Infineon Technologies S80KS2564GACHB043
- Part No.:
- S80KS2564GACHB043
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 49-VBGA
- Datasheet:
-
S80KS2564GACHB043.pdf
- Description:
- IC PSRAM 256MBIT HYPERBUS 49FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,342
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Product details
Overview
S80KS2564GACHB043 from Infineon Technologies is a 256 Mb pseudo-static RAM (PSRAM) based on self-refresh DRAM architecture, featuring HYPERBUS™ Extended-IO x16 interface, 1.8 V operation, and AEC-Q100 Grade 2 automotive qualification (–40°C to +105°C). It delivers up to 800 MBps throughput via DDR transfers at 200 MHz, supports configurable burst lengths (16–128 words), and integrates autonomous refresh control to emulate SRAM behavior for host systems.
For engineers reviewing the S80KS2564GACHB043 datasheet, S80KS2564GACHB043 pinout, S80KS2564GACHB043 application, or S80KS2564GACHB043 equivalent, this device serves as a high-bandwidth, low-pin-count memory solution for automotive ADAS, infotainment, and domain controller designs requiring deterministic latency, partial array refresh, and deep power-down modes.
Technical Context
The S80KS2564GACHB043 implements a HYPERBUS™ Extended-IO interface with 20–21 signal count (single/differential clock), using LV-CMOS I/Os and center-aligned command/address transfers. Its internal logic manages self-refresh without host intervention, though burst length must be constrained to accommodate internal refresh cycles between transactions.
RWDS[1:0] operates bidirectionally: as an initial latency indicator during CA phase, as a source-synchronous read strobe edge-aligned with data, and as a write mask signal (HIGH = masked, LOW = valid) during write bursts - enabling 16-bit word-aligned writes and non-aligned merge operations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mb (32 MB), organized as 16 M × 16-bit for direct x16 bus interfacing |
| Interface Standard | HYPERRAM™ HYPERBUS™ Extended-IO x16 DDR, 20/21-signal count |
| Max Clock Rate | 200 MHz - enables 800 MBps peak throughput (DDR, 16-bit bus) |
| Access Latency | tACC ≤ 35 ns - defines minimum time from CK edge to valid DQ output in read mode |
| Burst Config | Linear or wrapped bursts: 16/32/64/128 words; hybrid option (wrapped + linear) |
| Power Modes | Hybrid Sleep, Deep Power Down (15 μA), and Interface Standby (1.55 μA) |
| Operating Temp | AEC-Q100 Grade 2: –40°C to +105°C - qualified for under-hood automotive use |
Pinout & Package
Package: 49-ball FBGA (7 mm × 7 mm, 0.8 mm pitch), RoHS-compliant, with ball map per Infineon document 002-36092 Rev. *A Section 11.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Provides timing reference for DDR command/address/data capture; optional single-ended CK supported |
| CS# | Chip select | Active-low enable for all HYPERBUS™ transactions; deassertion terminates current burst |
| RWDS[1:0] | Bidirectional strobe/mask | Indicates initial latency, acts as read strobe (edge-aligned), and masks write words (HIGH = invalid) |
| DQ[15:0] | 16-bit bidirectional data bus | Carries command, address, and data in time-multiplexed DDR fashion; LV-CMOS compatible |
| RESET# | Hardware reset | Asynchronous active-low signal that clears internal state and forces re-initialization sequence |
| VCC / VCCQ | Power supplies | VCC = 1.8 V ±0.15 V (array); VCCQ = 1.8 V ±0.15 V (I/O buffers); separate pins for noise isolation |
Key Features
| Feature | Design Value |
|---|---|
| Self-refresh DRAM core | Eliminates external refresh controller; host sees SRAM-like interface with no refresh overhead |
| Configurable output drive strength | Allows optimization of signal integrity and EMI across varying PCB trace lengths and loading conditions |
| Partial array refresh | Supports 1/8, 1/4, or 1/2 array refresh - reduces power vs. full-array refresh during low-activity periods |
| HYPERBUS™ extended-IO protocol | Reduces pin count vs. parallel NOR/NAND while maintaining high bandwidth - ideal for space-constrained automotive modules |
| Deep Power Down mode | 15 μA standby current - extends battery life in always-on automotive subsystems (e.g., telematics wake-up logic) |
Applications
| ADAS Sensor Fusion Unit | Automotive Infotainment Head Unit |
|---|---|
Use Scenario: Real-time buffering of multi-camera video streams and radar point clouds before fusion processing. IC Role / Device Role / Timing Role: High-throughput PSRAM acting as frame buffer and scratchpad memory with deterministic access latency and burst coalescing. Use Value: 800 MBps bandwidth and 200 MHz DDR interface meet real-time streaming requirements without external refresh management overhead. | Use Scenario: Storing UI assets, decoded audio frames, and navigation map tiles in head unit SoC subsystems. IC Role / Device Role / Timing Role: Non-volatile-equivalent working memory supporting fast boot and seamless UI transitions. Use Value: AEC-Q100 Grade 2 rating ensures reliability at +105°C ambient; Deep Power Down mode preserves state during ignition-off periods. |
| Zone Controller Memory Expansion | Automotive Gateway Secure Boot Cache |
