Infineon Technologies S80KS2564GACHI043
- Part No.:
- S80KS2564GACHI043
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 49-VBGA
- Datasheet:
-
S80KS2564GACHI043.pdf
- Description:
- IC PSRAM 256MBIT HYPERBUS 49FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,940
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Product details
Overview
S80KS2564GACHI043 from Infineon Technologies is a 256 Mb pseudo-static RAM (PSRAM) with self-refresh DRAM core, HYPERBUS™ Extended-IO x16 interface, 1.8 V supply, 200 MHz DDR clock, and 49-ball FBGA package. It serves as high-bandwidth, low-pin-count external memory for microcontrollers and SoCs in embedded systems requiring seamless SRAM-like access without host-managed refresh.
For engineers reviewing the S80KS2564GACHI043 datasheet, S80KS2564GACHI043 pinout, S80KS2564GACHI043 application, or S80KS2564GACHI043 equivalent, key selection criteria include HYPERBUS™ timing compliance, RWDS bidirectional strobe behavior, burst length configurability (16–128 words), partial array refresh support, and industrial temperature operation (–40°C to +85°C).
Technical Context
The device implements a 25 nm DRAM array with integrated refresh control logic, presenting a static RAM interface to the host via HYPERBUS™ Extended-IO. Its DDR architecture transfers two 16-bit words per clock cycle on DQ[15:0], achieving up to 800 MBps throughput at 200 MHz.
Command/address and data share the same 16-bit DQ bus; RWDS[1:0] serves dual roles-indicating initial latency during CA transfer and acting as source-synchronous read strobe or write mask during data phases. Clocking supports single-ended (CK) or optional differential (CK/CK#) modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mb (32 MB), organized as 2M × 16-bit for linear addressing |
| Interface Standard | HYPERRAM™ compliant HYPERBUS™ Extended-IO x16, LV-CMOS compatible |
| Max Clock Frequency | 200 MHz DDR - enables 400 MT/s effective rate and 800 MBps peak bandwidth |
| Burst Length | Configurable: 16/32/64/128 words (8/16/32/64 clocks) or hybrid wrapped+linear mode |
| Access Latency | tACC ≤ 35 ns at 1.8 V - determines minimum time from command to first valid read data |
| Power Modes | Hybrid Sleep (reduced current, partial refresh) and Deep Power Down (15 μA, full refresh suspend) |
| Operating Temp | Industrial grade: –40°C to +85°C - validated for extended thermal cycling in edge computing hardware |
Pinout & Package
49-ball FBGA (7 mm × 7 mm, 0.8 mm pitch), RoHS-compliant, with ball map defined per Infineon datasheet Rev. *C section 11.1. Package supports automated optical inspection and fine-pitch PCB routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for command/address/data transactions; deassertion terminates ongoing burst |
| CK / CK# | Clock Input (optional differential) | Source-synchronous timing reference; center-aligns CA and data transfers on rising/falling edges |
| RWDS[1:0] | Bidirectional Strobe/Mask | Indicates refresh latency pre-read; acts as read data strobe or write mask (HIGH = masked word) |
| DQ[15:0] | Bi-directional Data Bus | Shared 16-bit bus for command, address, and DDR data; requires controlled impedance routing (50 Ω) |
| RESET# | Hardware Reset Input | Asynchronous active-low signal forcing device into known power-on state and clearing internal registers |
| VCC / VCCQ | Power Supplies | Separate 1.8 V supplies: VCC for core array, VCCQ for I/O buffers - decoupling critical for signal integrity |
Key Features
| Feature | Design Value |
|---|---|
| Self-refresh DRAM Core | Eliminates host refresh overhead - appears as SRAM to firmware, reducing CPU intervention and driver complexity |
| HYPERBUS™ Extended-IO | 20-signal interface (vs. 40+ for parallel NOR/NAND) - saves PCB layers and routing area in space-constrained designs |
| Configurable Output Drive Strength | Adjustable slew rate and drive current per DQ pin - optimizes signal integrity across varying trace lengths and loads |
| Partial Array Refresh | Supports 1/8, 1/4, or 1/2 array refresh - reduces power during idle periods while maintaining data retention |
| Linear + Wrapped Burst Hybrid Mode | Enables efficient sequential access followed by wrap-around - ideal for circular buffer implementations in real-time audio/video pipelines |
Applications
| Automotive ADAS Display Buffer | Industrial HMI Graphics Cache |
|---|---|
Use Scenario: Frame buffer storage for 1080p display controller in automotive instrument cluster with real-time overlay rendering. IC Role / Device Role / Timing Role: External PSRAM providing low-latency, high-throughput pixel data access synchronized to display engine clock domain. Use Value: 800 MBps bandwidth sustains 60 Hz refresh of 1920×1080 RGB565 frames (4.9 MB/frame) with margin for alpha blending and UI layer compositing. | Use Scenario: Graphics cache for ARM Cortex-A7-based HMI running Qt Quick applications with dynamic widget updates. IC Role / Device Role / Timing Role: Memory-mapped external RAM accessed via AXI bus bridge, delivering deterministic read latency under 35 ns. Use Value: Configurable burst lengths reduce bus arbitration overhead; Hybrid Sleep mode cuts standby power to <20 μA during screen-off intervals. |
| Edge AI Inference Accelerator Buffer | Smart Gateway Protocol Stack Memory |
