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NXP Semiconductors S912XEP100J5VAGR
- Part No.:
- S912XEP100J5VAGR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
S912XEP100J5VAGR.pdf
- Description:
- IC MCU 16BIT 1MB FLASH 144LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,912
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Product details
Overview
S912XEP100J5VAGR from NXP Semiconductors (formerly Freescale) is a 16-bit automotive microcontroller featuring the CPU12X core, 1 MB Flash, 64 KB RAM, and 4 KB emulated EEPROM. It integrates five MSCAN modules, dual 10-bit ATD converters (16-channel), eight PWM channels, and an enhanced XGATE co-processor running at 100 MHz - deployed in body control modules for real-time CAN/LIN gateway and power driver management.
For engineers reviewing the S912XEP100J5VAGR datasheet, S912XEP100J5VAGR pinout, S912XEP100J5VAGR application, or S912XEP100J5VAGR equivalent, key selection criteria include its -40°C to 125°C operating range, MAPBGA-208 package with non-multiplexed external bus support, Memory Protection Unit (MPU), ECC-enabled Flash, and full CAN performance via XGATE offload - critical for ASIL-B–aligned automotive ECU designs.
Technical Context
The S912XEP100J5VAGR implements a 16-bit CPU12X core with 50 MHz bus frequency and supports supervisor/user mode execution with MPU-enforced memory region protection (8 regions, 8-byte granularity). Its XGATE co-processor operates at 100 MHz, handles full CAN mailbox management independently of the CPU, and executes C-programmable I/O tasks including LIN frame generation and SPI/SCI data movement without CPU intervention.
System integrity is reinforced by on-chip features including ECC (1-bit correction / 2-bit detection) across Flash and D-Flash, a windowed COP watchdog, clock monitor, low-voltage detect/reset, and hardware-based illegal address trapping. The device uses a Loop Control Pierce oscillator (4–16 MHz crystal) and an internally filtered IPLL with spread-spectrum capability to reduce EMC emissions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | CPU12X 16-bit core, instruction-set compatible with MC9S12 except five removed fuzzy instructions - enables legacy code reuse with enhanced addressing. |
| Flash Memory | 1 MB Flash with 64+8 ECC bits per word - provides single-bit error correction and double-bit error detection during program/erase and read operations. |
| RAM & EEPROM | 64 KB SRAM; 4 KB emulated EEPROM (EEE) backed by 32 KB D-Flash - supports wear-leveling and atomic write operations via internal controller. |
| Operating Range | -40°C to +125°C ambient temperature, 3.3 V ±5% / +10% to 5.0 V +10% supply - qualified for under-hood automotive environments. |
| Peripheral Count | 5 × MSCAN, 8 × SCI, 3 × SPI, 2 × IIC, 2 × ATD (10-bit, 16-channel), 8 × PWM, 8 × ECT/TIM channels - enables consolidated body/gateway ECU functionality. |
| XGATE Performance | 100 MHz RISC co-processor with programmable C firmware - offloads CAN/LIN protocol stacks, sensor preprocessing, and SPI/SCI buffering from main CPU. |
| Package & Interface | 208-pin MAPBGA (17 mm × 17 mm); non-multiplexed external bus interface - supports glueless connection to external RAM/Flash without address/data multiplexing overhead. |
Pinout & Package
208-pin MAPBGA package (case no 1159A-01 issue B), 17 mm × 17 mm body size, 0.8 mm ball pitch. Pinout validated per MC9S12XEP100 datasheet Rev. 7 (2014) and Freescale Application Note AN3742.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDX | Core & I/O Power Supply | Dual-supply architecture separates internal regulator (VDDX) from I/O rails (VDD) - enables independent EMC filtering and noise isolation. |
| VRH, VRL | Analog Reference Inputs | Independent high/low reference pins for ATD modules - allow ratiometric or absolute voltage measurement with external precision references. |
| RESET | Active-Low Reset Input | Asynchronous reset with internal pull-up; asserts on POR, LVD, COP timeout, or illegal address access - ensures deterministic boot state. |
| MODA, MODB | Mode Selection Inputs | Configure boot source (internal Flash vs. external bus) and debug interface (BDM vs. xDBG) at power-on - determines initial vector fetch behavior. |
| XTAL, EXTAL | Crystal Oscillator Terminals | Support 4–16 MHz Pierce crystal; internal transconductance optimized for reliable startup - eliminates need for external load capacitors in most cases. |
