Infineon Technologies S80KS5122GABHA020
- Part No.:
- S80KS5122GABHA020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S80KS5122GABHA020.pdf
- Description:
- IC PSRAM 512MBIT HYPERBUS 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:626
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S80KS5122GABHA020 from Infineon is a 512 Mb self-refresh DRAM (Pseudo SRAM) with HYPERBUS™ interface, operating at 1.8 V, supporting 200 MHz DDR clock, 400 MBps data throughput, and 24-ball FBGA package. It serves as high-bandwidth, low-pin-count external memory for microcontrollers and SoCs in automotive instrument clusters and industrial HMIs where refresh-free operation simplifies host firmware.
For engineers reviewing the S80KS5122GABHA020 datasheet, S80KS5122GABHA020 pinout, S80KS5122GABHA020 application, or S80KS5122GABHA020 equivalent, key selection criteria include HYPERBUS™ timing compliance, RWDS-driven read/write strobe behavior, burst length configurability (16–128 bytes), partial array refresh support, and AEC-Q100 Grade 2 qualification for +105 °C operation.
Technical Context
The device implements a dual-die 256 Mb × 2 architecture with on-die self-refresh control logic that eliminates host-managed refresh cycles. Its HYPERBUS™ interface uses single-ended or optional differential CK/CK# and bidirectional RWDS to coordinate DDR-aligned 8-bit DQ transfers with center-aligned command/address and edge-aligned read data.
It supports linear and wrapped burst modes (16/32/64/128-byte), hybrid burst (one wrapped + linear), configurable drive strength, and four power states: interface standby, active clock stop, hybrid sleep, and deep power down (30 µA at 105 °C). Refresh is managed autonomously across partial (1/8, 1/4, 1/2) or full array segments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (2 × 256 Mb dies), enabling compact external memory expansion without doubling chip count |
| Clock Rate | 200 MHz DDR - delivers 400 MBps throughput using only 11–12 signals, reducing PCB routing complexity |
| Interface Voltage | 1.8 V VCC/VCCQ - compatible with modern low-voltage MCUs and SoCs, minimizing level-shifting requirements |
| Burst Length | Configurable 16/32/64/128 bytes - matches typical cache line or DMA buffer sizes for efficient data streaming |
| Operating Temp | AEC-Q100 Grade 2 (–40 °C to +105 °C) - qualified for under-hood automotive and high-ambient industrial use |
| Power Modes | Deep power down (30 µA @ 105 °C) and hybrid sleep - extends battery life in always-on embedded systems |
| Package | 24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch) - provides high I/O density in minimal board area |
Pinout & Package
24-ball FBGA package with 5 × 5 array footprint, 0.8 mm ball pitch, and standard JEDEC MO-279AC mechanical outline. Pin functions are defined per Infineon datasheet Rev. *C (pp. 9–10, 48–49).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select input | Active-low enable for all HYPERBUS™ transactions; deassertion terminates ongoing access |
| CK / CK# | Clock inputs | Single-ended (CK only) or differential (CK/CK#) source-synchronous timing reference for DDR DQ transfers |
| RWDS | Bidirectional strobe | Indicates initial latency during CA phase; acts as read data strobe (edge-aligned) or write mask (HIGH = masked) |
| DQ[7:0] | Data I/O bus | 8-bit bidirectional DDR data path - transfers two bytes per clock cycle (16-bit effective width) |
| RESET# | Hardware reset input | Asynchronous active-low signal forcing device into known state and clearing internal configuration registers |
Key Features
| Feature | Design Value |
|---|---|
| Self-refresh DRAM architecture | Eliminates host refresh overhead - appears as PSRAM to MCU, simplifying driver development and reducing CPU load |
| HYPERBUS™ interface | 11–12 signal count with DDR DQ - achieves SRAM-like performance with ~50% fewer pins than parallel NOR/NAND interfaces |
| Configurable burst mode | Linear or wrapped bursts up to 128 bytes - optimizes bandwidth utilization for sequential vs. circular buffer access patterns |
| Partial array refresh | Supports 1/8, 1/4, or 1/2 array refresh - reduces average current during idle periods compared to full-array refresh |
| AEC-Q100 Grade 2 | Qualified for –40 °C to +105 °C operation - meets thermal requirements for automotive body control and infotainment modules |
Applications
| Automotive Instrument Cluster | Industrial HMI Display Buffer |
|---|---|
Use Scenario: Real-time rendering of gauges, navigation overlays, and warning icons in digital dashboards. IC Role / Device Role / Timing Role: External frame buffer memory interfaced to MCU via HYPERBUS™, providing low-latency pixel data access with deterministic tACC ≤ 35 ns. Use Value: Enables 60 Hz UI updates using 128-byte wrapped bursts, while self-refresh maintains display content during MCU sleep modes. | Use Scenario: Storing dynamic UI assets (icons, fonts, bitmaps) and runtime variables in factory-floor HMIs. IC Role / Device Role / Timing Role: High-throughput PSRAM replacing parallel NOR flash + SRAM combo, accessed via MCU's HYPERBUS™ controller. Use Value: Reduces BOM count and PCB area by consolidating code storage and working memory into one 24-ball FBGA device. |
| Edge AI Inference Cache | Medical Imaging Preview Buffer |
Use Scenario: Caching intermediate neural network layer outputs during real-time inference on resource-constrained edge SoCs. IC Role / Device Role / Timing Role: Low-latency external memory mapped into SoC's AXI bus via HYPERBUS™ bridge, supporting burst-aligned tensor tile loads. Use Value: Delivers 400 MBps bandwidth with <35 ns access time - sustains compute-bound inference pipelines without stalling accelerator cores. | Use Scenario: Temporary storage of DICOM preview frames during ultrasound or endoscopy image acquisition. IC Role / Device Role / Timing Role: High-reliability external memory holding uncompressed 16-bit grayscale frames before compression or transmission. Use Value: AEC-Q100 Grade 2 qualification ensures stable operation in medical carts exposed to variable ambient temperatures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed PSRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S27KL0642DPBHB020 | 64 Mb density, same 24-ball FBGA, 166 MHz max clock, no RWDS-based masking | Limited to simpler UI buffering; insufficient capacity for multi-layer AI cache or full HD preview buffers | Select when cost-sensitive designs require smaller memory footprint and lower bandwidth |
| Infineon S80KS2562GABHA020 | 256 Mb density, identical pinout/timing/power, same AEC-Q100 Grade 2 rating | Half capacity suits entry-level instrument clusters or legacy HMI platforms with tighter memory budgets | Choose for drop-in migration path where existing layout supports 512 Mb but firmware only uses 256 Mb initially |
Compared with S27KL0642DPBHB020 and S80KS2562GABHA020, the S80KS5122GABHA020 uniquely balances 512 Mb capacity, 400 MBps throughput, and automotive-grade reliability in a 24-ball footprint-enabling next-generation displays and edge AI without increasing board area or signal count.
Availability
S80KS5122GABHA020 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMIs, edge AI inference accelerators, and medical imaging preview systems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S80KS5122GABHA020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
The HYPERRAM™ product line targets high-performance, low-pin-count external memory for MCU- and SoC-based systems where traditional parallel interfaces are too bulky or power-hungry.
FAQ
Does S80KS5122GABHA020 require external refresh control from the host MCU?
No. The device integrates autonomous self-refresh logic that manages DRAM refresh cycles internally without host intervention. The host sees it as a pseudo-static RAM (PSRAM), eliminating the need for refresh timers, dedicated refresh commands, or complex driver software - simplifying integration and reducing CPU overhead.
What is the function of the RWDS signal during write operations?
During writes, RWDS operates as a byte-level write mask: when HIGH, the corresponding DQ[7:0] byte is masked and not written to memory; when LOW, the byte is valid and stored. This enables precise byte-aligned writes and merging of non-word-aligned data within a single burst - critical for efficient register-mapped peripheral updates or fragmented buffer writes.
Can S80KS5122GABHA020 operate with single-ended clock only?
Yes. The device supports both single-ended (CK only) and optional differential (CK/CK#) clocking. Single-ended mode uses 11 bus signals (CS#, CK, RWDS, DQ[7:0], RESET#); differential mode adds CK# for improved noise immunity, using 12 signals. Configuration is fixed by internal strapping and cannot be changed dynamically.
Is the 24-ball FBGA package lead-free and RoHS compliant?
Yes. The S80KS5122GABHA020 uses a lead-free, RoHS-compliant 24-ball FBGA package with matte tin surface finish, meeting JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) and qualified for reflow soldering per IPC/JEDEC J-STD-020D.1 standards.
S80KS5122GABHA020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERRAM™
- Package/Case:
- 24-VBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- PSRAM
- Technology:
- PSRAM (Pseudo SRAM)
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- HyperBus
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 35 ns
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S80KS5122GABHA020 FAQ
1.How can I place an order for S80KS5122GABHA020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S80KS5122GABHA020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S80KS5122GABHA020 reliable?
The price and inventory of S80KS5122GABHA020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S80KS5122GABHA020 is usually 5 days.
3.What payment methods are accepted for S80KS5122GABHA020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S80KS5122GABHA020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S80KS5122GABHA020?
S80KS5122GABHA020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S80KS5122GABHA020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S80KS5122GABHA020?
For technical support, including S80KS5122GABHA020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S80KS5122GABHA020 requirements.
6.How does Aetrix verify that S80KS5122GABHA020 is sourced from the original manufacturer or authorized distributors?
All S80KS5122GABHA020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S80KS5122GABHA020 meets industry standards.
7.What is the process for return or replacement of S80KS5122GABHA020?
All S80KS5122GABHA020 units undergo pre-shipment inspection (PSI). If there is an issue with S80KS5122GABHA020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S80KS5122GABHA020 part is unused and in its original packaging.
Return procedure for S80KS5122GABHA020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S80KS5122GABHA020 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