Use Scenario: Intermediate tensor buffer for microNPU executing quantized CNN inference on sensor fusion data streams. IC Role / Device Role / Timing Role: High-speed scratchpad memory interfaced directly to NPU DMA engine using HYPERBUS™ burst reads/writes. Use Value: 200 MHz DDR timing and RWDS-aligned strobing ensure zero-wait-state transfers for 32-word convolution kernel weight fetches. | Use Scenario: Shared memory for multi-protocol gateway (Modbus TCP, CAN FD, MQTT) handling concurrent packet buffering and TLS session context storage. IC Role / Device Role / Timing Role: Non-volatile-aware external RAM supporting simultaneous Ethernet and serial protocol stacks with independent memory partitions. Use Value: Deep Power Down mode (15 μA) enables rapid wake-from-sleep response (<100 μs) for event-driven packet processing without data loss. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PSRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S27KL0641DPBHI020 | 64 Mb density, same HYPERBUS™ interface, 166 MHz max clock, 48-ball FBGA | Lower bandwidth (664 MBps) and capacity - suitable only for lightweight GUI or boot code caching | Select when BOM cost sensitivity outweighs bandwidth needs and system memory footprint is constrained |
| ISSI IS66WV12816EBLL-150B3LI | 128 Mb asynchronous SRAM, parallel x16 interface, 15 ns access, 48-pin TSOP | No self-refresh; requires continuous power and external address/control bus - higher pin count and static power draw | Choose only if legacy design lacks HYPERBUS™ PHY or requires guaranteed zero-latency random access without burst constraints |
Compared with S27KL0641DPBHI020 and IS66WV12816EBLL-150B3LI, the S80KS2564GACHI043 delivers 4× density and 20% higher throughput within identical board area, while eliminating refresh management and reducing signal count by 50% versus parallel SRAM.
Availability
S80KS2564GACHI043 is available at Aetrix Electronics and suitable for automotive ADAS displays, industrial HMIs, edge AI accelerators, and smart gateways requiring stable component supply across extended product lifecycles.
Supply support for S80KS2564GACHI043 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive ICs, and memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q100.
The HYPERRAM™ product line targets high-performance embedded systems needing SRAM-like simplicity with DRAM density and bandwidth - optimized for MCU/SoC offload in resource-constrained edge devices.
FAQ
What is the purpose of the RWDS[1:0] signal in read vs. write operations?
RWDS[1:0] serves three distinct functions: during command/address transfer, it outputs initial latency count to indicate pending refresh; during reads, it acts as a source-synchronous read data strobe edge-aligned with DQ; during writes, it functions as a per-word mask (HIGH = masked, LOW = written). This dual-role design eliminates need for separate strobe and mask lines.
Does S80KS2564GACHI043 require external refresh circuitry or host software intervention?
No. The device integrates autonomous refresh control logic that manages DRAM array refresh during idle cycles or configurable partial-array intervals. Host sees only a static RAM interface - no refresh commands, timers, or scheduling are required, simplifying firmware and reducing CPU load.
How does burst length configuration affect timing and power consumption?
Longer bursts (e.g., 128-word) improve sustained bandwidth but increase transaction duration, delaying internal refresh opportunities and raising average current (22 mA vs. 20 mA for linear burst). Shorter bursts reduce latency and allow more frequent refresh, lowering power in burst-limited applications like real-time control loops.
Can S80KS2564GACHI043 operate with a single-ended clock only, or is differential clock mandatory?
A single-ended clock (CK only) is fully supported and sufficient for most designs. Differential clock (CK/CK#) is optional and recommended only for high-noise environments or when board-level skew exceeds 50 ps - it improves timing margin but adds routing complexity and one extra ball.
S80KS2564GACHI043 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERRAM™
- Package/Case:
- 49-VBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- PSRAM
- Technology:
- PSRAM (Pseudo SRAM)
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- HyperBus
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 35 ns
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 49-FBGA (8x8)
S80KS2564GACHI043 FAQ
1.How can I place an order for S80KS2564GACHI043 through Aetrix?
Please submit a Request for Quotation (RFQ) for S80KS2564GACHI043 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S80KS2564GACHI043 reliable?
The price and inventory of S80KS2564GACHI043 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S80KS2564GACHI043 is usually 5 days.
3.What payment methods are accepted for S80KS2564GACHI043?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S80KS2564GACHI043 transactions.
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4.How is shipping managed for S80KS2564GACHI043?
S80KS2564GACHI043 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S80KS2564GACHI043 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S80KS2564GACHI043?
For technical support, including S80KS2564GACHI043 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S80KS2564GACHI043 requirements.
6.How does Aetrix verify that S80KS2564GACHI043 is sourced from the original manufacturer or authorized distributors?
All S80KS2564GACHI043 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S80KS2564GACHI043 meets industry standards.
7.What is the process for return or replacement of S80KS2564GACHI043?
All S80KS2564GACHI043 units undergo pre-shipment inspection (PSI). If there is an issue with S80KS2564GACHI043, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S80KS2564GACHI043 part is unused and in its original packaging.
Return procedure for S80KS2564GACHI043:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S80KS2564GACHI043 Tags

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STMicroelectronics
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