Use Scenario: Extending local memory capacity for zone-based ECUs handling mixed-criticality tasks (e.g., HVAC + lighting + diagnostics). IC Role / Device Role / Timing Role: Low-pin-count, high-density memory supplementing SoC internal RAM for task partitioning and isolation. Use Value: 49-ball FBGA footprint minimizes PCB area; Hybrid Sleep mode enables rapid wake/resume for time-sensitive control loops. | Use Scenario: Caching verified firmware images and cryptographic keys during secure boot sequence in automotive gateways. IC Role / Device Role / Timing Role: Fast-access, tamper-resilient memory holding immutable boot artifacts prior to execution. Use Value: Linear burst support enables contiguous key/image fetch; RWDS masking allows precise alignment of encrypted payload boundaries. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PSRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S27KL0641DPBHI020 | 64 Mb density, 166 MHz max clock, 1.8 V, same HYPERBUS™ x16 interface and FBGA-49 package | Limited to lower bandwidth (533 MBps) and smaller capacity; suitable for cost-sensitive entry-tier ADAS modules | Select when memory footprint and bandwidth requirements are reduced but automotive qualification and interface compatibility are retained. |
| Infineon S80KS1284GACHB043 | 128 Mb density, identical timing, package, voltage, and temperature specs; shares same die family and register map | Half capacity; used where BOM simplification across product variants is prioritized over memory headroom | Choose for design reuse and supply chain consolidation where 128 Mb suffices for target software stack and OS footprint. |
Compared with S27KL0641DPBHI020, the S80KS2564GACHB043 provides double density and +20% bandwidth - critical for multi-sensor fusion; versus S80KS1284GACHB043, it doubles capacity without changing layout or firmware initialization, easing future-proofing.
Availability
S80KS2564GACHB043 is available at Aetrix Electronics and suitable for automotive ADAS sensor fusion units, infotainment head units, and zone controller memory expansion requiring stable component supply, AEC-Q100 compliance, and long-term lifecycle support.
Supply support for S80KS2564GACHB043 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
The HYPERRAM™ product line targets automotive and industrial embedded systems needing high-speed, low-pin-count memory with SRAM-like simplicity and DRAM-level density - optimized for ADAS, infotainment, and domain controllers.
FAQ
Does S80KS2564GACHB043 require external refresh circuitry?
No. The device integrates autonomous self-refresh logic that maintains DRAM cell charge without host intervention. The host only issues standard HYPERBUS™ commands; refresh occurs transparently during idle intervals or via partial array refresh triggered by internal timers - eliminating refresh-related software overhead and timing constraints.
What is the function of RWDS[1:0] during write transactions?
RWDS[1:0] serves as a per-word write mask during write bursts: when HIGH, the corresponding 16-bit DQ[15:0] word is ignored and not written to memory; when LOW, the word is valid and stored. This enables byte-aligned writes across non-contiguous addresses and supports merging fragmented data into aligned memory locations without read-modify-write cycles.
Can S80KS2564GACHB043 operate with single-ended clock only?
Yes. The device supports both single-ended (CK only) and differential (CK/CK#) clock configurations. When using single-ended mode, CK# must be tied to VSS or VCC per Infineon's recommended termination. The interface automatically adapts timing parameters, and all AC specifications in the datasheet apply to both configurations.
Is the 49-ball FBGA package lead-free and RoHS compliant?
Yes. The S80KS2564GACHB043 uses a lead-free, RoHS-compliant 49-ball FBGA package (7 mm × 7 mm, 0.8 mm pitch) with NiPdAu surface finish. It meets JEDEC J-STD-020 moisture sensitivity level 3 and is qualified for reflow soldering per IPC/JEDEC J-STD-020D.1 standards.
S80KS2564GACHB043 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERRAM™
- Package/Case:
- 49-VBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Memory Type:
- Volatile
- Memory Format:
- PSRAM
- Technology:
- PSRAM (Pseudo SRAM)
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- HyperBus
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 35 ns
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 49-FBGA (8x8)
S80KS2564GACHB043 FAQ
1.How can I place an order for S80KS2564GACHB043 through Aetrix?
Please submit a Request for Quotation (RFQ) for S80KS2564GACHB043 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S80KS2564GACHB043 reliable?
The price and inventory of S80KS2564GACHB043 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S80KS2564GACHB043 is usually 5 days.
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S80KS2564GACHB043 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S80KS2564GACHB043 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S80KS2564GACHB043?
For technical support, including S80KS2564GACHB043 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S80KS2564GACHB043 requirements.
6.How does Aetrix verify that S80KS2564GACHB043 is sourced from the original manufacturer or authorized distributors?
All S80KS2564GACHB043 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S80KS2564GACHB043 meets industry standards.
7.What is the process for return or replacement of S80KS2564GACHB043?
All S80KS2564GACHB043 units undergo pre-shipment inspection (PSI). If there is an issue with S80KS2564GACHB043, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S80KS2564GACHB043 part is unused and in its original packaging.
Return procedure for S80KS2564GACHB043:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S80KS2564GACHB043 Tags

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STMicroelectronics
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