| CS0–CS3 | Chip Select Outputs | Four configurable chip selects for external memory mapping - each supports wait-state timeout or EWAIT deassertion for timing flexibility. |
Key Features
| Feature | Design Value |
|---|---|
| Memory Protection Unit (MPU) | 8 configurable address regions with no-execute/no-write attributes - enforces task isolation and prevents accidental code execution from data memory. |
| Full-CAN via XGATE | XGATE manages all MSCAN mailboxes, filters, and FIFOs - frees CPU for application logic while sustaining >95% bus utilization at 1 Mbps. |
| ECC-Protected Flash & D-Flash | 64+8 ECC bits per 64-bit word - guarantees data integrity over 10-year automotive lifetime with field-programmable reliability. |
| Enhanced ATD Converter | Two independent 10-bit ATD modules, 16-channel mux, 3 µs conversion time - supports simultaneous battery voltage, cabin temp, and motor current sensing. |
| API Timer in Full Stop Mode | Asynchronous periodic interrupt timer active down to Full Stop mode, trimmable ±10%, 0.2 ms–13 s range - enables ultra-low-power wake-up scheduling. |
| Background Debug (BDM) | Single-wire BDM interface with non-intrusive memory access - allows flash programming and real-time variable inspection without halting CPU operation. |
Applications
| Body Control Module (BCM) | Vehicle Gateway |
|---|---|
|
Use Scenario: Centralized control of lighting, door locks, wipers, and HVAC actuators in modern passenger vehicles. IC Role / Device Role / Timing Role: Primary MCU executing body domain software stack; manages CAN/LIN communication, PWM-driven power outputs, and analog sensor inputs. Use Value: Integrated five MSCAN modules and XGATE offload enable concurrent handling of chassis, infotainment, and powertrain CAN buses without CPU saturation. |
Use Scenario: Protocol translation and message routing between high-speed CAN FD (powertrain), low-speed CAN (body), and LIN (actuators/sensors). IC Role / Device Role / Timing Role: Gateway controller performing frame filtering, retransmission, and diagnostic message bridging across heterogeneous networks. Use Value: Dual ATD and 8-channel PWM support local sensor monitoring and fail-safe actuator control (e.g., fan speed regulation during gateway thermal events). |
| Roof Module Controller | Seat Control Unit |
|
Use Scenario: Sunroof, panoramic roof, and ambient lighting control with position feedback and anti-pinch safety logic. IC Role / Device Role / Timing Role: Real-time motion controller using ECT input capture for encoder feedback and PWM output for DC motor drive. Use Value: 8-channel ECT with 16-bit capture buffers and noise-immune delay counters ensure precise motor position tracking under EMI-heavy roof environments. |
Use Scenario: Motorized seat adjustment with memory presets, heating, and occupancy detection via seat pressure sensors. IC Role / Device Role / Timing Role: Safety-aware controller managing H-bridge drivers, thermistor readings, and LIN communication to central body domain. Use Value: MPU-enforced memory partitioning isolates safety-critical seat position algorithms from non-critical UI functions - supporting ASIL-B compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S12XEP100MAG | Same die, 144-pin LQFP package (20×20 mm), no external bus interface - lacks CS0–CS3 and associated address/data lines. | Targeted at space-constrained modules where external memory expansion is unnecessary - e.g., compact LIN nodes or sensor interfaces. | Select MC9S12XEP100MAG only when board layout excludes external memory needs and footprint reduction is prioritized over I/O count. |
| S912XEP768J5VAGR | Same MAPBGA-208 package but with 768 KB Flash, 48 KB RAM, and identical peripheral set - reduced non-volatile memory capacity. | Suitable for cost-sensitive body ECUs with smaller firmware footprints and fewer calibration tables - e.g., entry-level door modules. | Choose S912XEP768J5VAGR when application firmware size remains below 600 KB and long-term calibration storage requirements are modest. |
Compared with S912XEP100J5VAGR, MC9S12XEP100MAG trades external bus capability and 33 I/O pins for smaller footprint, while S912XEP768J5VAGR retains full pinout and peripherals but reduces Flash/RAM - both serve distinct cost, size, and memory tiers within the same automotive qualification envelope.
