Infineon Technologies S80KS5122GABHA023
- Part No.:
- S80KS5122GABHA023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S80KS5122GABHA023.pdf
- Description:
- IC PSRAM 512MBIT HYPERBUS 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,598
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Product details
Overview
S80KS5122GABHA023 from Infineon is a 512 Mb self-refresh DRAM (Pseudo SRAM) with HYPERBUS™ interface, operating at 1.8 V, supporting up to 200 MHz DDR clock, 400 MBps data throughput, and 24-ball FBGA package. It serves as high-bandwidth, low-pin-count external memory for microcontrollers and SoCs in automotive instrument clusters and industrial HMIs.
For engineers reviewing the S80KS5122GABHA023 datasheet, S80KS5122GABHA023 pinout, S80KS5122GABHA023 application, or S80KS5122GABHA023 equivalent, key selection factors include HYPERBUS™ timing compliance, RWDS-synchronized read/write strobe behavior, partial array refresh configuration, and AEC-Q100 Grade 2 (–40 °C to +105 °C) qualification for automotive use.
Technical Context
The device implements a dual-die 256 Mb × 2 architecture with on-die self-refresh control logic, eliminating host-managed refresh cycles. It uses LV-CMOS I/O with center-aligned command/address and edge-aligned read data via RWDS, requiring strict initial access latency handling per transaction.
HYPERBUS™ operates with 11–12 signal lines (including optional CK#), 8-bit DQ bus, and bidirectional RWDS that functions as both refresh latency indicator and source-synchronous read strobe/write mask - enabling deterministic timing without external clock forwarding or complex PHY layer support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (2 × 256 Mb dies), enabling compact external memory expansion without multi-chip stacking. |
| Clock Rate | Up to 200 MHz DDR, delivering 400 MBps peak bandwidth on an 8-bit bus - comparable to QSPI x4 but with simpler timing. |
| Interface Voltage | 1.8 V VCC/VCCQ, compatible with modern low-voltage MCUs and reducing I/O power vs. 3.3 V parallel NOR/PSRAM. |
| Burst Config | Configurable wrapped bursts (16–128 bytes) and hybrid burst mode, allowing alignment with cache line sizes and DMA transfer granularity. |
| Refresh Control | On-die self-refresh with selectable partial array (1/8, 1/4, 1/2) or full refresh - reduces power during idle while maintaining data retention. |
| Operating Temp | AEC-Q100 Grade 2 (–40 °C to +105 °C), qualified for under-hood automotive applications and extended-temperature industrial controllers. |
| Package | 24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch), supporting high-density PCB layouts with minimal board area and thermal resistance. |
Pinout & Package
24-ball FBGA package with 5 × 5 array footprint, 0.8 mm ball pitch, and standard JEDEC MO-270AC mechanical outline. Pin assignments conform to HYPERBUS™ v2.0 specification for 8-bit DQ, single/differential clock, CS#, RESET#, and bidirectional RWDS.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Clock input (single-ended or differential) | Edge-triggered sampling reference for CA and DQ; differential option improves noise immunity in noisy automotive environments. |
| CS# | Chip select | Active-low enable for all transactions; deassertion terminates ongoing burst and initiates internal refresh if needed. |
| RWDS | Bidirectional read/write data strobe | Indicates refresh latency at start of transaction; acts as read data strobe (edge-aligned) or write byte mask (HIGH = masked). |
| DQ[7:0] | 8-bit bidirectional data bus | DDR transfers two bytes per clock cycle; carries command/address (CA) and data - eliminates separate address bus. |
| RESET# | Hardware reset | Asynchronous active-low signal that forces device into known state and clears internal registers without power cycle. |
Key Features
| Feature | Design Value |
|---|---|
| Self-refresh DRAM architecture | Eliminates host refresh overhead and simplifies firmware - appears as PSRAM to MCU with no refresh scheduling required. |
| HYPERBUS™ low-pin-count interface | 11–12 signals replace 30+ pin parallel interfaces, reducing routing complexity and PCB layer count in space-constrained designs. |
| Configurable output drive strength | Allows optimization of signal integrity and EMI across varying trace lengths and loading conditions without external termination. |
| Hybrid sleep & deep power down modes | Reduces standby current to 3.1 mA (105 °C) and deep power down to 30 µA - critical for always-on automotive modules. |
| Partial array refresh | Enables selective refresh of only active memory regions, cutting dynamic power by up to 75% versus full-array refresh during partial usage. |
Applications
| Automotive Instrument Cluster | Industrial HMI Controller |
|---|---|
Use Scenario: Real-time rendering of vector graphics and animated gauges in digital dashboards with <100 ms boot-to-display. IC Role / Device Role / Timing Role: External frame buffer and asset storage, interfaced directly to ARM Cortex-M7/M8 SoC via HYPERBUS™. Use Value: 400 MBps bandwidth supports 1080p@60fps UI updates; AEC-Q100 Grade 2 ensures reliability at +105 °C ambient. | Use Scenario: Local GUI processing in factory-floor HMIs with offline operation and firmware update caching. IC Role / Device Role / Timing Role: Non-volatile-capable working memory for Qt-based UI engine, replacing slower SPI flash + RAM combo. Use Value: Linear burst mode enables cache-line-aligned DMA transfers; hybrid sleep mode extends uptime during brown-out events. |
| ADAS Domain Controller Boot Memory | Medical Imaging Edge Node |
Use Scenario: Storing boot firmware and calibration tables for radar/Ethernet domain controllers requiring fast cold-boot recovery. IC Role / Device Role / Timing Role: XIP-capable external code memory mapped via MCU's external bus interface (EBI), accessed with deterministic tACC ≤35 ns. Use Value: RWDS-synchronized reads eliminate setup/hold uncertainty; 25-nm process ensures stable operation over 15-year automotive lifecycle. | Use Scenario: Buffering real-time ultrasound echo data before compression and wireless transmission in portable diagnostic devices. IC Role / Device Role / Timing Role: High-throughput streaming buffer between ADC interface and ARM Cortex-A53 application processor. Use Value: Wrapped 128-byte bursts match typical DICOM packet boundaries; deep power down (<30 µA) preserves battery life during idle periods. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed, low-pin-count external memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S27KL0641DPBHI020 | 64 Mb Quad SPI NOR flash with execute-in-place (XIP); no DRAM refresh, lower bandwidth (80 MBps), no RWDS strobe. | Suitable for code storage only; lacks runtime data buffering capability and deterministic latency for UI rendering. | Select when firmware storage dominates; avoid for frame buffer or streaming buffer roles. |
| Infineon S80KS2562GABHA020 | 256 Mb variant, same HYPERBUS™ interface, package, and timing; half density, lower power consumption (32 mA burst vs. 44 mA). | Valid drop-in replacement where memory footprint and bandwidth requirements are reduced by 50%. | Choose for cost-sensitive or thermally constrained designs where 256 Mb suffices. |
Compared with S27KL0641DPBHI020, S80KS5122GABHA023 delivers 5× higher bandwidth and true random-access data buffering; versus S80KS2562GABHA020, it doubles capacity and maintains identical timing and thermal behavior - making it optimal for next-gen automotive displays and industrial edge nodes demanding >300 MBps sustained throughput.
Availability
S80KS5122GABHA023 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMIs, ADAS domain controllers, and medical edge imaging systems requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S80KS5122GABHA023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q200.
This part belongs to the HYPERRAM™ product line, designed specifically to replace parallel PSRAM and NOR flash in bandwidth-constrained, pin-limited embedded systems - prioritizing simplicity, deterministic timing, and automotive-grade reliability.
FAQ
Does S80KS5122GABHA023 require external refresh circuitry or host-controlled refresh commands?
No. The device contains on-die self-refresh logic that automatically manages DRAM array refresh during idle periods. The host only needs to observe initial access latency signaled via RWDS and avoid exceeding maximum burst duration - no refresh registers, timers, or periodic commands are required.
What is the function of the RWDS signal during write transactions?
During writes, RWDS acts as a per-byte write mask: when HIGH, the corresponding DQ[7:0] byte is ignored and not written to memory; when LOW, the byte is valid and stored. This enables precise byte-level merging of non-aligned writes within a single burst, supporting efficient DMA and cache-line updates.
Can S80KS5122GABHA023 operate with single-ended clock only, or is differential clock mandatory?
Single-ended clock (CK only) is fully supported and commonly used. Differential clock (CK/CK#) is optional and improves noise immunity in electrically noisy environments like automotive powertrain domains - no functional difference in timing or protocol behavior between the two modes.
Is the 24-ball FBGA package lead-free and RoHS compliant?
Yes. S80KS5122GABHA023 uses a lead-free, halogen-free, RoHS-compliant 24-ball FBGA package (JEDEC MO-270AC), qualified for reflow soldering per IPC/JEDEC J-STD-020D.1, with MSL Level 3 rating and 260 °C peak reflow tolerance.
S80KS5122GABHA023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERRAM™
- Package/Case:
- 24-VBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- PSRAM
- Technology:
- PSRAM (Pseudo SRAM)
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- HyperBus
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 35 ns
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S80KS5122GABHA023 FAQ
1.How can I place an order for S80KS5122GABHA023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S80KS5122GABHA023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S80KS5122GABHA023 reliable?
The price and inventory of S80KS5122GABHA023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S80KS5122GABHA023 is usually 5 days.
3.What payment methods are accepted for S80KS5122GABHA023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S80KS5122GABHA023 transactions.
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4.How is shipping managed for S80KS5122GABHA023?
S80KS5122GABHA023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S80KS5122GABHA023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S80KS5122GABHA023?
For technical support, including S80KS5122GABHA023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S80KS5122GABHA023 requirements.
6.How does Aetrix verify that S80KS5122GABHA023 is sourced from the original manufacturer or authorized distributors?
All S80KS5122GABHA023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S80KS5122GABHA023 meets industry standards.
7.What is the process for return or replacement of S80KS5122GABHA023?
All S80KS5122GABHA023 units undergo pre-shipment inspection (PSI). If there is an issue with S80KS5122GABHA023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S80KS5122GABHA023 part is unused and in its original packaging.
Return procedure for S80KS5122GABHA023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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