAM core | Eliminates host refresh overhead while retaining DRAM density/cost advantage; appears as SRAM to controller |
| Configurable burst wrapping | Enables cache-line-aligned reads (wrapped) or sequential DMA transfers (linear) without software intervention |
| Hybrid Sleep mode | Reduces power vs. standby while preserving data and allowing faster wake than Deep Power Down |
| Partial array refresh | Allows selective refresh of 1/8, 1/4, or 1/2 array segments - cuts refresh current by up to 87.5% during low-activity periods |
| RWDS-based latency signaling | Dynamic indication of required initial access latency per transaction - ensures timing compliance without fixed worst-case guardbands |
Applications
| ADAS Sensor Fusion Unit | Automotive Digital Cluster |
|---|---|
Use Scenario: Real-time buffering of multi-camera frame buffers and radar point clouds before fusion processing. IC Role / Device Role / Timing Role: High-bandwidth, low-latency external memory for SoC-side frame storage with deterministic access timing. Use Value: 800 MBps throughput sustains concurrent 4K@30fps video ingest and LIDAR preprocessing; RWDS latency signaling prevents pipeline stalls during burst transitions. | Use Scenario: Graphics frame buffer and UI asset storage for TFT-LCD instrument clusters with animated gauges and navigation overlays. IC Role / Device Role / Timing Role: PSRAM serving as unified graphics memory for GPU and display controller, replacing slower NOR+SRAM combinations. Use Value: Wrapped burst mode enables cache-line-aligned pixel fetches; AEC-Q100 Grade 2 rating ensures reliability at 105°C ambient near dashboard electronics. |
| Infotainment Head Unit | Telematics Control Unit (TCU) |
Use Scenario: Application code execution and media decode buffer in Android Automotive head units with limited onboard RAM. IC Role / Device Role / Timing Role: XIP-capable external memory mapped into CPU address space for fast instruction fetch and audio/video decode staging. Use Value: Linear burst support allows efficient 128-word streaming of compressed audio frames; 1.55 μA standby current extends battery backup runtime during ignition-off states. | Use Scenario: Secure boot firmware staging and OTA update packet buffering in cellular-connected TCUs operating in wide temperature ranges. IC Role / Device Role / Timing Role: Trusted memory region for cryptographic operation scratchpad and signed firmware image storage prior to authentication. Use Value: Deep Power Down mode (15 μA) maintains secure state during cellular sleep cycles; HYPERBUS™ interface resists EMI in noisy vehicle RF environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PSRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S27KL0641DPBHI020 | 64 Mb density, same HYPERBUS™ x16 interface, 166 MHz max clock, 48-ball FBGA | Limited to mid-tier infotainment with smaller code footprint; lacks Grade 2 temp rating | Select when memory bandwidth demand is ≤533 MBps and full Grade 2 qualification is not required |
| ISSI IS66WV12816EBLL-100B3LI | Asynchronous 128 Mb SRAM, parallel x16, 100 MHz, 44-pin TSOP II, no self-refresh | Requires external refresh management; higher static power (≈25 mA standby); no automotive qualification | Choose only for non-automotive industrial designs where deterministic latency > bandwidth and board space permits larger package |
Compared with S27KL0641DPBHI020 and IS66WV12816EBLL-100B3LI, the S80KS2564GACHB040 uniquely combines 256 Mb density, 200 MHz HYPERBUS™ performance, AEC-Q100 Grade 2 operation, and true self-refresh - making it the sole option for high-end automotive systems requiring scalable, low-power, drop-in memory expansion without host refresh overhead.
Availability
S80KS2564GACHB040 is available at Aetrix Electronics and suitable for ADAS sensor fusion units, automotive digital clusters, and telematics control units requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S80KS2564GACHB040 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and memory solutions, with global R&D and manufacturing infrastructure.
The HYPERRAM™ product line targets automotive and industrial systems needing high-density, low-pin-count external memory with SRAM-like ease-of-use and DRAM-like economics - specifically optimized for SoC memory expansion where board space and signal integrity are constrained.
FAQ
What is the function of RWDS[1:0] in read versus write operations?
RWDS[1:0] serves three distinct roles: during command/address transfer, it signals required initial latency; during reads, it acts as a source-synchronous read data strobe with edge-aligned DQ; during writes, it functions as a 16-bit write mask (HIGH = masked, LOW = written). This eliminates need for separate strobe and mask signals, reducing pin count while preserving timing precision.
Does S80KS2564GACHB040 require external refresh circuitry?
No. The device contains fully autonomous on-die refresh logic that manages all DRAM array refresh cycles without host intervention. The host sees only a static RAM interface - no refresh commands, timers, or scheduling are needed. Internal refresh occurs during idle periods or within configurable partial-array windows, ensuring data retention across all supported power modes.
How does the HYPERBUS™ Extended-IO interface differ from standard SPI or QSPI?
HYPERRAM™ uses a DDR x16 parallel interface with dedicated clock and RWDS, achieving 800 MBps - over 8× faster than quad-SPI's ~100 MBps limit. Unlike SPI, it supports true burst reads/writes with no command overhead per word, and includes hardware flow control via RWDS latency signaling - critical for real-time automotive applications where deterministic access timing is mandatory.
Can S80KS2564GACHB040 operate with only single-ended clock (CK) instead of differential (CK/CK#)?
Yes. The device supports both single-ended CK and optional differential CK/CK# modes. Using single-ended CK reduces signal count from 21 to 20 pins and simplifies PCB layout, while maintaining full 200 MHz operation and timing compliance. Differential mode is recommended only in high-noise environments where improved jitter immunity justifies the extra routing complexity and pin.
S80KS2564GACHB040 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERRAM™
- Package/Case:
- 49-VBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Memory Type:
- Volatile
- Memory Format:
- PSRAM
- Technology:
- PSRAM (Pseudo SRAM)
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- HyperBus
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 35 ns
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 49-FBGA (8x8)
S80KS2564GACHB040 FAQ
1.How can I place an order for S80KS2564GACHB040 through Aetrix?
Please submit a Request for Quotation (RFQ) for S80KS2564GACHB040 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S80KS2564GACHB040 reliable?
The price and inventory of S80KS2564GACHB040 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S80KS2564GACHB040 is usually 5 days.
3.What payment methods are accepted for S80KS2564GACHB040?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S80KS2564GACHB040 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S80KS2564GACHB040?
S80KS2564GACHB040 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S80KS2564GACHB040 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S80KS2564GACHB040?
For technical support, including S80KS2564GACHB040 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S80KS2564GACHB040 requirements.
6.How does Aetrix verify that S80KS2564GACHB040 is sourced from the original manufacturer or authorized distributors?
All S80KS2564GACHB040 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S80KS2564GACHB040 meets industry standards.
7.What is the process for return or replacement of S80KS2564GACHB040?
All S80KS2564GACHB040 units undergo pre-shipment inspection (PSI). If there is an issue with S80KS2564GACHB040, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S80KS2564GACHB040 part is unused and in its original packaging.
Return procedure for S80KS2564GACHB040:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S80KS2564GACHB040 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…

