Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors S908GZ32G3MFAE

Part No.:
S908GZ32G3MFAE
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
48-LQFP
Datasheet:
AetrixS908GZ32G3MFAE.pdf
Description:
S908GZ32G3MFAE - AUTO 8 BIT MCU
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,750

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

S908GZ32G3MFAE from NXP Semiconductors is an automotive-grade 8-bit MCU with 32 KB on-chip flash memory, 2 KB RAM, and LQFP-48 package; operates at up to 8 MHz internal bus frequency and supports CAN 2.0A/B protocol for vehicle body control modules.

For engineers reviewing the S908GZ32G3MFAE datasheet, S908GZ32G3MFAE pinout, S908GZ32G3MFAE application, or S908GZ32G3MFAE equivalent, key selection criteria include automotive qualification (AEC-Q100 Grade 2), RoHS-compliant plastic LQFP-48 packaging, and integrated CAN controller with 15 message buffers.

Technical Context

This MCU belongs to the HC08 family and uses a von Neumann architecture with single-cycle instruction execution for deterministic real-time response. It integrates a 16-bit timer module (TIM), serial communication interface (SCI), and serial peripheral interface (SPI) alongside its CAN 2.0B controller.

The device supports in-circuit debugging via JTAG/Background Debug Mode (BDM) using the JDBG interface. Flash memory is programmable in-system with security byte protection and supports up to 10,000 erase/write cycles with data retention exceeding 10 years at 85°C.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureHC08 8-bit CISC core with 8 MHz max bus frequency; enables deterministic timing for automotive sensor polling and actuator control loops.
Memory32 KB on-chip flash + 2 KB RAM; sufficient for AUTOSAR-compliant basic software modules and diagnostic routines.
CAN InterfaceCAN 2.0B compliant with 15 message buffers; supports multi-node vehicle network communication without external transceiver logic.
PackageLQFP-48 (7×7×1.4 mm, 0.5 mm pitch); compatible with standard SMT reflow profiles and IPC Class 3 assembly requirements.
QualificationAEC-Q100 qualified for Automotive Grade 2 (−40°C to +105°C); validated for under-hood and cabin control applications.
EnvironmentalRoHS-compliant, halogen-free, MSL 3 (168-hour floor life); meets automotive supply chain material declaration requirements.

Pinout & Package

LQFP-48 plastic surface-mount package with 0.5 mm lead pitch, 7 mm × 7 mm body, and 1.4 mm maximum height; JEDEC designation L-PQFP-G48.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSPower supply and groundDual 5 V supply pins per side ensure low-impedance power delivery and noise decoupling for analog peripherals.
RESETActive-low reset inputAsynchronous reset with internal pull-up; compatible with external watchdog or power-on reset ICs.
TXD0/RXD0SCI0 serial I/OFull-duplex UART interface for bootloader communication or diagnostic logging via ISO 9141/K-line.
CANH/CANLCAN differential bus terminalsDirect connection to external CAN transceiver (e.g., TJA1042); supports 125 kbps–1 Mbps bit rates.
PTA0–PTA7Port A general-purpose I/O8-bit bidirectional port with configurable pull-ups; used for switch inputs, LED drivers, or PWM-controlled actuators.

Key Features

FeatureDesign Value
On-chip BDM interfaceEnables real-time debugging and flash programming without dedicated debug header; reduces development board footprint.
Flash security bytePrevents unauthorized read-out of firmware; required for OEM anti-tampering compliance in ECU designs.
16-bit TIM moduleSupports input capture, output compare, and PWM generation with 1 µs resolution; suitable for motor speed control.
SCI + SPI + CANThree independent serial interfaces allow concurrent diagnostics (SCI), sensor interfacing (SPI), and vehicle networking (CAN).

Applications

Body Control ModuleDoor Module

Use Scenario: Centralized management of lighting, window lift, mirror adjustment, and door lock functions in passenger vehicles.

IC Role / Device Role / Timing Role: Main controller executing LIN/CAN gateway logic and PWM-driven actuator sequencing.

Use Value: Integrated CAN 2.0B and 16-bit TIM enable synchronized multi-actuator control with <100 µs jitter.

Use Scenario: Local intelligence for power windows, central locking, and interior lighting in each vehicle door.

IC Role / Device Role / Timing Role: Standalone node managing local sensor inputs and driving brushed DC motors via H-bridge gate signals.

Use Value: 32 KB flash accommodates full diagnostic stack (UDS services) plus application firmware within single die.

Climate Control PanelSeat Control Unit

Use Scenario: User interface and HVAC actuator coordination in dashboard-mounted climate systems.

IC Role / Device Role / Timing Role: Input scanning (keypad/resistive touch), display driver interface, and fan speed regulation via SCI-linked fan controller.

Use Value: Dual VDD/VSS pairs reduce EMI coupling between analog sensor front-end and digital display timing circuits.

Use Scenario: Motorized seat position memory, heating element control, and occupancy detection in premium automotive seating.

IC Role / Device Role / Timing Role: Safety-critical controller managing dual H-bridge drivers and thermistor-based overtemperature shutdown.

Use Value: AEC-Q100 Grade 2 qualification ensures reliable operation at 105°C ambient during prolonged summer parking conditions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit automotive MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S08DZ128MLC128 KB flash, same HC08 core, identical LQFP-48 package; higher memory density but no CAN controller.Used where CAN is replaced by LIN or SCI-based networking; requires external CAN transceiver if CAN needed.Select when firmware complexity exceeds 32 KB but CAN is not required.
SPC560B50L532-bit Power Architecture core, 512 KB flash, QFP-100 package; includes dual CAN, ADC, and motor control timers.Targeted at next-generation ECUs requiring ASIL-B compliance and complex control algorithms.Select when migrating from 8-bit to 32-bit for future scalability and functional safety expansion.