Availability
S912XEP100J5VAGR is available at Aetrix Electronics and suitable for automotive body control modules, vehicle gateways, roof controllers, and seat control units requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S912XEP100J5VAGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications - formed from the acquisition of Freescale Semiconductor in 2015.
The S912XEP100J5VAGR belongs to the S12XE family, designed specifically for automotive body electronics requiring high functional safety integrity, real-time communication offload, and extended temperature resilience - targeting ASIL-B–compliant ECUs.
FAQ
What is the maximum operating temperature specification for the S912XEP100J5VAGR?
The S912XEP100J5VAGR is rated for operation from -40°C to +125°C ambient temperature - fully qualified for under-hood automotive applications including engine bay-mounted body control modules. This rating is verified per AEC-Q100 Grade 1 stress testing and applies to all functional blocks including Flash, RAM, and peripheral modules. The device maintains full specification compliance across this range without derating.
Does the S912XEP100J5VAGR support CAN FD or only classical CAN?
The S912XEP100J5VAGR supports only Classical CAN (CAN 2.0A/B) up to 1 Mbps - it does not implement CAN FD physical layer or protocol enhancements such as flexible data-rate or extended payload. Its five MSCAN modules are fully compatible with existing S12D/S12X CAN drivers and XGATE-based mailbox handlers, but lack the bit-rate switching and CRC extension required for CAN FD.
How is Flash memory protected against corruption in the S912XEP100J5VAGR?
The S912XEP100J5VAGR implements dual-layer Flash protection: ECC (64+8 bits per word) provides 1-bit fault correction and 2-bit fault detection during reads/writes, while the Memory Protection Unit (MPU) enforces no-execute and no-write attributes on defined 8-byte memory regions. Together, they prevent both transient radiation-induced errors and software-induced overwrite of critical vectors or calibration data.
Can the S912XEP100J5VAGR operate without an external crystal?
Yes - the S912XEP100J5VAGR supports internal self-clock mode using its on-chip RC oscillator after reset, enabling basic operation for diagnostics or bootloader execution. However, full specification (including 50 MHz bus frequency and CAN timing accuracy) requires an external 4–16 MHz crystal connected to XTAL/EXTAL. The internal RC oscillator is not calibrated for CAN bit-timing compliance.
What debug interface does the S912XEP100J5VAGR use, and is JTAG supported?
The S912XEP100J5VAGR uses a single-wire Background Debug Mode (BDM) interface compliant with Motorola/Freescale BDM specification - not IEEE 1149.1 JTAG. It supports non-intrusive flash programming, real-time register inspection, and breakpoint insertion via dedicated BKGD pin. xDBG hardware debugger support is also available for advanced trace analysis using the 64-entry circular buffer.
S912XEP100J5VAGR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 144-LQFP
- Series:
- HCS12X
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- HCS12X
- Core Size:
- 16-Bit
- Speed:
- 50MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 119
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.72V ~ 5.5V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S912XEP100J5VAGR FAQ
1.How can I place an order for S912XEP100J5VAGR through Aetrix?
Please submit a Request for Quotation (RFQ) for S912XEP100J5VAGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S912XEP100J5VAGR reliable?
The price and inventory of S912XEP100J5VAGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S912XEP100J5VAGR is usually 5 days.
3.What payment methods are accepted for S912XEP100J5VAGR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S912XEP100J5VAGR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S912XEP100J5VAGR?
S912XEP100J5VAGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S912XEP100J5VAGR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S912XEP100J5VAGR?
For technical support, including S912XEP100J5VAGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S912XEP100J5VAGR requirements.
6.How does Aetrix verify that S912XEP100J5VAGR is sourced from the original manufacturer or authorized distributors?
All S912XEP100J5VAGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S912XEP100J5VAGR meets industry standards.
7.What is the process for return or replacement of S912XEP100J5VAGR?
All S912XEP100J5VAGR units undergo pre-shipment inspection (PSI). If there is an issue with S912XEP100J5VAGR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S912XEP100J5VAGR part is unused and in its original packaging.
Return procedure for S912XEP100J5VAGR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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