Compared with MC9S08DZ128MLC and SPC560B50L5, the S908GZ32G3MFAE offers optimal balance of CAN integration, AEC-Q100 qualification, and compact LQFP-48 footprint for cost-sensitive body electronics-without over-provisioning memory or pin count.

Availability

S908GZ32G3MFAE is available at Aetrix Electronics and suitable for body control modules, door modules, climate control panels, and seat control units requiring stable component supply across automotive production lifecycles.

Supply support for S908GZ32G3MFAE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The S908GZ32G3MFAE belongs to the HC08 GZ-series automotive microcontrollers, designed specifically for cost-optimized, CAN-enabled body electronics with extended temperature operation and long-term supply stability.

FAQ

What is the operating temperature range for the S908GZ32G3MFAE?

The S908GZ32G3MFAE is AEC-Q100 qualified for Grade 2 operation, supporting continuous operation from −40°C to +105°C. This range covers under-hood and cabin environments in passenger vehicles. The device undergoes thermal cycling validation per automotive qualification standards, and its LQFP-48 package maintains solder joint integrity across this full span. S908GZ32G3MFAE's flash memory retains data for 10+ years at 85°C ambient.

Does the S908GZ32G3MFAE include an integrated CAN transceiver?

No, the S908GZ32G3MFAE integrates only the CAN protocol controller (CAN 2.0B compliant), not the physical layer transceiver. External transceivers such as the TJA1042 or MCP2551 must be used on the CANH/CANL pins. The MCU provides direct register access to 15 message buffers and supports bit rates from 125 kbps to 1 Mbps. S908GZ32G3MFAE's CAN module is fully compatible with ISO 11898-1 physical layer standards.

What debug interface does the S908GZ32G3MFAE support?

The S908GZ32G3MFAE supports Background Debug Mode (BDM) via the JDBG interface, enabling in-circuit programming and real-time debugging without halting CPU execution. It uses a 6-pin BDM connector and is compatible with NXP's D-Bug12 and third-party BDM probes. No JTAG TAP controller is present. S908GZ32G3MFAE's BDM implementation allows flash erase/write and register inspection while maintaining system responsiveness.

Is the S908GZ32G3MFAE RoHS and halogen-free compliant?

Yes, the S908GZ32G3MFAE is RoHS compliant and halogen-free, meeting EU Directive 2011/65/EU and automotive material restrictions. Its plastic LQFP-48 package uses e3 matte tin lead finish (2nd level interconnect), and moisture sensitivity level is rated MSL 3 (168-hour floor life). S908GZ32G3MFAE's compliance documentation includes RoHS Certificate of Conformance and Product Content Report.

What is the minimum order quantity for the S908GZ32G3MFAE?

The minimum package quantity (MPQ) for the S908GZ32G3MFAE is 250 units per tray, and the preferred order quantity (POQ) is 1,250 units per brick. Lead time is 4 weeks from confirmed order. Aetrix Electronics maintains active inventory and supports staggered delivery schedules aligned with customer production ramps. S908GZ32G3MFAE is supplied in dry-packed trays with humidity indicator cards per J-STD-033.

S908GZ32G3MFAE Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
48-LQFP
Series:
HC08
Packaging:
Bulk
Product Status:
Obsolete
Programmable:
-
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
37
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
1.5K x 8
Voltage - Supply (Vcc/Vdd):
2.97V ~ 3.63V, 4.5V ~ 5.5V
Data Converters:
A/D 24x10b SAR
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S908GZ32G3MFAE FAQ

1.How can I place an order for S908GZ32G3MFAE through Aetrix?

Please submit a Request for Quotation (RFQ) for S908GZ32G3MFAE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S908GZ32G3MFAE reliable?

The price and inventory of S908GZ32G3MFAE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S908GZ32G3MFAE is usually 5 days.

3.What payment methods are accepted for S908GZ32G3MFAE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S908GZ32G3MFAE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S908GZ32G3MFAE?

S908GZ32G3MFAE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S908GZ32G3MFAE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S908GZ32G3MFAE?

For technical support, including S908GZ32G3MFAE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S908GZ32G3MFAE requirements.

6.How does Aetrix verify that S908GZ32G3MFAE is sourced from the original manufacturer or authorized distributors?

All S908GZ32G3MFAE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S908GZ32G3MFAE meets industry standards.

7.What is the process for return or replacement of S908GZ32G3MFAE?

All S908GZ32G3MFAE units undergo pre-shipment inspection (PSI). If there is an issue with S908GZ32G3MFAE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S908GZ32G3MFAE part is unused and in its original packaging.

Return procedure for S908GZ32G3MFAE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S908GZ32G3MFAE Tags

  • S908GZ32G3MFAE
  • S908GZ32G3MFAE PDF
  • S908GZ32G3MFAE Datasheet
  • S908GZ32G3MFAE Specifications
  • S908GZ32G3MFAE Images
  • NXP Semiconductors
  • NXP Semiconductors S908GZ32G3MFAE
  • Buy S908GZ32G3MFAE
  • S908GZ32G3MFAE Price
  • S908GZ32G3MFAE Distributor
  • S908GZ32G3MFAE Supplier
  • S908GZ32G3MFAE Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER